Summary form only given, as follows. Many new types of ball gridarray packages have been introduced or proposed in the last year asalternatives to PQFPs and PGAs. These include single and multilayerconfigurations for both plastic and metal BGAs based on a variety ofmaterial and process technologies. A commonly claimed advantage of allthese BGAs is improved electrical performance. With continued increasesin clock speed and reductions in noise margins due to voltage scaling,electrical performance will become a driving force for introduction ofBGAs in many products. A detailed study of the electrical performance ofa selected set of single and multilayer BGA packages was completed. Thedifferent package models were generated using a field solver andanalyzed for their signal integrity characteristics using SPICE. Thisincludes an analysis of how closely the output signals and the inputsignals match under varying load conditions. The design and performanceof the selected BGA packages were then assessed based on initialsimulation results, and a set of design guidelines to optimizeelectrical performance were developed. These design guidelines can thenbe applied based on product needs. This paper will address theelectrical performance and relative complexity and cost factors facingthe engineer and suggest optimal choices for the varying load conditionsand chip types
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