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International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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1.
Passive Micromixer with Sharp Edges: Simulation and Optimization
机译:
具有尖锐边缘的被动微混合器:仿真和优化
作者:
Moein Talebian Gevari
;
Ali Kosar
;
Murat Kaya Yapici
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Mixers;
Geometry;
Fluids;
Ink;
Numerical simulation;
Numerical models;
Fans;
2.
AI-Assisted Package Design for Improved Warpage Control of Ultra-Thin Packages
机译:
用于改进超薄包装的翘曲控制的AI辅助封装设计
作者:
Cheryl Selvanayagam
;
Pham Luu Trung Duong
;
Nagarajan Raghavan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Substrates;
Metals;
Analytical models;
Material properties;
Mathematical model;
Optimization;
Computed tomography;
3.
Towards a System-Level Model of a Tunable Dual-Frequency Piezoelectric Energy Harvester
机译:
朝着可调谐双频压电能量收割机的系统级模型
作者:
Y. Rao
;
S. Bouhedma
;
C. Yuan
;
T. Bechtold
;
D. Hohlfeld
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Integrated circuit modeling;
Finite element analysis;
Mathematical model;
Damping;
Magnetic resonance;
Tuning;
4.
Structure Function Assisted Thermal Coupling Analysis for Paralleling Power Semiconductor Chips
机译:
结构功能辅助热耦合对并联功率半导体芯片的热耦合分析
作者:
Daniel Pottage
;
Xiang Li
;
Matt Packwood
;
Daohui Li
;
Yangang Wang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Insulated gate bipolar transistors;
Solid modeling;
Numerical models;
Heating systems;
Coolants;
Cold plates;
Impedance;
5.
Simulation challenges of warpage for wafer- and panel level packaging
机译:
晶圆和面板级包装翘曲仿真挑战
作者:
Marius van Dijk
;
Simon Kuttler
;
Florian Rost
;
Johannes Jeaschke
;
Hans Walter
;
Olaf Wittler
;
Tanja Braun
;
Martin Schneider-Ramelow
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Strain;
Electromagnetic compatibility;
Temperature measurement;
Geometry;
Semiconductor device modeling;
Numerical simulation;
Packaging;
6.
Mechanical Design of a 3D CMOS Compatible Microelectrode Array for Neural Interfacing
机译:
用于神经接口3D CMOS兼容微电极阵列的机械设计
作者:
Bart Weekers
;
Rachid Haouari
;
Dries Braeken
;
Veronique Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Spirals;
Electrodes;
Three-dimensional displays;
Strain;
Spatial resolution;
Computer architecture;
Young's modulus;
7.
Design Optimization of a Multi-Resonant Folded Beam Piezoelectric Energy Harvester
机译:
多谐振折梁压电能量收割机的设计优化
作者:
Siyang Hu
;
Arwed Schütz
;
Sofiane Bouhedma
;
Dennis Hohlfeld
;
Tamara Bechtold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Resonant frequency;
Geometry;
Design optimization;
Evolutionary computation;
Programming;
Structural beams;
8.
Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests
机译:
在热冲击测试期间,使用来自原位状态监测的数据网络封装标准包的应力预测
作者:
Mehryar Majd
;
Peter Meszmer
;
Alexandru Priscaru
;
Przemyslaw Jakub Gromala
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Stress;
Neural networks;
Reliability;
Machine learning;
Delamination;
Sensors;
Training;
9.
Hydrolytic resistant performance evaluation for Y3 A15 O12: Ce3+ yellow phosphor used in white LED packaging
机译:
Y3 A15 O12的水解性能评价:Ce3 +黄色磷光体用于白色LED包装
作者:
Jiajie Fan
;
Shanghuan Chen
;
Xiang Sun
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Phosphors;
Fitting;
Light emitting diodes;
Temperature measurement;
Temperature;
Conductivity;
Mechanical factors;
10.
Impact of PCB-housing-interaction on QFN solder joint reliability
机译:
PCB住房 - 相互作用对QFN焊点可靠性的影响
作者:
Bart Vandevelde
;
Riet Labie
;
Daniel Vanderstraeten
;
Eddy Blansaer
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Soldering;
Reliability;
Strain;
Finite element analysis;
Fasteners;
Aluminum;
Integrated circuit modeling;
11.
DSM Reballing Ball Height Prediction Model
机译:
DSM Reballing球高预测模型
作者:
Chao-Wei Liu
;
Shang-Lin Wu
;
Ming-Hung Chen
;
Chang-Lin Yeh
;
Tun-Ching Pi
;
Jen-Chieh Kao
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
assembly;
system in package;
double side mold;
reballing;
ball height prediction model;
12.
Thermal cycling solder joint reliability reduction due to PCB bending introduced during product assembly
机译:
热循环焊接接头可靠性降低,由于产品组装期间引入PCB弯曲
作者:
Marek Wojcik
;
Janusz Duralek
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Soldering;
Strain;
Load modeling;
Creep;
Thermal loading;
Computational modeling;
Reliability;
13.
