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International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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1.
Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
机译:
球尺寸和几何的影响对MM波系统的可靠性和RF性能:模拟方法
作者:
Seyyid Dilek
;
Ivan Ndip
;
Marco Rossi
;
Christian Tschoban
;
Simon Kuttler
;
Olaf Wittler
;
Klaus-Dieter Lang
;
Christian Goetze
;
Daniel Berger
;
Marcel Wieland
;
Martin Schneider-Ramelow
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Radio frequency;
Geometry;
Solid modeling;
Three-dimensional displays;
Sensitivity analysis;
Packaging;
Numerical simulation;
2.
Finite Element Analysis of Copper Pillar Interconnect Stress of Flip-chip Chip-Scale Package
机译:
倒装芯片芯片级封装铜柱互连应力的有限元分析
作者:
Amirul Afripin
;
Burt Carpenter
;
Torsten Hauck
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Performance evaluation;
Materials reliability;
Reliability engineering;
Electronic packaging thermal management;
Finite element analysis;
Compounds;
Flip-chip devices;
3.
Aging of the Molding Compound Identification using Piezoresistive Silicon Based Stress Sensor
机译:
使用压阻式硅基应力传感器的模塑复合鉴定老化
作者:
Alexandru Prisacaru
;
Przemyslaw Jakub Gromala
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature sensors;
Temperature measurement;
Temperature;
Aging;
Oxidation;
Silicon;
Compounds;
4.
Evaluating Local Delamination of Power Electronic Devices Through Thermal-Mechanical Analysis
机译:
通过热机械分析评估电力电子设备的局部分层
作者:
H. Huai
;
G. Laskin
;
M. Fratz
;
T. Seyler
;
T. Beckmann
;
A. Bertz
;
D. Carl
;
J. Wilde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Optical filters;
Insulated gate bipolar transistors;
Solid modeling;
Optical interferometry;
Optical variables measurement;
Optical imaging;
Adaptive optics;
5.
Infrared thermal imaging as inline quality assessment tool
机译:
红外线热成像作为内联质量评估工具
作者:
S. Panahandeh
;
D. May
;
D.R. Wargulski
;
E. Boschman
;
R. Schacht
;
M. Abo Ras
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Scanning electron microscopy;
Microscopy;
Production;
Inspection;
Tools;
Quality assessment;
Reliability;
6.
Comparison of different models of magnetic nanoparticle aggregation in microchannels with magnetic field
机译:
磁场微通道磁纳米粒子聚集模型的比较
作者:
Péter Pálovics
;
Márton Németh
;
Márta Rencz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Solid modeling;
Torque;
Computational modeling;
Microscopy;
Magnetic nanoparticles;
Predictive models;
7.
Dynamical characterisation of a miniaturised bulge tester for use at elevated temperatures
机译:
高温下使用的小型化凸起测试仪的动力学特征
作者:
U. Zschenderlein
;
H. Zhang
;
R. Ecke
;
N. Jöhrmann
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Micromechanical devices;
Temperature;
Thermomechanical processes;
Loading;
Pressure measurement;
Microelectronics;
8.
Reliability of LED-based Systems
机译:
基于LED系统的可靠性
作者:
Willem D. van Driel
;
B. Jacobs
;
P. Watte
;
X. Zhao
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Technological innovation;
Solid state lighting;
Systematics;
System integration;
Reliability engineering;
Robustness;
Product development;
9.
Robust Package Study for A Power Package by Simulation
机译:
通过模拟对电力包装的强大包装研究
作者:
Haibo Fan
;
Civen Li
;
Noorazam bin Azman
;
Peilun Yao
;
Haibin Chen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Shape;
Lead;
Tools;
Electromagnetic compatibility;
Minimization;
Delamination;
10.
Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System
机译:
基于模拟系统的高性能车辆热机械可靠性研究
作者:
Rainer Dudek
;
Ralf Döring
;
Sven Rzepka
;
Przemyslaw Gromala
;
Jens Schindele
;
Bart Vandevelde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Program processors;
Parametric study;
Computational modeling;
Creep;
Thermomechanical processes;
Computer performance;
11.
