Novel adhesive, using in-line process, has been shown to reduceadhesive cure cycle time from 70 minutes to as little as 44 seconds at160° C. Throughput improvement of 60% using existing box ovens and noincrease in floor space has been confirmed on production equipment. Theadhesive is based upon a modified cyanate ester resin, which cures toform a triazine polymer with excellent temperature stability and uniquemoisture properties. It generates 75% less outgassing during cure thantypical snap sure epoxies, which reduces contamination of the chip,leadframe and oven chamber. Live device reliability, equivalent tostandard box oven, has been demonstrated for the new snap cure adhesiveusing in-line cure, as well as, fast box oven process. Material,processing and qualification data is summarized and compared to epoxiesfor analog and logic ICs packaged in SOIC, PDIP, and PLCC body styles.The material has been fully qualified and is in production use
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