Flip chip mounting technology is currently being considered foruse in consumer information equipment, and industry is waiting for theestablishment of solder bump forming technology as an essentialconstituent of flip chip (FC) mounting technology. At the present,however, no bump forming technology offers a combination of simpleprocess and low cost. Furukawa Electric has developed a latticesubstitution solder generation technique (Super Solder, or SS) to supplysolder to the pads on PC boards. Taking advantage of the uniquecharacteristics of the SS technique, the authors have developed a solderbump formation technology for FC, under the key concepts of simpleprocess, low cost and non-bridging solder supply. The technique hasproven successful in forming solder bumps with ample volume forpractical application
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