The cost reduction requirement and the package miniaturization have brought to use signal packages like SOP for power application. Discrete transistors with vertical structure are attached to metal lead frame by means of curable adhesive glue. Therefore the thin layer of silver filled is crossed by high density current; the glue electrical resistance has to be lower as possible and stable during the device life. Failures are detected o the field and 2 different failures mode are described and discussed.
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