Healing solders: A numerical investigation of damage-healing experiments
机译:
愈合焊料:损伤治疗实验的数值调查
作者:
Georg Siroky
;
David Melinc
;
Julien Magnien
;
Ernst Kozeschnik
;
Dietmar Kieslinger
;
Elke Kraker
;
Werner Ecker
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Strain;
Heating systems;
Loading;
Filling;
Liquids;
Numerical models;
Surface cracks;
14.
Differential Reflective Metrology An innovative variability measurement for advanced FDSOI material
机译:
差分反射计量为先进的FDSOI材料进行创新的可变性测量
作者:
J.-M. Billiez
;
W. Schwarzenbach
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Thickness measurement;
Metrology;
Wavelength measurement;
Substrates;
Two dimensional displays;
Semiconductor device measurement;
Temperature measurement;
15.
A Decade of Gains in LED Packaging Technologies as Captured in LM-80 Data
机译:
LM-80数据中捕获的LED包装技术中有十年的收益
作者:
J. Lynn Davis
;
Monica Hansen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
16.
Electromagnetic System-Level Model of Novel Free Flight Microactuator
机译:
新型免费飞行微致动器的电磁系统级模型
作者:
Arwed Schütz
;
Siyang Hu
;
Evgeny B. Rudnyi
;
Tamara Bechtold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Computational modeling;
Magnetomechanical effects;
Actuators;
Magnetostatics;
Projectiles;
Finite element analysis;
Mathematical model;
17.
Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages
机译:
芯片尺度包装中再分配层疲劳性的半实验法
作者:
M. van Soestbergen
;
J.J.M. Zaal
;
R. Roucou
;
Q. Jiang
;
A. Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Fatigue;
Strain;
Copper;
Silicon;
Reliability;
Plastics;
Resistance;
18.
Numerical Analysis of Impact Induced Failure for MEMS Membranes during Guided Free Fall Tests
机译:
MEMS膜在引导秋季试验中对MEMS膜失效的数值分析
作者:
David Faraci
;
Aldo Ghisi
;
Silvia Adorno
;
Alberto Corigliano
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Fixtures;
Micromechanical devices;
Fluids;
Atmospheric modeling;
History;
Stress;
Silicon;
19.
Characterization of toughness of epoxy based molding compound and its implementation in FEM code
机译:
基于环氧树脂的成型化合物韧性及其在FEM编码中的表征及其实现
作者:
Lukas Haag
;
Fabian Welschinger
;
Patrick Gaiser
;
Przemyslaw Gromala
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Finite element analysis;
Stress;
Load modeling;
Electromagnetic compatibility;
Geometry;
Convergence;
Compounds;
20.
Panel Level Warpage Simulation of Printed Circuit Boards comprising electrical components
机译:
包括电气部件的印刷电路板的面板级翘曲模拟
作者:
J. Zündel
;
T. Krivec
;
Q. Tao
;
M. Frewein
;
S. Stojanovic
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Resins;
Copper;
Integrated circuit modeling;
Printed circuits;
Curing;
Material properties;
Temperature measurement;
21.
Optimization of Thermal Vias Design in PCB-Based Power Circuits
机译:
基于PCB的PCB电源电路热通孔设计的优化
作者:
A. P. Catalano
;
R. Trani
;
C. Scognamillo
;
V. d’Alessandro
;
A. Castellazzi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
TV;
Finite element analysis;
Plating;
Thermal resistance;
Cooling;
Performance evaluation;
Gallium nitride;
22.
Power Module Ceramic Substrates: mechanical characterization and modeling
机译:
电源模块陶瓷基板:机械表征和建模
作者:
Alessandro Sitta
;
Marco Renna
;
Angelo Alberto Messina
;
Giuseppe Mirone
;
Giuseppe D’Arrigo
;
Michele Calabretta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Substrates;
Copper;
Temperature measurement;
Ceramics;
Reliability;
Numerical models;
Microelectronics;
23.
Simulation of Dielectrophoresis based Separation of Red Blood Cells (RBC) from Bacteria Cells
机译:
基于介电泳基于细菌细胞的红细胞(RBC)分离的模拟
作者:
Osman Sahin
;
Meltem Elitas
;
Murat Kaya Yapici
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Microorganisms;
Electrodes;
Electric fields;
Mathematical model;
Force;
Dielectrophoresis;
Permittivity;
24.
Condensation characteristics of a propylene loop heat pipe working in 193 K-283 K
机译:
193 k-283 k的丙烯回路热管的凝结特性
作者:
Kaifen Yan
;
Guangming Xu
;
Nanxi Li
;
Yinong Wu
;
Rongjian Xie
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Temperature measurement;
Heating systems;
Heat transfer;
Fluids;
Temperature distribution;
Cooling;
25.
A Reliability Assessment Approach for The Biomimetic Neuron Circuit
机译:
生物菊粉神经元电路的可靠性评估方法
作者:
Bo Sun
;
Ziquan Lei
;
Chunbing Guo
;
Guohao Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Neurons;
Capacitors;
Integrated circuit modeling;
Degradation;
Biological system modeling;
Integrated circuit reliability;
26.
