Healing solders: A numerical investigation of damage-healing experiments

机译：愈合焊料：损伤治疗实验的数值调查

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The effect of liquid-assisted healing (LAH) of solder materials is investigated by means of experiments and numerical modelling. An in-situ heating experiment shows the material transport due to viscous flow into a surface cavity and, thus, motivates the

机译：通过实验和数值模拟研究了液体辅助愈合（LAH）焊料材料的影响。原位采热实验表明，由于粘性流入表面腔，因此，粘性的材料传输，从而激励

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 》|2020年|395p|共7页
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作者
Georg Siroky; David Melinc; Julien Magnien; Ernst Kozeschnik; Dietmar Kieslinger; Elke Kraker; Werner Ecker;
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中图分类自动模拟理论（自动仿真理论） ;
关键词
Strain; Heating systems; Loading; Filling; Liquids; Numerical models; Surface cracks;

机译：菌株;加热系统;装载;填充;液体;数值模型;表面裂缝;

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2. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA)ASSEMBLY--PART Ⅱ: RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION [J] . 史训清, John HL Pang, 杨前进, 力学学报：英文版 . 2002 ,第004期

机译：球栅阵列（BGA）组装中焊点可靠性的快速评估方法-第二部分：可靠性实验与数值模拟
3. Investigation of Orthogonal Experiment for Fabrication of a Soldering Joint for a 4-T HTS Coil [J] . Zhou F., Cheng J., Xu Y., Applied Superconductivity, IEEE Transactions on . 2014 ,第5期

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4. Healing solders: A numerical investigation of damage-healing experiments [C] . Georg Siroky, David Melinc, Julien Magnien, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：修复焊料：损伤修复实验的数值研究
5. Investigating Brittle Rock Failure and Associated Seismicity Using Laboratory Experiments and Numerical Simulations [D] . Zhao, Qi. 2017

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6. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack [O] . Shoudong Gu, Xiaoyang Jiao, Jianfang Liu, 2010

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Healing solders: A numerical investigation of damage-healing experiments

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