Bump forming method, pretreatment method for solder joint, solder joint method, bump forming apparatus, pretreatment apparatus for solder joint, and solder joint device

摘要

While the process gas is supplied from the gas supply means (31) to the plasma generating means (21) in the vacuum chamber (12), the plasma generating means (21) generates a hydrogen containing plasma under low pressure. In this hydrogen containing plasma, the soft solder alloy on the surface of the processing object (11) held by the object to be exposed (15) is exposed to hydrogen containing plasma. At the same time or continuously, the soft solder alloy is reflowed in vacuum by heating means 36. As a result, an inexpensive soft solder alloy on the surface of the processed object (11) is used, so that the melted material is not used, so that the cleaning step is unnecessary, and a bump type electrode terminal which is excellent in the reliability surface can be formed.