Lifetime modelling of sintered silver interconnected power devices by FEM and experiment
机译:
FEM和实验终身建模烧结银相互连接功率器件
作者:
Anu Mathew
;
Rainer Dudek
;
Alexander Otto
;
Christina Scherf
;
Sven Rzepka
;
Nilavzhagan Subbiah
;
Kashmira Arvind Rane
;
Jürgen Wilde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Insulated gate bipolar transistors;
Silver;
Wires;
Integrated circuit interconnections;
Lead;
Finite element analysis;
Plastics;
12.
Towards Data Driven Failure Analysis Using Infrared Thermography
机译:
使用红外热成像数据驱动失效分析
作者:
Kaushal Arun Pareek
;
Daniel May
;
Mohamad Abo Ras
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Training;
Performance evaluation;
Thermomechanical processes;
Failure analysis;
Production;
Signal reconstruction;
13.
Analysis of the stress state in QFN package during four bending experiment utilizing piezoresistive stress sensor
机译:
利用压阻应力传感器的四个弯曲实验期间QFN封装应力状态分析
作者:
Daniel Riegel
;
Przemyslaw Jakub Gromala
;
Sven Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Geometry;
Temperature sensors;
Temperature measurement;
Bending;
Predictive models;
Numerical simulation;
Silicon;
14.
Simulations for nanoindentation on thin metal films and the potential influence of creep
机译:
薄金属薄膜纳米内膜的模拟及蠕变的潜在影响
作者:
N. Jöhrmann
;
R. Ecke
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Atomic measurements;
Films;
Creep;
Simulation;
Thermomechanical processes;
Metals;
Microelectronics;
15.
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
机译:
任意电力电子电气热机械可靠性评估
作者:
Mario Gschwandl
;
Martin Pfost
;
Thomas Antretter
;
Peter Filipp Fuchs
;
Ivaylo Mitev
;
Qi Tao
;
Angelika Schingale
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Loading;
Thermomechanical processes;
Tools;
Electronic packaging thermal management;
Reliability engineering;
Power electronics;
16.
Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)
机译:
先进(金属3D印刷)直接液体喷射冲洗冷却解决方案,用于自主驾驶高性能车计算机(HPVC)
作者:
Antonio Pappaterra
;
Bart Vandevelde
;
Majid Nazemi
;
Willem Verleysen
;
Herman Oprins
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Solid modeling;
Three-dimensional displays;
Program processors;
Cooling;
Computational modeling;
Metals;
17.
A comparative study of acoustic isolation configurations for pMUT array-based applications
机译:
基于PMUT阵列应用的声学隔离配置的比较研究
作者:
Bogdan Vysotskyi
;
Rachid Haouari
;
Bart Weekers
;
Grim Keulemans
;
Guilherme Brondani Torri
;
Veronique Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Filtering;
Crosstalk;
Machining;
Acoustic arrays;
Acoustics;
Microelectronics;
18.
Reliability Analysis of a RF Product with Improved Quality for the Prediction of Failure Probabilities
机译:
具有改进质量的RF产品的可靠性分析,以预测失效概率
作者:
Philippe Leduc
;
Peter Krenz
;
Roland Niemeier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Radio frequency;
Micromechanical devices;
Manufacturing processes;
Stochastic processes;
Production;
Probability;
Predictive models;
19.
Geometrically Parametrized Reduced Order Model of a Miniaturized Thermoelectric Generator for Electrically Active Implants
机译:
用于电活性植入物的小型热电发电机的几何参数化减少阶模型
作者:
Chengdong Yuan
;
Tamara Bechtold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Geometry;
Micromechanical devices;
Parametric study;
Reduced order systems;
Generators;
Software;
Parametric statistics;
20.
A Parametric Simulative Study for Lifetime Prediction of Sintered Silver Die Attach Under Different Accelerated Testing Conditions
机译:
不同加速试验条件下烧结银模具的寿命预测的参数模拟研究
作者:
Freerik Forndran
;
Jens Heilmann
;
Martin Metzler
;
Markus Leicht
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Silver;
Power system measurements;
Temperature;
Silicon carbide;
Semiconductor materials;
Thermomechanical processes;
Predictive models;
21.
