The resin molded chip size package (MCSP)

摘要

The resin molded chip size package (MCSP), consisting of apolyimide/Cu film carrier with metal bumps, has been developed. The CSPhaving area-array type electrodes connected with the printed circuitboard has been developed by many semiconductor companies. We havedeveloped a resin molded CSP. The encapsulant used for this applicationhas also been developed; it is unlike the conventional liquid type ortransfer mold type. The molding method is also new and has beenindigenously developed. Two new molding methods were designed: 1) theresin-mold and the connection between the semiconductor-chip and thecarrier tape with the metal bumps were simultaneously carried out usingthe newly developed thermo-adhesive polyimide coated on the carrier tapebefore the connection; 2) this approach involved laminating the sheet onthe semiconductor-chip with the new polyimide adhesive. Theencapsulation and the reliability of MCSP were investigated and found tobe excellent (resistance to corrosion, heat and stress), equal orsuperior to that of the conventional surface-mounted devices