An ISFET Sensor-Integrated Micromixer for pH Measurements
机译:
用于pH测量的ISFET传感器集成的微混合器
作者:
Gizem Acar
;
Hossein Alijani
;
Ali Kosar
;
Murat Kaya Yapici
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Logic gates;
Electrodes;
Indexes;
Microfluidics;
Sensors;
Sensitivity;
Numerical models;
27.
Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation
机译:
扇出晶圆级包装晶圆翘曲研究:有限元建模与实验验证
作者:
A. Salahouelhadj
;
M. Gonzalez
;
K. Vanstreels
;
A. Podpod
;
A. Phommahaxay
;
K. Rebibis
;
E. Beyne
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Temperature measurement;
Strain;
Young's modulus;
Liquids;
Temperature distribution;
Heating systems;
28.
Direct Measurements of Underfill Local Strain Using Confocal Microscopy and Digital Image Correlation
机译:
使用共聚焦显微镜和数字图像相关性的底部填充局部应变的直接测量
作者:
Ying Yang
;
Papa Momar Souare
;
Julien Sylvestre
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
29.
Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models
机译:
瞬态热分析和校准FE模型LED封装中的故障识别
作者:
Alexander Hanss
;
E Liu
;
Muhammad Rizwan Abdullah
;
Gordon Elger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
Light emitting diodes;
Aluminum nitride;
III-V semiconductor materials;
30.
Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments
机译:
PCB嵌入技术的翘曲调查 - 通过FEM和实验测定相关建模参数
作者:
Florian Rost
;
Saskia Huber
;
Hans Walter
;
Marius van Dijk
;
Thomas Cramer
;
Johannes Jaeschke
;
Olaf Wittler
;
Martin Schneider-Ramelow
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Temperature measurement;
Fabrics;
Resins;
Glass;
Lamination;
Weaving;
Finite element analysis;
31.
BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses
机译:
由于制造业引入了残余应力,BEOL破解风险
作者:
Juergen Auersperg
;
Ellen Auerswald
;
Dietmar Vogel
;
Sven Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
32.
Automated Method Using Finite Element Simulation to Identify Microvia Stacks at Risk of Separation in Complex PCB Designs
机译:
使用有限元仿真的自动化方法识别复杂PCB设计中分离风险的Microvia堆栈
作者:
Kourosh Kalayeh
;
Natalie Hernandez
;
Craig Hillman
;
Nathan Blattau
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Copper;
Integrated circuit reliability;
Integrated circuit interconnections;
Stress;
Strain;
Integrated circuit modeling;
33.
Lifetime Prediction of Ultraviolet Light-emitting Diodes with Accelerated Wiener Degradation Process
机译:
紫外线发光二极管与加速维纳劣化过程的寿命预测
作者:
Zhou Jing
;
Mesfin Seid Ibrahim
;
Jiajie Fan
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Light emitting diodes;
Degradation;
Aging;
Stress;
Reliability;
Data models;
Maintenance engineering;
34.
Layout optimization of CMOS Interconnects for Heating, Cooling and Improved Stress Distribution
机译:
CMOS互连的布局优化,用于加热,冷却和改进应力分布
作者:
Verena Hein
;
Kirsten Weide-Zaage
;
Xi Yang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Heating systems;
Stress;
Layout;
Temperature distribution;
Integrated circuit modeling;
Metallization;
35.
Effect of Nonlinear Interactions of Electronic Assemblies in Response to Multiaxial Vibration
机译:
电子组件非线性相互作用响应多轴振动的影响
作者:
Xiao Lin
;
Abhijit Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Vibrations;
Testing;
Loading;
Accelerometers;
Bandwidth;
Load modeling;
Microelectronics;
36.
Modeling temperature dependent chemical reaction of intermetallic compound growth
机译:
金属间化合物生长的温度依赖性化学反应
作者:
A. Morozov
;
A. Freidin
;
W.H. Müller
;
A. Semencha
;
M. Tribunskiy
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Chemicals;
Stress;
Microelectronics;
Strain;
Thermal stresses;
Tin;
37.
Application of Artificial and recurrent neural network on the steady-state and transient finite element modeling
机译:
人工和经常性神经网络在稳态和瞬态有限元建模中的应用
作者:
Cadmus Yuan
;
Yu-Jun Hong
;
Chang-Chi Lee
;
Kou-Ning Chiang
;
Jin-Huang Huang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Artificial neural networks;
Iron;
Recurrent neural networks;
Artificial intelligence;
Training;
Electronic packaging thermal management;
Semiconductor device modeling;
38.
Degradation Prediction of Electronic Packages using Machine Learning
机译:
使用机器学习的电子包装的降解预测
作者:
Alexandru Prisacaru
;
Ernesto Oquelis Guerrero
;
Przemyslaw Jakub Gromala
;
Bongtae Han
;
Guo Qi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Stress;
Artificial intelligence;
Delamination;
Stress measurement;
Task analysis;
Reliability engineering;
39.
