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Components, Packaging and Manufacturing Technology, IEEE Transactions on

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中文名称：组件，包装和制造技术，IEEE交易

ISSN：2156-3950
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发文量：1777

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1.Finite Element Model of a Bilayered Gold-Coated Carbon Nanotube Composite Surface

机译：双层镀金碳纳米管复合表面的有限元模型
- 作者：Liu Hong;McBride John W.;Down Michael Peter;Pu Suan Hui
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
- Bilayered;
- carbon nanotubes (CNTs);
- contact mechanics;
- finite element (FE) modeling;
- finite element (FE) modeling.;
2.Implementation of a Compact EMI Filter Array for 4G-LTE Applications on LTCC

机译：在LTCC上为4G-LTE应用实现紧凑型EMI滤波器阵列
- 作者：Chen Li-Ju;Lin Ken-Huang
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
- 4G-Long Term Evolution dielectric devices;
- electromagnetic interference (EMI);
- ferrite;
- filters;
- filters.;
3.Novel Technique for Precision Soldering Based on Laser-Activated Gold Nanoparticles

机译：基于激光活化金纳米粒子的精密焊接新技术
- 作者：Bakhoum Ezzat G.;Van Landingham Kevin M.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
- Gold nanoparticles;
- graphene sheet;
- heating profile;
- low power laser;
- precision soldering;
- precision soldering.;
4.Role of Transparent Die Attach Adhesives for Enhancing Lumen Output of Midpower LED Emitters With Standard MESA Structure

机译：透明管芯粘附剂在增强具有标准MESA结构的中功率LED发射器的流明输出中的作用
- 作者：Shih Yu-Chou;Kim Gunwoo;Huang Linjuan;You Jiun-Pyng;Shi Frank G.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
- Die attach adhesive (DAA);
- light emitting diodes (LEDs);
- midpower LED;
- silicone;
- silicone.;
5.Water-Based Microchannel and Galinstan-Based Minichannel Cooling Beyond 1 kW/cm src='/images/tex/25897.gif' alt='^{2}'> Heat Flux

机译：超过1 kW / cm的基于水的微通道和基于Galinstan的微通道的冷却 src =“ / images / tex / 25897.gif” alt =“ ^ {2}”> 热量助焊剂
- 作者：Zhang Rui;Hodes Marc;Lower Nathan;Wilcoxon Ross
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
- Galinstan;
- microchannels;
- minichannels;
- single-phase cooling;
- water;
- water.;
6.A Simple Technique for Power Distribution With Better Characteristics Than Electromagnetic Bandgap Structures

机译：一种比电磁带隙结构具有更好特性的简单配电技术
- 作者：Telikepalli Satyanarayana;Swaminathan Madhavan;Keezer David
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
7.Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling

机译：新型配电方案在高速信号复杂印刷电路板上的应用
- 作者：Zhang David C.;Swaminathan Madhavan;Keezer David
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
8.Fabrication of Microstructures in LTCC Technology Using Selective Laser Ablation

机译：使用选择性激光烧蚀在LTCC技术中制造微结构
- 作者：Shafique Muhammad Farhan;Steenson David Paul;Robertson Ian D.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
9.Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics

机译：高功率密度氮化镓电子产品的基本冷却极限
- 作者：Won Yoonjin;Cho Jungwan;Agonafer Damena;Asheghi Mehdi;Goodson Kenneth E.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
10.Investigation of the Surface Adhesion Phenomena and Mechanism of Gold-Plated Contacts at Superlow Making/Breaking Speed

机译：超低制/断速度下镀金触点的表面粘附现象及机理研究
- 作者：Ren Wanbin;Chang Cheng;Chen Yu;Xue Shengjun;Coutu Ronald /A/.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
- Adhesion force;
- contact resistance;
- electrical contact;
- gold-plated material;
- joule heating;
- joule heating.;
11.Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes

机译：老式SAC细间距球栅阵列封装与表面处理的可靠性比较
- 作者：Hai Zhou;Zhang Jiawei;Shen Chaobo;Evans John L.;Bozack Michael J.;Basit Munshi M.;Suhling Jeffrey C.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
12.Simulation and Experimental Study of Thermal Effects on Composite Contacts in Electrical Life Cycle Tests of DC Relays

机译：直流继电器电气寿命测试中复合触点热效应的仿真和实验研究
- 作者：Yang Wenying;Li Dongyuan;Liu Peng;Chen Zhuanke;Zhai Guofu
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
- Composite contact;
- finite-element (FE);
- finite-element (FE) method (FEM);
- method (FEM);
- temperature field;
- thermal stress;
- thermal stress.;
13.Wideband and Compact EBG Structure With Balanced Slots

