机译:球栅阵列(BGA)组件中焊点可靠性的快速评估方法-第一部分:蠕变本构关系和疲劳模型
Dept. of Power Eng., Beijing Univ. of Aeronautics & Astronautics, Beijing 100083, China;
School of Mech. & Prod. Eng., Nanyang Technological Univ., Nanyang Avenue, Singapore 639798;
School of Mech. & Prod. Eng., Nanyang Technological Univ., Nanyang Avenue, Singapore 639798;
Dept. of Power Eng., Beijing Univ. of Aeronautics & Astronautics, Beijing 100083, China;
Dept. of Power Eng., Beijing Univ. of Aeronautics & Astronautics, Beijing 100083, China;
dislocation controlled creep flow; creep-fatigue interaction; constitutive relation; life prediction model; solder joint reliability;