Coupled Electro-mechanical Simulation of Capacitive MEMS Accelerometer for Determining Optimal Parameters of Readout Circuit
机译:
电容MEMS加速度计确定读出电路最优参数的电力机械仿真
作者:
Piotr Zaj?c
;
Micha? Szermer
;
Piotr Amrozik
;
Cezary Maj
;
Grzegorz Jab?oński
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Accelerometers;
Integrated circuit modeling;
Micromechanical devices;
Capacitance;
Electrostatics;
Force;
Switching frequency;
40.
Automatic assembly of multiscale models and its application to a family of homogenized models of wave propagation through interfaces having a periodic structure
机译:
通过具有周期性结构的接口自动组装多尺度模型及其应用于均质型波传播模型的应用
作者:
M. Lenczner
;
W. Belkhir
;
N. Ratier
;
N.B. Trinh
;
B. Cavallier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Mathematical model;
Grammar;
Computational modeling;
Periodic structures;
Software;
Propagation;
41.
Smart textiles: how electronics merge into our clothing
机译:
智能纺织品:电子器件如何合并到我们的衣服中
作者:
K. M. B. Jansen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Sensors;
Clothing;
Smart textiles;
Fabrics;
Printed circuits;
Integrated circuit interconnections;
42.
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
机译:
在恶劣环境条件下开发可靠性测试的模块化测试设置
作者:
Laura Wambera
;
Karsten Meier
;
Robert H?hne
;
Bj?rn B?hme
;
Christian G?tze
;
Jens Paul
;
Marcel Wieland
;
Karlheinz Bock
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Monitoring;
Resistance;
Testing;
Connectors;
Current measurement;
Humidity;
Electrical resistance measurement;
43.
The effect of the thermal conductivity of room-temperature-vulcanizing silicone used for boiling heat transfer
机译:
用于沸腾热传递的室温硫化硅胶的导热率的影响
作者:
Noriyuki Unno
;
Kazuhisa Yuki
;
Risako Kibushi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
Electronic packaging thermal management;
Power systems;
Resistance heating;
Heat transfer;
44.
Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures
机译:
电阻电容器方法,用于在电子外壳内温湿度响应建模
作者:
?. Staliulionis
;
S. Mohanty
;
J. H. Hattel
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Moisture;
Humidity;
Adsorption;
Integrated circuit modeling;
Finite element analysis;
Capacitance;
Mathematical model;
45.
Effect of material properties on PCB frequencies in electronic control unit
机译:
材料特性对电子控制单元PCB频率的影响
作者:
Mahdi Sadeghinia
;
Chalukya Chincholi
;
Alexander Udyansky
;
Andreas Fischer
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Shape;
Material properties;
Frequency measurement;
Vehicle dynamics;
Analytical models;
Microelectronics;
Micromechanical devices;
46.
A SPICE-based Transient Thermal-Electronic Model for LEDs
机译:
用于LED的香料基瞬态热电子型号
作者:
Bo Sun
;
Jiajie Fan
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Light emitting diodes;
Numerical models;
Junctions;
Integrated circuit modeling;
Temperature measurement;
Temperature;
Electronic packaging thermal management;
47.
Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane
机译:
光学微加工的超声传感器,具有搭扣声学膜中的硅光子谐振器
作者:
W.J. Westerveld
;
S.M. Leinders
;
P.L.M.J. van Neer
;
H.P. Urbach
;
N. de Jong
;
M.D. Verweij
;
X. Rottenberg
;
V. Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
48.
Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
机译:
使用低熔点温度SNBI基焊膏LMPA-Q改进QFN热循环可靠性
作者:
Bart Vandevelde
;
Riet Labie
;
Ralph Lauwaert
;
Daniel Werkhoven
;
Daniel Vanderstraeten
;
Eddy Blansaer
;
Jonas Lannoo
;
Davy Pissoort
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Soldering;
Lead;
Reliability;
Stress;
Standards;
Resistance;
49.
Measurements and Simulations of the Creep Strain in Flip Chip Solder Balls
机译:
倒装芯片焊球中蠕变应变的测量和模拟
作者:
Florian Schindler-Saefkow
;
Florian Rost
;
Sven Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Stress;
Semiconductor device measurement;
Stress measurement;
Creep;
Simulation;
Flip-chip devices;
Mathematical model;
50.
Simulation Methodology for Active Semiconductor Devices in MEMS
机译:
MEMS中有源半导体器件的仿真方法
作者:
Mike Schwarz
;
Volkmar Senz
;
Arne Dannenberg
;
Wolfgang Feiler
;
Friedjof Heuck
;
Thomas Friedrich
;
Christian Sorger
;
Jochen Robert Bosch Franz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Micromechanical devices;
Semiconductor diodes;
Semiconductor process modeling;
Sensors;
Analytical models;
Temperature measurement;
51.
Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions
机译:
谐波振动耐久性在不同等温条件下无铅焊点测试
作者:
Karsten Meier
;
David Leslie
;
Tamara Storz
;
Abhijit Dasgupta
;
Karlheinz Bock
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Resonant frequency;
Vibrations;
Soldering;
Stress;
Temperature;
Fatigue;
Isothermal processes;
52.