机译：具有均衡插槽的宽带紧凑型EBG结构
- 作者：Kim Myunghoi;Kam Dong Gun
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第6期
14.High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics

机译：电力电子用镀锡锌焊料的高温模具连接
- 作者：Park Sungwon;Nagao Shijo;Kato Yoshitaka;Ishino Hiroshi;Sugiura Kazuhiko;Tsuruta Kazuhiro;Suganuma Katsuaki
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Joining processes;
- packaging;
- power semiconductor devices;
- soldering;
- soldering.;
15.Optimization of Cu–Ag Core–Shell Solderless Interconnect Paste Technology

机译：Cu-Ag核-壳无焊锡膏互连技术的优化
- 作者：Kammer Milea J.;Muza Anthony;Snyder John;Rae Alan;Kim Suk Jun;Handwerker Carol /A/.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Assembly;
- electronics packaging;
- soldering;
- surface mount technology;
- surface mount technology.;
16.Modeling, Fabrication, and Reliability of Through Vias in Polycrystalline Silicon Panels

机译：多晶硅面板中通孔的建模，制作和可靠性
- 作者：Chen Qiao;Lu Hao;Sundaram Venky;Tummala Rao R.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Fracture strength;
- polycrystalline silicon panel;
- reliability characterization;
- silicon interposer;
- silicon interposer.;
17.A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application

机译：MEMS封装中用于薄膜封装的坚固双层盖
- 作者：Sharma Jaibir;Lee Jae-Wung;Merugu Srinivas;Singh Navab
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
18.Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

机译：模塑料的吸湿和粘弹性行为引起的MEMS传感器装置应力的研究
- 作者：Kim Yeonsung;Liu Dapeng;Lee Hohyung;Liu Ruiyang;Sengupta Dipak;Park Seungbae
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
19.Ultralow Power Circuit Design With Subthreshold/Near-Threshold 3-D IC Technologies

机译：具有亚阈值/近阈值3D IC技术的超低功耗电路设计
- 作者：Samal Sandeep Kumar;Peng Yarui;Pathak Mohit;Lim Sung Kyu
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- 3-D IC;
- subthresholdear-threshold operation;
- through-silicon via (TSV);
- ultralow power;
- ultralow power.;
20.Multistrata Subsurface Laser-Modified Microstructure With Backgrind-Assisted Controlled Fracture for Defect-Free Ultrathin Die Fabrication

机译：具有反向研磨辅助控制断裂的多层多层激光修饰显微组织，用于无缺陷的超薄模具制造
- 作者：Teh Weng Hong;Boning Duane S.;Welsch Roy E.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Defects;
- laser;
- semiconductor device manufacture;
- semiconductor device packaging;
- semiconductor memory;
- wafer dicing;
- wafer dicing.;
21.Stencil Printing of Underfill for Flip Chips on Organic-Panel and Si-Wafer Substrates

机译：在有机面板和硅晶圆基板上倒装芯片底部填充的模版印刷
- 作者：Lau John H.;Zhang Qinglong;Li Ming;Yeung Kai Ming;Cheung Yiu Ming;Fan Nelson;Wong Yam Mo;Zahn Michael;Koh Max
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Flip chip;
- organic panel substrate;
- silicon wafer substrate;
- stencil printing;
- underfill;
- underfill.;
22.Study of a Ferrite LTCC Multifunctional Circulator With Integrated Winding

机译：集成绕组铁氧体LTCC多功能循环器的研究
- 作者：Yang Shicheng;Vincent Didier;Bray Joey R.;Roy Langis
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
23.Electroplated Copper for Heterogeneous Die Integration

机译：电镀铜用于异种芯片集成
- 作者：Kierzewski Iain M.;Boteler Lauren;Bedair Sarah S.;Meyer Christopher D.;Hanrahan Brendan M.;Lazarus Nathan
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Copper;
- multichip module;
- through-silicon vias (TSVs);
- wafer scale integration;
- wafer scale integration.;
24.Development of Mold Compounds With Ultralow Coefficient of Thermal Expansion and High Glass Transition Temperature for Fan-Out Wafer-Level Packaging

机译：用于扇出晶圆级包装的具有超低热膨胀系数和高玻璃化转变温度的模塑料的开发
- 作者：Carias Vinicio;Thompson Jeffrey;Myers Philip D.;Kumar Prashant;Racz Livia M.;Toomey Ryan;Wang Jing
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Ceramics;
- encapsulation;
- epoxy resins;
- epoxy resins.;
25.Investigation on the Influence of Nanofluids in Wavy Microchannel Heat Sink

