Design of future single wafer logic fabs

摘要

Describes several unique, single wafer, logic fabs designed tomeet the challenges of wafer processing in the 1990s. Specifically, theauthor compares four fab designs: (1) a new fab standard (NFS), which isdesigned with minienvironment Class 1 or better in the wafer processingand Class 10,000 in the support areas; (2) a more conventional Class 1ball-room design that is smaller due to new tooling concepts; (3) aunique minienvironment, small footprint, three story production fab inwhich the subfloor is used for photo lithography and ion implant; (4)and a minienvironment, two story production fab, slab-on-grade design.The four fab designs will produce a minimum of 25 logic part numbers perday and will process 200 mm, 0.35 micron technology wafers at a rate of500 wafer starts per day with four levels of metal in seven days or less