Electrical and mechanical studies of MCM-D interconnect structure

摘要

The electrical and mechanical properties of a multilayer thin-filmMCM-D interconnect are studied in this investigation. Numerical analysesare executed to calculate the electrical parameters of thin-filmmicrostrip line and it shows that the additional delay decreases whileincreasing the thickness of the conductor. Environmental scanningelectron microscopy (E-SEM) was utilized to characterize mechanicalinduced defects in signal line. Cracking on metal lines and delaminationof polyimide/metal interfaces due to mismatch of coefficient of thermalexpansion and the moisture absorption of the polyimide film wereobserved