机译：纳米流体对波浪形微通道散热器影响的研究
- 作者：Sakanova Assel;Zhao Jiyun;Tseng King-Jet
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- Computational fluid dynamics;
- microchannel heat sink (MCHS);
- nanofluids;
- power electronic cooling;
- wavy channel;
26.Thermal Management Technique Using Control of Thermal Radiation Spectrum for Encapsulated Electronic Devices

机译：利用热辐射谱控制的热管理技术，用于封装电子设备
- 作者：Tsuda Shinichiro;Shimizu Makoto;Iguchi Fumitada;Yugami Hiroo
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
27.Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects

机译：使用基于SVD的傅立叶连续性实现高速数字互连的频谱精确因果关系
- 作者：Barannyk Lyudmyla L.;Aboutaleb Hazem /A/.;Elshabini Aicha;Barlow Fred D.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
28.Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging

机译：发光二极管封装硅射流分配中破裂行为的实验和建模研究
- 作者：Chen Yun;Wang Fuliang;Li Han-Xiong
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
- High-speed camera;
- initial disturbance;
- jet dispensing;
- theory model;
- thread breakup;
- thread breakup.;
29.High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling

机译：使用磁场共振耦合的高效PCB级和封装级无线功率传输互连方案
- 作者：Kim Sukjin;Jung Daniel H.;Kim Jonghoon J.;Bae Bumhee;Kong Sunkyu;Ahn Seungyoung;Kim Jonghoon;Kim Joungho
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
30.Efficient Wi-Fi Power Amplifier LTCC Module Using a Buck Converter With a Power Inductor Implemented in Ferrite-Filled PCB Technology

机译：采用降压转换器的高效Wi-Fi功率放大器LTCC模块，其功率电感器采用铁氧体填充PCB技术实现
- 作者：Yoon Sang-Woong;Dang Trung-Sinh;Lai Ngoc-Duy-Hien;Park Jae Y.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第7期
31.An Enhanced Statistical Analysis Method for I/O Links Considering Supply Voltage Fluctuations and Intersymbol Interference

机译：考虑电源电压波动和符号间干扰的I / O链接的增强统计分析方法
- 作者：Kim Jingook;Lee Jongjoo;Park Eunkyeong;Park Youngwoo
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
32.Static Template for Fast Power/Ground Pin Assignment of Large-Scale BGA Packages Using Genetic Algorithm

机译：使用遗传算法的大型BGA封装快速电源/接地引脚分配静态模板
- 作者：Li Zhuo-Yue;Zhang Mu-Shui;Long Yunliang
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Ball grid array (BGA) package;
- genetic algorithm (GA);
- pin assignment;
- signal integrity;
- system in package;
- system in package.;
33.On-Demand Infrared Laser Sintering of Gold Nanoparticle Paste for Electrical Contacts

机译：用于电触点的金纳米粒子膏的按需红外激光烧结
- 作者：Yamaguchi Mitsugu;Araga Shinji;Mita Mamoru;Yamasaki Kazuhiko;Maekawa Katsuhiro
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Adhesivity;
- dry process;
- electrical contacts;
- gold;
- ink-jet printing;
- laser sintering;
- metal nanoparticles;
- metallization;
- plating;
- plating.;
34.Sn–3.0Ag–0.5Cu Nanocomposite Solder Reinforced With Bi₂Te₃ Nanoparticles

机译：Bi _{2 Te _{3 纳米颗粒增强的Sn–3.0Ag–0.5Cu纳米复合焊料}}
- 作者：Chen Si;Luo Xin;Jiang Di;Ye Lilei;Edwards Michael;Liu Johan
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Bi₂Te₃ nanoparticles;
- Bi2Te3 nanoparticles;
- Nanocomposite solders;
- Sn-3.0Ag-0.5Cu.;
- Sn???30Ag???05Cu;
35.Deformation and Oxidation of Copper Metallization on Ceramic Substrate During Thermal Cycling From −40 °C to 250 °C

机译：在−40°C至250°C的热循环过程中，陶瓷基板上铜金属化层的变形和氧化
- 作者：Lang Fengqun;Yamaguchi Hiroshi;Nakagawa Hiroshi;Sato Hiroshi
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Copper;
- power electronics;
- reliability;
- silicon carbide (SiC) power module;
- substrate;
- surface roughness;
- thermal cycling test (TCT);
- thermal stresses;
- thermal stresses.;
36.LTCC Multilayered Helical Filters With a Mixed Electric and Magnetic Coupling Structure