Numerical and Experimental Study on Determination Method of Elastoplastic Properties for Indentation Testing
机译:
压痕试验弹塑性性能测定方法的数值实验研究
作者:
Kento Kariya
;
Noriyuki Masago
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Deformable models;
Instruments;
Mechanical variables measurement;
Microelectronics;
Finite element analysis;
Stress;
22.
Concept of a Mechanical Test Setup for Packaging Materials Using Digital Image Correlation Methods
机译:
使用数字图像相关方法包装材料的机械测试设置的概念
作者:
E. Wiss
;
D. Barth
;
S. Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature sensors;
Temperature measurement;
Micromechanical devices;
Modular construction;
Correlation;
Digital images;
Packaging;
23.
Tilt- and warpage measurement of bonded dies as an inline quality assessment tool
机译:
绑定模具的倾斜和翘曲测量作为内联质量评估工具
作者:
D. May
;
J. Heilmann
;
E. Boschman
;
M. Abo Ras
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Insulated gate bipolar transistors;
Semiconductor device measurement;
Production;
Thermal sensors;
Vibration measurement;
Tools;
24.
Vibration of Roadway Luminaires
机译:
道路灯具的振动
作者:
G. Charlston
;
M. Shiue
;
Willem D. van Driel
;
B. Jacobs
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Micromechanical devices;
Computational modeling;
Computational fluid dynamics;
Microelectronics;
Acceleration;
Stress;
25.
Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading
机译:
SAC305焊点机械循环耐久性的可变性:使用循环剪切载荷的晶粒尺度建模基于模型的评估
作者:
Abhishek Deshpande
;
Qian Jiang
;
Abhijit Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Uncertainty;
Loading;
Stochastic processes;
Fatigue;
Finite element analysis;
Thermal loading;
Soldering;
26.
Using AFM Measurements for Failure Indication During High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers
机译:
在MEMS悬臂上的薄金属薄膜的高循环疲劳试验期间使用AFM测量
作者:
V. Osipova
;
N. Jöhrmann
;
J. Heilmann
;
D. May
;
J. Arnold
;
T. Bieniek
;
R. Pufall
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Temperature measurement;
Films;
Surface resistance;
Metals;
Resonant frequency;
Fatigue;
27.
Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates
机译:
硅氮化硅芯片与铜基材焊接和烧结互连中应力现象的仿真和实验
作者:
E Liu
;
Fosca Conti
;
Sri Krishna Bhogaraju
;
Gordon Elger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Performance evaluation;
Analytical models;
Compressive stress;
Thermomechanical processes;
Data models;
Microelectronics;
Finite element analysis;
28.
Time-based Reliability Analysis of Electrolytic Capacitors for Automotive Applications Using Multi-Domain Simulation
机译:
多域模拟汽车应用的电解电容基于时间的可靠性分析
作者:
Philipp Adler
;
Regine Mallwitz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Viscosity;
Analytical models;
Capacitors;
Aging;
Batteries;
Reliability;
Thermal loading;
29.
Characterization of prepreg shrinkage and investigation of its influence on warpage simulation
机译:
预浸料坯收缩特征及其对翘曲模拟影响的研究
作者:
J. Zündel
;
M. Sagerer
;
M. Frewein
;
T. Krivec
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Transmission line matrix methods;
Temperature;
Simulation;
Thermomechanical processes;
Production;
Curing;
30.
The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts
机译:
逼真布局互连堆栈寿命时间性能估计的改进
作者:
Verena Hein
;
Kirsten Weide-Zaage
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Layout;
Integrated circuit interconnections;
Predictive models;
Tools;
Integrated circuit reliability;
Integrated circuit modeling;
31.
Finite element-based lifetime modelling of SAC solder joints in LED applications
机译:
基于有限元的LED应用中SAC焊接接头的寿命建模
作者:
M. Shaygi
;
M. Li
;
K.J. Lang
;
H. Laux
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Uncertainty;
Thermomechanical processes;
Light emitting diodes;
Thermal management;
Microelectronics;
Finite element analysis;
32.
