SOLDER BUMP FORMING MEMBER, ITS MANUFACTURING METHOD, MANUFACTURING METHOD OF BOARD WITH SOLDER BUMP AND REPRODUCING METHOD FOR DAMAGED SOLDER BUMP OF BOARD WITH SOLDER BUMP

摘要

PROBLEM TO BE SOLVED: To provide a solder bump forming member, its manufacturing method, a manufacturing method for boards with solder bumps and a reproducing method for damaged solder bumps of boards with solder bumps capable of performing the reproduction of solder bumps, etc., on a MCM (multichip module) board for example at a low cost and with an excellent mass productivity. SOLUTION: A sheet of solder foil 13 is put on a coarsened base material 3 and is stuck by a press. Next, an epoxy dry film 15 is glued on the surface of the solder foil 13. Next, ultrasonic rays are emitted on sites where solder is to be left unremoved, and the epoxy dry film 15 is hardened. After that, etching resists 17 are formed by melting and removing unrequisite parts of the dry film 15. Next, unnecessary solders in parts uncovered by the etching resists 17 are melted and removed. Next, the base material 3 is dipped in acetone, and the etching resists 17 are removed from the upside of a solder preform 5, and a solder bump forming member 1 is completed.