Numerical Simulation of Reflow Soldering
机译:
回流焊接的数值模拟
作者:
Michael Stadler
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Semiconductor device modeling;
Liquids;
Optimization;
Mathematical model;
Reflow soldering;
53.
Modelling of display-compatible piezoelectric micromachined ultrasonic transducers for haptic feedback
机译:
显示兼容压电微机械超声换能器的模拟触觉反馈
作者:
A. Halbach
;
P. Gijsenbergh
;
Y. Jeong
;
M. Billen
;
C. Chare
;
H. Gao
;
G.B. Torri
;
D. Cheyns
;
X. Rottenberg
;
V. Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Resonant frequency;
Integrated circuit modeling;
Acoustics;
Impedance;
RLC circuits;
Atmospheric modeling;
Impedance measurement;
54.
Migration of flow inducted hotspot with heat spreader integrated microchannel subjected to asymmetric heat flux: A Multiphysics approach.
机译:
流动电感热点与散热器集成的微通道进行流动的热点,经受不对称热通量的微通道:多体验方法。
作者:
G. Narendran
;
N. Gnanasekaran
;
D. Arumuga Perumal
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Microchannels;
Heating systems;
Numerical models;
Heat sinks;
Temperature distribution;
Fluids;
Mathematical model;
55.
Analytical modelling of MEMS Z-axis comb-drive accelerometer
机译:
MEMS Z轴梳驱加速度计的分析模型
作者:
Cezary Maj
;
Micha? Szermer
;
Piotr Zaj?c
;
Piotr Amrozik
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
56.
A Combined Methodology to Include System Effects in Board-Level Stress Simulations
机译:
组合方法包括在液体压力模拟中包含系统效应
作者:
Rainer Dudek
;
Marcus Hildebrandt
;
Sven Rzepka
;
Ralf D?ring
;
Lutz Scheiter
;
Bastian Tr?ger
;
Mengjia Zhang
;
Reinhold W. Ortmann
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Loading;
Strain;
Fasteners;
Stress;
Reliability;
Temperature measurement;
Standards;
57.
Numerical study on local effects of composition and geometry in self-healing solders
机译:
对自我愈合焊料组成和几何局部影响的数值研究
作者:
Georg Siroky
;
Elke Kraker
;
Julien Magnien
;
Ernst Kozeschnik
;
Dietmar Kieslinger
;
Werner Ecker
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
58.
Electromigration Effects in Corroded BGA
机译:
腐蚀BGA的电迁移效应
作者:
Kirsten Weide-Zaage
;
Alexandrine Guédon-Gracia
;
Hélène Frémont
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Electromigration;
Corrosion;
Microelectronics;
Reliability;
Soldering;
Stress;
Integrated circuit modeling;
59.
Numerical and experimental study of a novel body-mounted piezoelectric energy harvester based on synchronized multi-magnet excitation
机译:
基于同步多磁体激励的新型车身压电能收割机的数值和实验研究
作者:
Arunas Kleiva
;
Rolanas Dauksevicius
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Magnetic flux;
Magnetic resonance;
Magnetometers;
Transducers;
Magnetosphere;
Transient analysis;
Vibrations;
60.
Methodology for Correlation of Porosity and Mechanical Properties of Silver Sintered Joints in Electronics
机译:
电子烧结关节孔隙率和机械性能相关的方法
作者:
R. Metasch
;
M. Roellig
;
P. Knoch
;
C. Weinmann
;
K. Meier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Strain;
Temperature measurement;
Force;
Silver;
Temperature dependence;
Force measurement;
61.
Enhanced Fluid Flow by Wavelike Excitation of a Micromechanical Bending Actuator
机译:
通过微机械弯曲致动器的波动激发增强的流体流动
作者:
Wolfgang H?lzl
;
Regine Behlert
;
Matthias Gehring
;
Gabriele Schrag
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Mathematical model;
Oscillators;
Actuators;
Force;
Electrodes;
Micromechanical devices;
62.
Micro-Transfer-Printing and Potential Process Optimizations by FEA
机译:
微型转印 - 印刷和FEA的潜在过程优化
作者:
Kjell Buehler
;
Georg Lorenz
;
Marcel Mittag
;
Uwe Krieger
;
Niclas Heise
;
Sebastian Wicht
;
Ronny Gerbach
;
Falk Naumann
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Adhesives;
Micromechanical devices;
Force;
Temperature measurement;
Printing;
Stress;
Mathematical model;
63.
Thermal Warpage Behavior Analysis of Semiconductor Packages
机译:
半导体套件的热翘曲行为分析
作者:
Kento Kariya
;
Naoaki Tsurumi
;
Takuji Maekawa
;
Mitsuru Morimoto
;
Noriyuki Masago
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Electromagnetic compatibility;
Temperature measurement;
Stress;
Material properties;
Chemicals;
Lead;
Mathematical model;
64.