机译：具有电磁耦合结构的LTCC多层螺旋滤波器
- 作者：Wu Yafen;Chin Kuo-Sheng;Che Wenquan;Chang Kuang-Ching;Feng Wenjie
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
37.Metal Proportion Optimization of Annular Through-Silicon via Considering Temperature and Keep-Out Zone

机译：考虑温度和避开区的环形硅的金属配比优化
- 作者：Yin Xiangkun;Zhu Zhangming;Yang Yintang;Ding Ruixue
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- 3-D integration;
- annular through-silicon via (TSV);
- keep-out zone (KOZ);
- temperature;
- temperature.;
38.Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

机译：铜封装通孔对玻璃中介层热性能的影响
- 作者：Cho Sangbeom;Sundaram Venky;Tummala Rao R.;Joshi Yogendra K.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- 2.5-D interposer;
- 25-D interposer;
- thermal performance;
- through-package via (TPV);
- through-package via (TPV).;
39.A Neural Network Model for Predicting the Dielectric Permittivity of Epoxy- Aluminum Nanocomposite and Its Experimental Validation

机译：预测环氧铝纳米复合材料介电常数的神经网络模型及其实验验证
- 作者：Paul Siny;Sindhu T.K.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Capacitors;
- dielectric permittivity;
- dielectric polarization;
- epoxy resins;
- nanocomposites;
- nanocomposites.;
40.Ringing Noise Suppression for Differential Signaling in Unshielded Flexible Flat Cable

机译：非屏蔽柔性扁平电缆中差分信号的振铃噪声抑制
- 作者：Huang Shih-Ya;Huang Ting-Yi;Liu Chia-Tsung;Wu Ruey-Beei
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Crosstalk;
- differential signaling;
- flexible flat cable (FFC);
- resonance;
- ringing noise;
- signal integrity;
- signal integrity.;
41.Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction

机译：非接触感应化学镀镍在金上制备具有小特征尺寸的镍微凸块
- 作者：Du Yuxin;Song Zhen;Zhu Huizhong;Wang Zheyao
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Activation;
- contactless;
- electroless nickel plating;
- induction;
- induction.;
42.Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing

机译：硅通孔底部填充胶中密封剂流动的参数关联和计算建模
- 作者：Le Fuliang;Lee Shi-Wei Ricky;Yang Chaoran;Lo Jeffery C. C.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Dispensing;
- through-silicon-via;
- underfill;
- underfill.;
43.Integration of a 140 GHz Packaged LTCC Grid Array Antenna With an InP Detector

机译：140 GHz封装的LTCC网格阵列天线与InP检测器的集成
- 作者：Zhang Bing;Gulan Heiko;Zwick Thomas;Li Yinggang;Oderfalt Ulf;Carlsson Fredrik;Zirath Herbert
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
44.Formation of Through Silicon Vias for Silicon Interposer in Wafer Level by Metal-Assisted Chemical Etching

机译：金属辅助化学刻蚀形成晶圆级硅中介层的硅通孔
- 作者：Li Liyi;Zhang Guoping;Wong Ching-Ping
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
45.Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method

机译：通过CMOS传感器和有限元方法研究3-D IC中TSV中间层（硅通孔）引起的热机械应力
- 作者：Ewuame Komi Atchou;Fiori Vincent;Inal Karim;Bouchard Pierre-Olivier;Gallois-Garreignot Sebastien;Lionti Sylvain;Tavernier Clement;Jaouen Herve
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
46.Silicon Nanowire Arrays Based On-Chip Thermoelectric Generators

机译：基于芯片的硅纳米线阵列热电发生器
- 作者：Lee Kam Yu;Brown David;Kumar Satish
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Contact resistance;
- energy harvesting;
- silicon nanowire (Si-NW);
- thermoelectric generator (TEG);
- waste heat;
- waste heat.;
47.Parametric Study on Flow Boiling Characteristics in src='/images/tex/25881.gif' alt='Omega '> -Shaped Re-Entrant Porous Microchannels With Structured Surface

机译：中的流沸腾特性的参数研究 src =“ / images / tex / 25881.gif” alt =“ Omega”> 形结构表面的折返多孔微通道
- 作者：Deng Daxiang;Tang Yong;Qin Yu;Wang Xiaoyu;Zhang Jingrui;Cai Huikun
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第8期
- Flow boiling;
- microchannel heat sinks;
- porous microchannels;
- re-entrant;
- re-entrant.;
48.Pressureless Sintering of Microscale Silver Paste for 300 °C Applications

机译：适用于300°C应用的微尺度银浆的无压烧结
- 作者：Yu Fang;Johnson R. Wayne;Hamilton Michael C.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Die attach;
- high temperature;
- reliability;
- sintered Ag;
- sintered Ag.;
49.Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions

