The vacuum hot plate soldering method to reduce voids in solder joints.

摘要

The electronics industry has remarkably evolved. New technology such as thick film resistors has helped shrink equipment size and minimize cost. Consequently, these advances have put a substantial amount of pressure on manufacturers to develop new techniques to overcome the performance deficiencies associated with current manufacturing methods. Manufacturing parameters affect their key capabilities including: the temperature coefficient of resistant, long-term stability, and humidity resistance. Since voids are widely associated with reliability and performance issues, this project focuses on refining power film resistor manufacturing process in order to minimize the voids that occur within the solder joints during the soldering process. In order to do so, vacuum hot plate soldering is introduced as a new manufacturing technique. The present study is intended to demonstrate that the vacuum hot plate soldering method is a strong candidate for manufacturing power film resistors. For this purpose, the research presented below will seek to illustrate how the performance, the long-term reliability, and the manufacturing of the resistors can be improved, with this new process.