Simulation and Design of an Optical Accelerometer
机译:
光学加速度计的仿真与设计
作者:
V. Rochus
;
W.J. Westerveld
;
B. Figeys
;
X. Rottenberg
;
R. Jansen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Optical waveguides;
Accelerometers;
Sensitivity;
Photonics;
Optical sensors;
Resonant frequency;
Mathematical model;
65.
Design for Package Miniaturization for a MEMS Pressure Sensor
机译:
用于MEMS压力传感器的包装小型化设计
作者:
Roseanne Duca
;
Marco Omar Ghidoni
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Stress;
Micromechanical devices;
Substrates;
Sensors;
Ceramics;
Safety;
Metals;
66.
A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints
机译:
球栅阵列焊点稳健热力学分析的概率方法
作者:
Ayda Halouani
;
Abel Cherouat
;
Mariem Miladi Chaabane
;
Mohamed Haddar
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Strain;
Stochastic processes;
Chaos;
Soldering;
Heating systems;
Monte Carlo methods;
Load modeling;
67.
Finite element method simulation of graphene phononic crystals with cross-shaped nanopores
机译:
具有交叉形纳米孔的石墨烯函声晶体的有限元法模拟
作者:
Seiya Kubo
;
Marek E. Schimidt
;
Manoharan Muruganathan
;
Hiroshi Mizuta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Phonons;
Graphene;
Neck;
Crystals;
Heating systems;
Finite element analysis;
Photonic band gap;
68.
Modeling of Thermal Processes in Thin-Film BAW Resonators
机译:
薄膜BAW谐振器热处理建模
作者:
A. G. Kozlov
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Resonators;
Heating systems;
Air gaps;
Acoustics;
Piezoelectric transducers;
Substrates;
Atmospheric modeling;
69.
Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling
机译:
基于粘弹性材料建模的高温PCB树脂制造过程中局部负荷的数值估计
作者:
M. Schmidt
;
Y. Maniar
;
R. Ratchev
;
A. Kabakchiev
;
M. Guyenot
;
H. Walter
;
M. Schneider-Ramelow
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Resins;
Glass;
Transmission line matrix methods;
Optical fiber testing;
Strain;
Load modeling;
Stress;
70.
Package Level Warpage Simulation of a Fan Out System in Board Module
机译:
包级翘曲模拟船用扇出系统的模块
作者:
M. Frewein
;
T. Krivec
;
Q. Tao
;
J. Zuendel
;
J. Rosc
;
M. Gschwandl
;
Peter F. Fuchs
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Laminates;
Temperature;
Finite element analysis;
Temperature dependence;
Resins;
Strain;
Copper;
71.
Air-Coupled Array of Pmuts at 100 kHz with PZT Active Layer: Multiphysics Model and Experiments
机译:
带有PZT活性层的100kHz的空气耦合阵列Pmuts:多体模型和实验
作者:
G. Massimino
;
A. Colombo
;
R. Ardito
;
F. Quaglia
;
F. Foncellino
;
A. Corigliano
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Transducers;
Acoustics;
Numerical models;
Fluids;
Atmospheric modeling;
History;
Computational modeling;
72.
Degradation of Bisphenol-A-polycarbonate (BPA-PC) Optical Lenses under Simulated Harsh Environment Conditions
机译:
模拟苛刻环境条件下双酚-A-聚碳酸酯(BPA-PC)光学镜片的降解
作者:
Maryam Yazdan Mehr
;
Willem van Driel
;
Kouchi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Light emitting diodes;
Degradation;
Lenses;
Stress;
Reliability;
Aging;
Lighting;
73.
Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion
机译:
压痕载荷期间模塑化合物的塑性变形及失效模式及其对粘附性致粘性定量表征的重要性
作者:
Nadine Pflügler
;
Georg M. Reuther
;
Michael Goroll
;
Reinhard Pufall
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Compounds;
Plastics;
Loading;
Strain;
Load modeling;
Adhesives;
Tools;
74.
Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments
机译:
用拉曼实验验证的铜基焊接在铜基上的GaN导向器中的热机械应力
作者:
E Liu
;
Fosca Conti
;
Raffaella Signorini
;
Enrico Brugnolotto
;
Sri Krishna Bhogaraju
;
Gordon Elger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
75.
Advanced Mixed-Mode Bending Test: Influence of the Surface Topography on the Fracture Behavior of an EMC to Copper Lead Frame Bi-Material Interface
机译:
高级混合模式弯曲试验:表面形貌对EMC骨折行为的影响到铜引线框架双层界面
作者:
M. Schulz
;
R. Mro?ko
;
B. Wunderle
;
M. Abo Ras
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Electromagnetic compatibility;
Lead;
Milling;
Surface cracks;
Surfaces;
Copper;
Stress;
76.