机译：实际使用条件下焊点疲劳寿命的统计变化
- 作者：Hamasha Sad;Wentlent Luke;Borgesen Peter
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Fatigue;
- first failure;
- reliability;
- solder;
- solder.;
50.Spiral Inductors With Floating Low-Loss RF Shields for src='/images/tex/28742.gif' alt='LC'> Resonator Applications

机译：用于的具有浮动低损耗RF屏蔽的螺旋电感器 src =“ / images / tex / 28742.gif” alt =“ LC”> 谐振器应用
- 作者：Haner Ronald L.;Krishnan Shoba
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Floating shield;
- LC resonator;
- Q measurement;
- RLC circuits;
- projected shield;
- shielding;
- shielding.;
51.Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

机译：等温循环中焊点疲劳寿命与累积功的相关性
- 作者：Hamasha Sad;Qasaimeh Awni;Jaradat Younis;Borgesen Peter
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Fatigue;
- reliability;
- solder;
- work accumulation;
- work accumulation.;
52.Crack-Insensitive Wearable Electronics Enabled Through High-Strength Kevlar Fabrics

机译：高强度凯夫拉纤维织物实现了对裂纹不敏感的可穿戴电子设备
- 作者：Gao Yang;Sim Kyoseung;Sun Sicong;Chen Zhou;Song Jizhou;Yu Cunjiang
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Crack;
- deformation;
- fabric;
- flexible electronics;
- flexible electronics.;
53.Conformability of a Thin Elastic Membrane Laminated on a Rigid Substrate With Corrugated Surface

机译：层压在具有波纹表面的刚性基板上的薄弹性膜的整合性
- 作者：Qiao Shutao;Gratadour Jean-Baptiste;Wang Liu;Lu Nanshu
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Adhesion;
- conformability;
- rough surfaces;
- rough surfaces.;
54.High-Selectivity Low-Pass Filters With Ultrawide Stopband Based on Defected Ground Structures

机译：基于变形地面结构的超宽阻带高选择性低通滤波器
- 作者：Chen Fu-Chang;Hu Hao-Tao;Qiu Jie-Ming;Chu Qing-Xin
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Defected ground structure (DGS);
- low-pass filter (LPF);
- microstrip;
- selectivity;
- transmission zero;
- transmission zero.;
55.Designs of Microstrip Four- and Five-Channel Multiplexers Using Branch-Line-Shaped Matching Circuits

机译：使用分支线形匹配电路的微带四通道和五通道多路复用器设计
- 作者：Deng Pu-Hua;Huang Bo-Li;Chen Bo-Lin
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Bandpass;
- matching circuit;
- microstrip;
- multiplexer;
- quadruplexer;
- quadruplexer.;
56.3-D Printed Metal-Pipe Rectangular Waveguides

机译：3D打印的金属管矩形波导
- 作者：DAuria Mario;Otter William J.;Hazell Jonathan;Gillatt Brendan T. W.;Long-Collins Callum;Ridler Nick M.;Lucyszyn Stepan
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
57.Novel Sidewall Interconnection Using a Perpendicular Circuit Die for 3-D Chip Stacking

机译：使用垂直电路管芯进行3D芯片堆叠的新型侧壁互连
- 作者：Kim Sun-Rak;Lee Jae Hak;Lee Seung S.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Edge tracing technique;
- sidewall interconnection;
- stacked chip;
- stud bump;
- wafer level;
- wafer level.;
58.A Novel Enhanced-Performance Flexible RFID-Enabled Embroidered Wireless Integrated Module for Sensing Applications

机译：用于传感应用的新型增强性能的，灵活的，支持RFID的绣花无线集成模块
- 作者：Hasani Masoumeh;Vena Arnaud;Sydanheimo Lauri;Tentzeris Manos M.;Ukkonen Leena
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
59.Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

机译：在混合大面积系统中集成和接口柔性电子
- 作者：Rieutort-Louis Warren S. A.;Sanz-Robinson Josue;Moy Tiffany;Huang Liechao;Hu Yingzhe;Afsar Yasmin;Sturm James C.;Verma Naveen;Wagner Sigurd
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Flexible electronics;
- integration;
- noncontact;
- systems;
- thin film;
- wireless;
- wireless.;
60.Thermal Remote Phosphor Coating for Phosphor-Converted White-Light-Emitting Diodes

机译：磷光转换白光二极管的热远程磷光体涂层
- 作者：Yu Xingjian;Xie Bin;Chen Qi;Ma Yupu;Wu Ruikang;Luo Xiaobing
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
61.Stress Analysis and Design Optimization for Low- src='/images/tex/18651.gif' alt='k'> Chip With Cu Pillar Interconnection

