COB and COC for low cost and high density package

摘要

Today, portable electronic devices have many more functions thanthe same type of nonportable products had a few years ago. As thesimilitude rules are no longer valid when designers are faced withminiaturization, it is necessary to find and develop new approaches forthe packaging and the interconnections of the integrated circuits. Byusing a well mastered Chip-On-Board (COB) technology in association witha very accurate die attach process, it is possible to offer aninexpensive Chip-On-Chip (COC) solution to the engineers who need a 3Dassembly for a higher level of miniaturization