Advanced Electro-Thermal Analysis of IGBT Modules in a Power Converter System
机译:
电力转换系统中IGBT模块的高级电热分析
作者:
Xiang Li
;
Daohui Li
;
Fang Qi
;
Matthew Packwood
;
Haihui Luo
;
Guoyou Liu
;
Yangang Wang
;
Xiaoping Dai
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Insulated gate bipolar transistors;
Integrated circuit modeling;
Multichip modules;
Junctions;
Inverters;
Couplings;
Three-dimensional displays;
77.
Simulation-Based Design of an Electrostatically Driven Micro-Actuator for Fluid Transport in Mobile Applications
机译:
基于仿真的静电驱动微致动器设计,用于移动应用中的流体运输
作者:
M. Seidl
;
M. Gehring
;
U. Krumbein
;
G. Schrag
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Pumps;
Valves;
Fluidics;
Fluids;
Finite element analysis;
Actuators;
Micromechanical devices;
78.
Virtual Prototyping and Simulation of Electro-Thermal Systems
机译:
电热系统的虚拟原型和仿真
作者:
Torsten Hauck
;
Vibhash Jha
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Mathematical model;
Finite element analysis;
Transmission line matrix methods;
Transistors;
Interconnected systems;
Heating systems;
Integrated circuit modeling;
79.
Reconstructing mid-air acoustic holograms using PMUT arrays: a simulation study
机译:
使用PMUT阵列重建中空声学全息图:模拟研究
作者:
H. Gao
;
P. Gijsenbergh
;
S.P. Mao
;
A. Halbach
;
Y. Jeong
;
D. Cheyns
;
X. Rottenberg
;
V. Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Acoustics;
Phased arrays;
Acoustic arrays;
Frequency measurement;
Resonant frequency;
Micromechanical devices;
80.
Accelerated Pump Out Testing for Thermal Greases
机译:
加速泵出热润滑脂的试验
作者:
B. Wunderle
;
D. May
;
J. Heilmann
;
J. Arnold
;
J. Hirscheider
;
Y. Li
;
J. Bauer
;
R. Schacht
;
M. Abo Ras
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Thermal conductivity;
Testing;
Conductivity;
Life estimation;
Thermal stresses;
Stress;
Loading;
81.
Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder
机译:
由焊料选择的焊接堆的热电力行为的比较
作者:
Ramiro S. Vargas C
;
Viktor Gonda
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Creep;
Mathematical model;
Strain;
Load modeling;
Lead;
Stress;
82.
Online prognostication of remaining useful life for random discharge lithium-ion batteries using a gamma process model
机译:
使用伽马工艺模型对随机放电锂离子电池剩余使用寿命的在线预测
作者:
Zeyu Wu
;
Zili Wang
;
Cheng Qian
;
Bo Sun
;
Yi Ren
;
Qiang Feng
;
Dezhen Yang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Microelectronics;
Micromechanical devices;
Probability density function;
Reactive power;
Conferences;
Stochastic processes;
Shape;
83.
Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests
机译:
通过粘性区有限元模拟预测包装的鲁棒性,无损检测验证
作者:
Reinhard Pufall
;
Daniel May
;
Bernhard Wunderle
;
Georg M. Reuther
;
Nadine Pflügler
;
Dominik Udiljak
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Delamination;
Adhesives;
Predictive models;
Stress;
Microscopy;
Compounds;
Acoustics;
84.
Electrical and optical characterization of MoS
2
thin film transistors and the effect of strain on their performances
机译:
MOS
2 INF>薄膜晶体管的电气和光学表征及其对性能的影响
作者:
Zuopeng Qu
;
Hongyu Tang
;
Huaiyu Ye
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Molybdenum;
Sulfur;
Thin film transistors;
Dielectrics;
Optical films;
Strain;
85.
Determination of BEOL Aluminum-Copper Constitutive Equation using FEA Simulation and Response Surface Methodology
机译:
使用FEA模拟和响应表面方法测定BEOL铝 - 铜组织型方程
作者:
Raj Sekar Sethu
;
Hansika Jayawardana
;
Kok Heng Soon
;
Almon Wei-Yen Chai
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Mathematical model;
Strain;
Aluminum;
Stress;
Plastics;
Computational modeling;
Semiconductor device modeling;
86.
Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading
机译:
剪切和拉伸显性循环载荷下SnAGCU焊料失效的数值预测
作者:
M. Kuczynska
;
Y. Maniar
;
N. Schafet
;
U. Becker
;
S. Weihe
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Strain;
Load modeling;
Stress;
Numerical models;
Soldering;
Isothermal processes;
Force;
87.
Material Model and Simulation of Multilayer-AgSn-Foils for Transient-Liquid-Phase Bonding of Sensor Elements
机译:
用于传感器元件瞬态 - 液相键合多层AGSN箔的材料模型及仿真
作者:
Markus Fei?t
;
Cong Li
;
Jürgen Wilde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Temperature measurement;
Stress;
Strain;
Substrates;
Bonding;
Heating systems;
Metals;
88.
Numerical Simulation of Top Metal Thickness on IMD Stress due to Probing
机译:
探测引起的IMD压力顶部金属厚度的数值模拟
作者:
Raj Sekar Sethu
;
Lars Bergmann
;
Marco Erstling
;
Peter Lammert
;
Angela Fahr
;
Hansika Jayawardana
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Stress;
Probes;
Metals;
Needles;
Wires;
Dielectrics;
Bonding;
89.