机译：铜柱互连的低 src =“ / images / tex / 18651.gif” alt =“ k”> 芯片的应力分析和设计优化
- 作者：Che Fa Xing;Lin Jong-Kai;Au Keng Yuen;Hsiao Hsiang-Yao;Zhang Xiaowu
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
62.An Equivalent Circuit Model With Current Return Path Effects for ON-Chip Interconnect up to 80 GHz

机译：具有高达80 GHz的片内互连电流返回路径效应的等效电路模型
- 作者：Zhu Yukun;Kang Kai;Wu Yunqiu;Zhao Chenxi;Ban Yong-Ling;Guo Jinhong;Sun Ling Ling;Yin Wen-Yan;Xue Quan
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Compact model;
- ON-chip interconnect;
- equivalent circuit model;
- millimeter wave;
- wideband;
- wideband.;
63.Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage

机译：用于控制包装间翘曲的过程和材料参数的反确定模型
- 作者：Lall Pradeep;Patel Kewal;Narayan Vikalp
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
64.Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability of Solder ACF Bonding

机译：键合压力和键合温度对焊料接头形态和焊料ACF键合可靠性的影响
- 作者：Kim Yoo-Sun;Kim Seung-Ho;Shin Ji-Won;Paik Kyung-Wook
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
65.Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics

机译：软电子中无机可拉伸电路的机械设计
- 作者：Wang Shuodao;Huang Yonggang;Rogers John A.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第9期
- Biomimicking electronics;
- buckling;
- inorganic semiconductor;
- stretchable electronics;
- stretchable electronics.;
66.A Theoretical Study on Post-It-Like Debonding Process for BCB Cap Transfer Packaging Based on FEM Simulation

机译：基于有限元模拟的BCB瓶盖转移包装类似样脱胶工艺的理论研究
- 作者：Seok Seonho
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- ANSYS;
- BCB packaging;
- finite-element method (FEM);
- modeling;
- transfer;
- transfer.;
67.Assembly and Packaging Technologies for High-Temperature and High-Power GaN Devices

机译：高温和高功率GaN器件的组装和封装技术
- 作者：Bajwa Adeel Ahmad;Qin Yangyang;Reiner Richard;Quay Rudiger;Wilde Jurgen
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
68.A Silicon Interposer Platform Utilizing Microfluidic Cooling for High-Performance Computing Systems

机译：利用微流体冷却的硅中介层平台，用于高性能计算系统
- 作者：Zheng Li;Zhang Yang;Bakir Muhannad S.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
69.Electrowetting Heat Pipes for Heat Transport Over Extended Distances

机译：电润湿热管，用于远距离传热
- 作者：Hale Renee S.;Bahadur Vaibhav
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- Digital microfluidics;
- electrowetting (EW);
- heat pipe;
- thermal management;
- ultrahigh heat capacity;
- ultrahigh heat capacity.;
70.Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization

机译：银和镍钯-金-银金属镀层上的第二铜线键合的可焊性
- 作者：Ismail Roslina;Harun Fuaida;Zulkifli Muhammad Nubli;Jalar Azman;Bakar Maria Abu;Abdullah Shahrum
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- Copper substrate;
- image processing;
- pull strength;
- second bond;
- second bond.;
71.Heat Generation in Bond Wires

机译：键合线中的发热
- 作者：Jung Carl Christoph;Silber Christian;Scheible Jurgen
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- Current;
- cylindrical system;
- heat equation;
- molding compound;
- pulse power systems;
- thermal simulation;
- transient heating;
- wire bonding;
- wire bonding.;
72.Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis

机译：埋铜/环氧界面分子结构的无损表征及其与失效分析的关系
- 作者：Myers John N.;Zhang Xiaoxian;Xiu Yonghao;Wei Yuying;Williamson Jaimal M.;Lee Kang-Wook;Chen Zhan
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- Failure analysis;
- interface phenomena;
- nonlinear optics;
- spectroscopy;
- spectroscopy.;
73.Impedance-Varying Broadband 90° Branch-Line Coupler With Arbitrary Coupling Levels and Higher Order Harmonic Suppression

机译：具有任意耦合电平和高阶谐波抑制的阻抗变化宽带90°分支线耦合器
- 作者：Alshamaileh Khair A.;Devabhaktuni Vijay K.;Dib Nihad I.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
74.Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package

