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Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International

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1.Fluctuation smoothing scheduling policies for multiple process flowfabrication plants

机译：多流程的波动平滑调度策略制造工厂
- 作者：Sohl D.L.;Kumar P.R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
2.Fluxless flip-chip attachment techniques using the Au/Sn metallurgy

机译：使用Au / Sn冶金技术的无助焊剂倒装芯片连接技术
- 作者：Kallmayer C.;Lin D.;Kloeser J.;Oppermann H.;Zakel E.;Reichl H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
3.Estimating tools to support multi-path agility in electronicsmanufacturing

机译：估算工具以支持电子产品中的多路径敏捷性制造业
- 作者：Graves R.J.;Agrawal A.;Haberle K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
4.Process integration and optimization of GaAs MESFET and MSM basedopto-electronics integrated circuit (OEIC) using statisticalexperimental design techniques

机译：基于GaAs MESFET和MSM的工艺集成和优化使用统计的光电子集成电路（OEIC）实验设计技术
- 作者：Wang J.S.;Teng C.C.;Middleton J.R.;Feng M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
5.Measurements of thermal conductivity and specific heat of lead freesolder

机译：无铅导热系数和比热的测量焊接
- 作者：Lloyd J.R.;Chao Zhang;Tan H.L.;Shangguan D.;Achari A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
6.Issues in low-cost manufacture of reliable optoelectronic systems

机译：低成本制造可靠的光电系统的问题
- 作者：Leclerc S.A.;Subbarayan G.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
7.Design for manufacturability and design for “X”:concepts, applications, and perspectives

机译：可制造性设计和“ X”设计：概念，应用和观点
- 作者：Kuo T.C.;Hong-Chao Zhang
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
8.Managing for a future electronics manufacturing

机译：为未来而管理电子制造
- 作者：Kelly M.J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
9.Flip chip process development techniques using a modifiedlaboratory aligner bonder

机译：使用改进的倒装芯片工艺开发技术实验室对准器键合机
- 作者：Koopman N.;Adema G.;Nangalia S.;Schneider M.;Saba V.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
10.Towards a standard for differential scanning calorimetrymeasurement of solder paste products

机译：迈向差示扫描量热法标准锡膏产品的测量
- 作者：Kalantary M.R.;Conway P.P.;Sarvar F.;Williams D.J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
11.Designing response surface model based Run by Run controllers: anew approach

机译：设计基于响应面模型的Run by Run控制器：新的方法
- 作者：Baras J.S.;Patel N.S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
12.Electrical performance analysis of a three-dimensional package

机译：三维封装的电气性能分析
- 作者：Seung-Ho Ahn;Kyung-Sun Lee;Se-Young Oh;Miersch E.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
13.A novel structure to realize crack-free plastic package duringreflow soldering process-development of CSS (chip side support) package

机译：一种新型结构，可在生产过程中实现无裂纹的塑料包装回流焊接工艺-CSS（芯片侧支撑）封装的开发
- 作者：Nakazawa T.;Unoue Y.;Sawada K.;Sudo T.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
14.Measurement of solder paste component retention properties

机译：焊膏成分保持性能的测量
- 作者：Thomas S.;Srihari K.;McLenaghan A.J.;Westby G.R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
15.Reliability of soldered silicon devices on copper alloys

机译：铜合金上焊接硅器件的可靠性
- 作者：Achari A.;Green W.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
16.Batchless factory concept for very short cycle time semiconductormanufacturing

机译：无批次工厂概念，适用于极短周期的半导体制造业
- 作者：Stanley T.D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
17.New methodology of dynamic lot dispatching: required turn rate

机译：动态批次分配的新方法：所需的周转率
- 作者：Wen-Cheng Chin;Jiann-Kwang Wang;Kuo-Cheng Lin;Seng-Rong Huang
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
18.COB and COC for low cost and high density package

机译：COB和COC用于低成本和高密度封装
- 作者：Rochat G.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
19.Laser ablation forward deposition of metal lines for electricalinterconnect repair

机译：激光烧蚀正向沉积金属线以用于电气互连维修
- 作者：Tatah K.;Fukumoto A.;Thompson C.V.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
20.Design of future single wafer logic fabs