Analysis of Self Heating Effect in Vertical-channel Field Effect Transistor
机译:
垂直通道场效应晶体管中自加热效应分析
作者:
Ilho Myeong
;
Jongwook Jeon
;
Myounggon Kang
;
Hyungcheol Shin
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Heating systems;
Ions;
Thermal conductivity;
Performance evaluation;
Substrates;
Field effect transistors;
Analytical models;
90.
Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications
机译:
双悬臂梁上的微弯曲试验:一种标本为中心的方法,可以精确测定电力电子应用的烧结银粘塑性的方法
作者:
Uwe Zschenderlein
;
Markus Klingler
;
J?rg Arnold
;
Mario Baum
;
Marie Wei?bach
;
Marco Schaal
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Mathematical model;
Strain;
Silver;
Dogs;
Bones;
Silicon;
Manufacturing;
91.
Transgranular Crack Propagation in Thermal Cycling of SnAgCu Solder Joints
机译:
Snagcu焊点热循环中的跨晶裂纹繁殖
作者:
Andreas L?vberg
;
Per-Erik Tegehall
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Soldering;
Strain;
Lead;
Fatigue;
Failure analysis;
Grain boundaries;
Temperature distribution;
92.
Computational Mechanics for Flexible and Wearable Electronics
机译:
柔性可穿戴电子产品的计算力学
作者:
Zhuangjian LIU
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Strain;
Silicon;
Substrates;
Inverters;
Optical imaging;
Integrated circuit interconnections;
Performance evaluation;
93.
Measurement and Simulation of Test Structures Dedicated to the Investigation of Heat Diffusion at Nanoscale
机译:
纳米尺度热扩散研究的测试结构的测量和仿真
作者:
Marcin Janicki
;
Jedrzej Topilko
;
Artur Sobczak
;
Piotr Zajac
;
Piotr Pietrzak
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Resistors;
Temperature measurement;
Heating systems;
Silicon;
Thermal resistance;
Mathematical model;
94.
Numerical modelling of magnetic nanoparticle dynamics in microfluidic devices
机译:
微流体装置中磁纳米粒子动力学的数值模拟
作者:
Péter Pálovics
;
Márta Rencz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Magnetic separation;
Magnetic cores;
Saturation magnetization;
Magnetic susceptibility;
Magnetic domains;
Force;
Biochemistry;
95.
Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load
机译:
热机械负荷下SiC-MOSFET电源模块的聚合物和陶瓷封装的模拟比较
作者:
Felix Wagner
;
Youssef Maniar
;
Martin Rittner
;
Stefan Kaessner
;
Michael Guyenot
;
Lukas Lang
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Thermal conductivity;
Ceramics;
Multichip modules;
Heating systems;
Conductivity;
Temperature measurement;
Compounds;
96.
Solder interconnect degradation with irregular joint shape
机译:
用不规则关节形状焊料互连劣化
作者:
X.J. Zhao
;
H. De Vries
;
R. Engelen
;
P. Watté
;
G. van Hees
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Wires;
Light emitting diodes;
Degradation;
Integrated circuit interconnections;
Soldering;
Plating;
Aging;
97.
Characterization of Stochastically Distributed Voids in Sintered Nano-Silver Joints
机译:
烧结纳米银关节中随机分布空隙的表征
作者:
Zhongchao Sun
;
Zili Wang
;
Cheng Qian
;
Yi Ren
;
Qiang Feng
;
Dezhen Yang
;
Bo Sun
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Gaussian distribution;
Soldering;
Silver;
Shape;
Sensitivity;
Microelectronics;
Micromechanical devices;
98.
Modelling, Simulations and Performance Analysis of MEMS vibrating Gyroscope in Coventor MEMS+ Environment
机译:
COVETOR MEMS +环境中MEMS振动陀螺仪的建模,仿真与性能分析
作者:
Jacek Nazdrowicz
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Micromechanical devices;
Gyroscopes;
Solid modeling;
Mathematical model;
Springs;
Integrated circuit modeling;
Software;
99.
Simulations in Terms of Radiation Effects on different BEOL Material Systems
机译:
在不同BEOL材料系统上的辐射效应方面模拟
作者:
Kirsten Weide-Zaage
;
Guillermo Paya-Vaya
;
Philemon Eichin
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Neutrons;
Single event upsets;
Silicon;
Microelectronics;
Metallization;
Radiation effects;
Integrated circuits;
100.
Modelling and Simulation of Glass Frit Bonding of Silicon Wafers
机译:
硅晶圆玻璃玻璃料粘接的建模与仿真
作者:
Seyed Amir Fouad Farshchi Yazdi
;
Matteo Garavaglia
;
Aldo Ghisi
;
Alberto Corigliano
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Semiconductor device modeling;
Glass;
Silicon;
Micromechanical devices;
Bonding;
Residual stresses;
Computational modeling;
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