机译：3-D芯片堆叠封装上硅通孔底部填充的失效分析和实验验证
- 作者：Le Fuliang;Lee Shi-Wei Ricky;Lo Jeffery C. C.;Yang Chaoran
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- 3D die stack;
- 3D die stack.;
- dispensing;
- underfill;
75.An Investigation of the Ink-Transfer Mechanism During the Printing Phase of High-Resolution Roll-to-Roll Gravure Printing

机译：高分辨率卷对版凹版印刷印刷阶段油墨转移机理的研究
- 作者：Nguyen Ho Anh Duc;Lee Changwoo;Shin Kee-Hyun;Lee Dongjin
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
76.Fine-Grained 3-D IC Partitioning Study With a Multicore Processor

机译：使用多核处理器的细粒度3D IC分区研究
- 作者：Jung Moongon;Song Taigon;Peng Yarui;Lim Sung Kyu
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- 3-D integrated circuits (ICs);
- block folding;
- bonding style;
- power benefit;
- power distribution network (PDN);
- thermal analysis;
- thermal analysis.;
77.Low Thermal-Resistance Silicon-Based Substrate for Light-Emitting Diode Packaging

机译：用于发光二极管封装的低耐热硅基基板
- 作者：Liu Xiaogang;Lv Zhicheng;Liu Sheng
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
78.Reliability of Plastic-Encapsulated Electronic Components in Supersaturated Steam Environments

机译：塑料封装电子元件在过饱和蒸汽环境中的可靠性
- 作者：George Jinto;Compagno Tony;Rodgers Ken;Waldron Finbarr;Barrett John
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- Encapsulants;
- harsh environment;
- medical;
- plastic packaging;
- reliability;
- steam sterilization;
- steam sterilization.;
79.Study of Techniques for Flip-Chip Bonding to Organic Substrates for Low-Power Applications

机译：低功率应用中倒装芯片键合到有机基板的技术研究
- 作者：Kerachev Lyubomir;Lembeye Yves;Crebier Jean-Christophe
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
- CMOS integrated circuits;
- electronics packaging;
- flip-chip devices;
- flip-chip devices.;
80.Experimental Investigation of a Direct Liquid Immersion Cooled Prototype for High Performance Electronic Systems

机译：高性能电子系统直接液浸冷却原型的实验研究
- 作者：Gess Joshua L.;Bhavnani Sushil H.;Johnson R. Wayne
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
81.Capacitance Expressions and Electrical Characterization of Tapered Through- Silicon Vias for 3-D ICs

机译：3-D IC的锥形硅通孔的电容表示和电特性
- 作者：Su Jinrong;Wang Fang;Zhang Wenmei
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
82.Fast Structure-Aware Direct Time-Domain Finite-Element Solver for the Analysis of Large-Scale On-Chip Circuits

机译：快速的结构感知直接时域有限元求解器，用于大规模片上电路分析
- 作者：Lee Woochan;Jiao Dan
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
83.Analytical Formulas for Tradeoff Among Channel Loss, Length, and Frequency of src='/images/tex/21718.gif' alt='RC'> - and src='/images/tex/28742.gif' alt='LC'> -Dominant Single-Ended Interconnects for Fast Equalized Link Tradeoff Estimation

机译： src =“ / images / tex / 21718.gif” alt =“ RC”> -和 src =“ / images / tex / 28742.gif” alt =“ LC”> -主要单端互连，用于快速均衡链路权衡估计
- 作者：Choi Minsoo;Kim Kwangmin;Sim Jae-Yoon;Park Hong-June;Kim Byungsub
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第10期
84.Cox-Proportional Hazards Modeling in Reliability Analysis—A Study of Electromagnetic Relays Data

机译：可靠性分析中的Cox比例风险建模-电磁继电器数据研究
- 作者：Li Lingling;Ma Dongjuan;Li Zhigang
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Electromagnetic relays;
- Weibull distribution;
- Weibull distribution.;
- lifetime;
- proportional hazards model (PHM);
- testing temperature;
85.KitFox: Multiphysics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture

机译：KitFox：用于多核微体系结构的集成电源，热和可靠性仿真的多物理库
- 作者：Song William J.;Mukhopadhyay Saibal;Yalamanchili Sudhakar
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Computer architecture;
- design methodology;
- software engineering;
- software engineering.;
86.Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression

机译：使用RF阻抗分析和高斯过程回归预测焊点的剩余寿命
- 作者：Kwon Daeil;Azarian Michael H.;Pecht Michael
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Gaussian process (GP);
- impedance;
- prognostics;
- solder-joint reliability;
- time-domain analysis;
- time-domain analysis.;
87.Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