机译：未来单晶片逻辑晶圆厂的设计
- 作者：Castrucci P.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
21.Utilizing production data to increase factory capacity

机译：利用生产数据提高工厂产能
- 作者：Konopka J.;Trybula W.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
22.Electrical performance trade-offs in ball grid array packagedesigns

机译：球栅阵列封装中的电气性能折衷设计
- 作者：Wang K.N.;Adam J.M.;Dziekowicz P.A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
23.Single-wafer processing: opportunities and challenges

机译：单晶圆加工：机遇与挑战
- 作者：Doering R.R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
24.Applying DFM in the semiconductor industry

机译：DFM在半导体行业中的应用
- 作者：Preston White K. Jr.;Athay R.N.;Trybula W.J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
25.Production improvements using a forward scheduler

机译：使用前向调度程序改进生产
- 作者：Juba R.C.;Keller P.N.;Verity A.F.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
26.Correlation between yield and waiting time: a quantitative study

机译：产量与等待时间的相关性：定量研究
- 作者：Srinivasan K.;Sandell R.;Brown S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
27.Run by run (generalized SPC) control of semiconductor processes onthe production floor

机译：逐个运行（通用SPC）控制半导体工艺生产车间
- 作者：Boyd J.D.;Banan M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
28.A robust metric for measuring within-wafer uniformity

机译：用于测量晶片内均匀性的可靠指标
- 作者：Davis J.C.;Gyurcsik R.S.;Jye-Chi Lu;Hughes-Oliver J.;Nychka D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
29.Underfill flow as viscous flow between parallel plates driven bycapillary action

机译：底部填充流是由驱动的平行板之间的粘性流毛细作用
- 作者：Schwiebert M.K.;Leong W.H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
30.The resin molded chip size package (MCSP)

机译：树脂模压芯片尺寸封装（MCSP）
- 作者：Tanigawa S.;Igarashi K.;Nagasawa M.;Yoshio N.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
31.Area bonding conductive epoxy adhesives for low cost grid arraychip carriers

机译：用于低成本栅格阵列的区域粘结导电环氧胶芯片载体
- 作者：Bolger J.C.;Czarnowski J.M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
32.Properties of thin layers of Sn62Pb36Ag2

机译：Sn62Pb36Ag2薄层的性质
- 作者：Grossmann G.;Weher L.;Heiduschke K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
33.Dual chip memory package

机译：双芯片内存封装
- 作者：Young-Do Kweon;Seung-Ho Ahn;Hae-Jeong Sohn;Young-Hee Song;Se-Yong Oh
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
34.Lead free interconnect materials for the electronics industry

机译：电子行业的无铅互连材料
- 作者：Napp D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
35.Reliability of novel die attach adhesive for snap curing

机译：用于快速固化的新型芯片连接胶的可靠性
- 作者：Galloway D.P.;Grosse M.;Nguyen M.N.;Burkhart A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
36.Contamination control using production test data

机译：使用生产测试数据进行污染控制
- 作者：Young-Jun Kwon;Walker D.M.H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
37.Run by run control of chemical-mechanical polishing

机译：通过化学机械抛光的运行控制
- 作者：Boning D.;Moyne W.;Smith T.;Moyne J.;Trelfeyan R.;Hurwitz A.;Sellman S.;Taylor J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
38.High-density build-up wiring boards using conventional printedwiring boards process

机译：使用常规印刷的高密度组合接线板接线板工艺
- 作者：Itaya S.;Miyazawa H.;Morimoto E.;Takahashi Y.;Uno Y.;Nakakuki K.;Igucki Y.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
39.Laser micromachining of through via interconnects in active die for3D multichip module

机译：有源芯片中通孔互连的激光微加工3D多芯片模块
- 作者：Dahwey Chu;Miller W.D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
40.Solderability testing of alternate component termination materialswith lead free solder alloys

机译：备用组件端接材料的可焊性测试与无铅焊料合金
- 作者：Conway P.P.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
41.Flux activity evaluation using the wetting balance

机译：使用润湿天平评估助焊剂活性
- 作者：Huang C.-Y.;Srihari K.;McLenaghan A.J.;Westby G.R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
42.Effective modeling of factory throughput times

