Mounting technology of BGA-P and BGA-T

摘要

The BGA is not as easy to inspect or repair as other packageformats. The feasibility of its practical application hinges, therefore,on the condition that its bonding rate and solder defect level issuperior to that of the QFP. In order to promote the spread of BGAs,there is a pressing need to establish a process for ensuring highbonding reliability. In this report, we present the mounting test on aBGA-P with 225 pins and a BGA-T with 426 pins. We hope that thisinformation will contribute to spurring the adoption of the BGAs