Panel Level Warpage Simulation of Printed Circuit Boards comprising electrical components
机译:
包括电气部件的印刷电路板的面板级翘曲模拟
作者:
J. Zündel
;
T. Krivec
;
Q. Tao
;
M. Frewein
;
S. Stojanovic
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Resins;
Copper;
Integrated circuit modeling;
Printed circuits;
Curing;
Material properties;
Temperature measurement;
33.
Optimization of Thermal Vias Design in PCB-Based Power Circuits
机译:
基于PCB的PCB电源电路热通孔设计的优化
作者:
A. P. Catalano
;
R. Trani
;
C. Scognamillo
;
V. d’Alessandro
;
A. Castellazzi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
TV;
Finite element analysis;
Plating;
Thermal resistance;
Cooling;
Performance evaluation;
Gallium nitride;
34.
Power Module Ceramic Substrates: mechanical characterization and modeling
机译:
电源模块陶瓷基板:机械表征和建模
作者:
Alessandro Sitta
;
Marco Renna
;
Angelo Alberto Messina
;
Giuseppe Mirone
;
Giuseppe D’Arrigo
;
Michele Calabretta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Substrates;
Copper;
Temperature measurement;
Ceramics;
Reliability;
Numerical models;
Microelectronics;
35.
Simulation of Dielectrophoresis based Separation of Red Blood Cells (RBC) from Bacteria Cells
机译:
基于介电泳基于细菌细胞的红细胞(RBC)分离的模拟
作者:
Osman Sahin
;
Meltem Elitas
;
Murat Kaya Yapici
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Microorganisms;
Electrodes;
Electric fields;
Mathematical model;
Force;
Dielectrophoresis;
Permittivity;
36.
Condensation characteristics of a propylene loop heat pipe working in 193 K-283 K
机译:
193 k-283 k的丙烯回路热管的凝结特性
作者:
Kaifen Yan
;
Guangming Xu
;
Nanxi Li
;
Yinong Wu
;
Rongjian Xie
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Temperature measurement;
Heating systems;
Heat transfer;
Fluids;
Temperature distribution;
Cooling;
37.
A Reliability Assessment Approach for The Biomimetic Neuron Circuit
机译:
生物菊粉神经元电路的可靠性评估方法
作者:
Bo Sun
;
Ziquan Lei
;
Chunbing Guo
;
Guohao Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Neurons;
Capacitors;
Integrated circuit modeling;
Degradation;
Biological system modeling;
Integrated circuit reliability;
38.
An ISFET Sensor-Integrated Micromixer for pH Measurements
机译:
用于pH测量的ISFET传感器集成的微混合器
作者:
Gizem Acar
;
Hossein Alijani
;
Ali Kosar
;
Murat Kaya Yapici
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Logic gates;
Electrodes;
Indexes;
Microfluidics;
Sensors;
Sensitivity;
Numerical models;
39.
IC package related stress effects on the characteristics of ring oscillator circuits
机译:
IC封装相关应力对环形振荡电路特性的影响
作者:
S. Schlipf
;
C. Sander
;
A. Clausner
;
J. Paul
;
S. Capecchi
;
L. Wambera
;
K. Meier
;
E. Zschech
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Ring oscillators;
Thermomechanical processes;
Silicon-on-insulator;
Bending;
Transistors;
Integrated circuit modeling;
Stress;
40.
Thermal Analysis of Microfluidic cooling in Processing-in-3D-Stacked Memory
机译:
加工3D堆叠记忆中微流体冷却的热分析
作者:
Jun-Han Han
;
Karina Torres-Castro
;
Robert E. West
;
Nathan Swami
;
Mircea Stan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Power system measurements;
Solid modeling;
Three-dimensional displays;
Power demand;
Density measurement;
Coolants;
Thermal analysis;
41.
A Piezoelectric MEMS Loudspeaker Lumped and FEM models
机译:
压电MEMS扬声器集体和有限元模型
作者:
Romain Liechti
;
Stéphane Durand
;
Thierry Hilt
;
Fabrice Casset
;
Christel Dieppedale
;
Thierry Verdot
;
Mikaël Colin
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Loudspeakers;
Simulation;
Piezoelectric actuators;
Bandwidth;
Bending;
Acoustics;
42.