机译：有效模拟工厂吞吐时间
- 作者：Srivarsan N.;Kempf K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
43.Model-based product quantity control

机译：基于模型的产品数量控制
- 作者：Ramakrishnan V.;Walker D.M.H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
44.The impact of single-wafer processing on fab cycle time

机译：单晶圆处理对晶圆厂周期时间的影响
- 作者：Wood S.C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
45.Technology/strategy management issues for semiconductor technology

机译：半导体技术的技术/战略管理问题
- 作者：Keys L.K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
46.Total contamination control: the minienvironment era

机译：全面污染控制：迷你环境时代
- 作者：Abuzeid S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
47.Real-time diagnosis of semiconductor manufacturing equipment usingneural networks

机译：实时诊断使用的半导体制造设备神经网络
- 作者：Byungwhan Kim;May G.S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
48.Metrology control for an advanced 200 mm sub-micron wafer fab

机译：先进的200毫米亚微米晶圆厂的计量控制
- 作者：Haider S.E.;Faa-Ching Wang;Hegemann V.;Capps J.;Price R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
49.Reusable modeling capabilities for simulating high volumeelectronics manufacturing systems

机译：可重用的建模功能可模拟大量电子制造系统
- 作者：Farrington P.A.;Swain J.J.;Ayokanmbi M.;Evans J.L.;Rogers J.S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
50.Nitrogen reflow ovens: the effect exit temperature has onbenzotriazole coated copper boards

机译：氮气回流炉：影响出口温度的因素苯并三唑涂层铜板
- 作者：Gutierrez S.;Saxton D.;Schluter R.;Thune P.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
51.LSM vision gage RR study

机译：LSM视觉量具R＆R研究
- 作者：Messina W.S.;Willey L.G.;Jones K.W. Jr.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
52.Product integrity assessment using fatigue synthesis for avionicsprograms

机译：使用疲劳综合航空电子产品进行产品完整性评估程式
- 作者：Rassaian M.;Pietila D.A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
53.Temperature accelerated life test (ALT) at the circuit board level

机译：电路板级的温度加速寿命测试（ALT）
- 作者：Yang C.R.;Kim J.T.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
54.A framework for supply chain management in semiconductormanufacturing industry

机译：半导体供应链管理框架制造业
- 作者：Ovacik I.M.;Weng W.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
55.Reducing cycle time through programmable multichip modules

机译：通过可编程多芯片模块缩短周期时间
- 作者：Banker J.;Miller R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
56.Laser-diode based soldering system with vision capabilities

机译：具有视觉功能的基于激光二极管的焊接系统
- 作者：Laferriere P.;Fukumoto A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
57.Automated inspection of solder joints-a neural network approach

机译：自动检查焊点-神经网络方法
- 作者：Sankaran V.;Chartrand B.;Lillard D.L.H.;Embrechts M.J.;Kraft R.P.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
58.A simple and reproducible method towards fabricating defect-freeand reliable solder joints

机译：一种简单且可重现的无缺陷制造方法可靠的焊点
- 作者：Xie D.J.;Chan Y.C.;Lai J.K.L.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
59.The experience of lead users in the adoption of minienvironmenttechnology

机译：领先用户在采用迷你环境方面的经验技术
- 作者：Rappa M.A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
60.Modeling the cost of ownership of assembly and inspection

机译：模拟组装和检查的拥有成本
- 作者：Dance D.L.;DiFloria T.;Jimenez D.W.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
61.Optimization of solder paste printability with laser inspectiontechnique

机译：通过激光检查优化焊膏的可印刷性技术
- 作者：Okura T.;Kanai M.;Ogata S.;Takei T.;Takakusagi H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
62.Inspection of short fault in power-plane with irregular andperforated shapes MCMs

机译：检查电源板上的短路故障是否有异常穿孔的形状MCM
- 作者：Fang-Lin Chao;Ruey-Beei Wu
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
63.Manufacturing ownership through process re-engineering

机译：通过流程再造获得制造所有权
- 作者：Stobaugh J.;Rosentrater A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
64.Plasma process control with optical emission spectroscopy

机译：用光发射光谱法进行等离子体过程控制
- 作者：Ward P.P.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
65.Development of design for manufacture

