Measurements of thermal conductivity and specific heat of lead freesolder

摘要

Thermal processes in the manufacture of solder joints are criticalto the production of high quality electronic packaging. Thermalconductivity, thermal diffusivity and volumetric heat capacity arethermophysical properties of solder material that control the thermalaspects of the soldering process. As lead based solder materials aretargeted for elimination from electronics manufacture, the need tounderstand the thermal properties of the new attachment materials to beused are critical for quality control as well as for energy consumptionand environmental impact of the manufacturing process. Lead free soldermaterials are expected to be the predominant attachment material in thenear future