机译：晶圆级封装，使用B级非导电膜进行Cu柱/ Sn-Ag微凸点互连
- 作者：Lee Hyeong-Gi;Choi Yong-Won;Shin Ji-Won;Paik Kyung-Wook
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Composite materials;
- polymer films;
- through-silicon vias;
- through-silicon vias.;
88.Wafer-Level Hermetic All-Glass Packaging for Microalkali Vapor Cells of Chip-Scale Atomic Devices

机译：晶片级原子器件微碱蒸气电池的晶圆级密封全玻璃包装。
- 作者：Ji Yu;Gan Qi;Wu Lei;Shang Jintang;Wong Ching-Ping
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
89.Nonlinear Electronic/Photonic Component Modeling Using Adjoint State-Space Dynamic Neural Network Technique

机译：伴随状态空间动态神经网络技术的非线性电子/光子成分建模
- 作者：Sadrossadat Sayed Alireza;Gunupudi Pavan;Zhang Qi-Jun
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
90.Multidimensional Variability Analysis of Complex Power Distribution Networks via Scalable Stochastic Collocation Approach

机译：基于可扩展随机搭配方法的复杂配电网多维变异性分析
- 作者：Prasad Aditi Krishna;Roy Sourajeet
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
91.Performance-Governing Transport Mechanisms for Heat Pipes at Ultrathin Form Factors

机译：超薄外形尺寸的热管性能控制传输机制
- 作者：Yadavalli Yashwanth;Weibel Justin A.;Garimella Suresh V.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Flat heat pipe;
- low heat flux;
- numerical model;
- performance limits;
- ultrathin vapor chamber;
- ultrathin vapor chamber.;
92.Characterization of Die-Attach Thermal Interface of High-Power Light-Emitting Diodes: An Inverse Approach

机译：大功率发光二极管的模片附着热界面的表征：一种反向方法
- 作者：Kim Dae-Suk;Han Bongtae;Bar-Cohen Avram
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
93.3-D Transient Finite-Element Analysis and Experimental Investigation of Short-Circuit Dynamic Stability for Air Circuit Breaker

机译：空气断路器的3D瞬态有限元分析和短路动态稳定性试验研究
- 作者：Qu Jianyu;Wang Qian;Zhang Junmin;Zhao Hu;Wu Gang;Li Xingwen
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
94.Effect of Thinning Encapsulant Layer on Junction and Phosphor Temperature of White Light-Emitting Diodes

机译：薄密封剂层对白光发光二极管结和磷光温度的影响
- 作者：Huang Linjuan;Shih Yu-Chou;Shi Frank G.
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
95.Influence of Glass-Frit Material Distribution on the Performance of Precision Piezoresistive MEMS Pressure Sensors

机译：玻璃料分布对精密压阻MEMS压力传感器性能的影响
- 作者：Sandvand Asmund;Halvorsen Einar;Aasmundtveit Knut E.;Jakobsen Henrik
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Finite-element analysis (FEA);
- glass-frit bonding;
- pressure sensor;
- pressure sensor.;
96.Reliability Prediction Using Physics–Statistics-Based Degradation Model

机译：使用基于物理统计量的退化模型进行可靠性预测
- 作者：Xu Dan;Wei Qidong;Chen Yunxia;Kang Rui
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
97.Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays

机译：使用铜微线阵列将大型低CTE中介层与印刷线路板直接SMT互连
- 作者：Qin Xian;Raj Pulugurtha Markondeya;Smet Vanessa;Tummala Rao
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Connectors;
- electronics packaging;
- surfacemount technology;
- surfacemount technology.;
98.Analytical Evaluation of Interfacial Crack Propagation in Vacuum-Based Picking-up Process

机译：基于真空的拾取过程中界面裂纹扩展的分析评估
- 作者：Xu Zhoulong;Liu Zunxu;Liu Huimin;Yin Zhouping;Huang Yongan;Chen Jiankui
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
- Adhesive joins;
- energy release rate (ERR);
- flip-chip;
- microelectronic packaging;
- picking-up;
- picking-up.;
99.Substrate-Integrated Millimeter-Wave Short Backfire Antenna Excited by a Novel Quad-Slot Cavity-Back Feed

机译：新型四槽腔后馈激励的基片集成毫米波短回火天线
- 作者：Chu Hui;Jin Chen;Sun Wen-Jian;Chen Jian-Xin;Guo Yongxin
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期
100.Analysis, Design, and Prototyping of Temperature Resilient Clock Distribution Networks for 3-D ICs

机译：3-D IC温度弹性时钟分配网络的分析，设计和原型设计
- 作者：Park Sung Joo;Natu Nitish;Swaminathan Madhavan
- 期刊名称：《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 | 2015年第11期

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