机译：开发设计制造
- 作者：Trybula W.J.;Konopka J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
66.Mounting technology of BGA-P and BGA-T

机译：BGA-P和BGA-T的安装技术
- 作者：Hattas D.;Wakigawa A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
67.Decomposition algorithms for scheduling semiconductor testingfacilities

机译：用于调度半导体测试的分解算法设备
- 作者：Demirkol E.;Uzsoy R.;Ovacik I.M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
68.Thermomechanical stress-strain hysteresis of Sn-Bi eutectic solderalloy

机译：Sn-Bi共晶焊料的热机械应力-应变滞后合金
- 作者：Raeder C.H.;Felton L.E.;Messier R.W. Jr.;Coffin L.F. Jr.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
69.Impact of minienvironments on facilities cost

机译：小型环境对设施成本的影响
- 作者：Barnett W.;Schneider R.K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
70.Development of ultra-fine pitch ball bonding technology

机译：超细间距球焊技术的发展
- 作者：Tatsumi K.;Uno T.;Kitamura O.;Ohno Y.;Katsumata T.;Furusawa M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
71.Fine pitch thermosonic wire bonding

机译：细间距热超声引线键合
- 作者：Cavasin D.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
72.Soldering on gold plated substrates-solder joint reliability andintegrity of surface components

机译：镀金基板上的焊接-焊点可靠性和表面组件的完整性
- 作者：Ganasan J.R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
73.Alternative facility layouts for semiconductor wafer fabricationfacilities

机译：半导体晶圆制造的替代设施布局设备
- 作者：Hase R.;Uzsoy R.;Takoudis C.G.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
74.Iterative capacity allocation and production flow estimation forscheduling semiconductor fabrication

机译：迭代产能分配和生产流程估算安排半导体制造
- 作者：Shi-Chung Chang;Loo-Hay Lee;Lee-Sing Pang;Chen T.W.-Y.;Yi-Chen Weng;Huei-Der Chiang;Dai D.W.-H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
75.Development of integrated process control system utilizing neuralnetwork for plasma etching

机译：利用神经网络开发集成过程控制系统等离子体蚀刻网络
- 作者：Taek-Beom Koh;Sang-Yeob Cha;Kwang Bang Woo;Dae-Sik Moon;Kyu Hwan Kwak;Ho Seung Chang
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
76.Electrical and mechanical studies of MCM-D interconnect structure

机译：MCM-D互连结构的电气和机械研究
- 作者：Fang-Lin Chao;Ruey-Beei Wu;Pecht M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
77.Ericsson's VLSI mini-fab strategy; low volume VLSI fab to ensureshort time to market for Ericsson telecom systems and products

机译：爱立信的VLSI微型晶圆厂战略;小批量VLSI晶圆厂可确保爱立信电信系统和产品的上市时间短
- 作者：Engde K.-I.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
78.Void formation in flip-chip solder bumps. I

机译：倒装芯片焊料凸点中的空隙形成。一世
- 作者：Goenka L.;Achari A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
79.AUTHOR INDEX

机译：作者索引
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
80.Solder bumping through Super Solder

机译：焊锡通过超级焊锡碰撞
- 作者：Kaga Y.;Amano T.;Kohno M.;Obara Y.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
81.Development of 0.5 mm thick small outline packages

机译：研发出0.5毫米厚的小尺寸封装
- 作者：Young-Jae Song;Seung-Ho Ahn;Se-Yong Oh
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
82.Distributed control of hot bar thermode in fine pitch surface mountassembly

机译：细间距表面贴装中的热棒温度计的分布式控制部件
- 作者：Skormin V.A.;Park K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
83.Advanced interconnect and low cost μ stud BGA

机译：先进的互连和低成本μ螺柱BGA
- 作者：Mita M.;Murakami G.;Kumakura T.;Okabe N.;Shinzawa S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
84.How TOC TPM work together to build the quality toolbox ofSDWTs

机译：TOC和TPM如何共同构建质量工具箱SDWT
- 作者：Rose E.;Odom R.;Dunbar R.;Hinchman J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》
85.An overview of manufacturing BGA technology

机译：制造BGA技术概述
- 作者：Mearig J.;Goers B.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International》