Transient pull-in simulation of electrostatic microvalve with physics-based contact function
机译:
基于物理的接触功能的静电微仪模拟
作者:
Grim Keulemans
;
Boshen Liang
;
Alexey Podkovskiy
;
Shruti Jambaldinni
;
Dominika Wysocka
;
Lei Zhang
;
Tim Stakenborg
;
David Cheyns
;
Paul Heremans
;
Veronique Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Microvalves;
Stability analysis;
Sensors;
Microelectronics;
Mathematical model;
Transient analysis;
43.
Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test
机译:
通过3 PB测试,4H-SIC模具的失效力量分析
作者:
Antonio Landi
;
Aye Aye Mon
;
Laura Liaci
;
Alessandro Sitta
;
Michele Calabretta
;
Antonella Sciuto
;
Giuseppe D’Arrigo
;
Marco Renna
;
Vincenzo Vinciguerra
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Young's modulus;
Silicon carbide;
Atmospheric measurements;
Gain measurement;
Particle measurements;
Surface roughness;
Rough surfaces;
44.
Deep Learning of the SSL Luminaire Spectral Power Distribution under Multiple Degradation Mechanisms by Hybrid kNN algorithm
机译:
用混合核对算法在多重降解机制下SSL灯具光谱配电的深度学习
作者:
Cadmus Yuan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Degradation;
Training;
Neural networks;
Thermal engineering;
Power distribution;
Predictive models;
Logic gates;
45.
Comparison of cooling performance of manifold and straight microchannel heat sinks using CFD simulation
机译:
使用CFD仿真比较歧管和直微通道散热器的冷却性能
作者:
Piotr Zając
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Manifolds;
Micromechanical devices;
Manufacturing processes;
Fluid flow;
Thermal management;
Microelectronics;
Heat sinks;
46.
Invited Talk: Simulation-Based Design and Optimization for Future Mobility Electronics Systems
机译:
邀请谈话:对未来移动电子系统的基于仿真的设计和优化
作者:
Ercan M. Dede
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Power system measurements;
Electronic components;
Topology;
Numerical models;
Microelectronics;
Electromagnetics;
47.
Multi-scale Viscoplastic Modeling of Pb-free Sn3.0Ag0.5Cu Solder Interconnects
机译:
PB无铅SN3.0AG0.5CU焊料互连的多尺度粘液型造型
作者:
Gayatri Cuddalorepatta
;
Abhijit Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
48.
Multiple Environment Overstress Testing and Modelling of Solar Cells
机译:
多种环境过度测试和太阳能电池建模
作者:
E. P. Veninga
;
A. W. J. Gielen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
49.
Large Deformation of Beam Columns - a Closed Form Solution and Design Guide for Vertical Buckling Probe Needles
机译:
梁柱的大变形 - 垂直屈曲探针针的封闭式溶液和设计指南
作者:
Torsten Hauck
;
Wolfgang Muller
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
50.
Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality
机译:
引线粘接未来:一种提高Cu-Wire键合质量的组合实验和数值方法
作者:
E. Spaan
;
E. Ooms
;
W. D. van Driel
;
C. A. Yuan
;
D. G. Yang
;
G. Q. Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
51.
Global modelling and simulation of a Coriolis vibrating micro-gyroscope for quadrature error compensation
机译:
正常误差补偿科里奥利振动微陀螺的全局建模与仿真
作者:
Melanie Descharles
;
Jean Guerard
;
Hamid Kokabi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
52.
Jets and Rotary Flows for Single-Phase Liquid Cooling: An Overview of Some Recent Experimental Findings
机译:
用于单相液体冷却的喷射和旋转流动:一些最近的实验结果概述
作者:
Punch J.
;
Walsh E.
;
Grimes R.
;
Jeffers N.
;
Kearney D.
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
53.
Thermo-mechanical simulations in double-sided heat transfer power assemblies
机译:
双面传热功率组件中的热机械模拟
作者:
E. Woirgard
;
I. Favre
;
J. Y. Deletage
;
S. Azzopardi
;
R. Leon
;
G. Convenant
;
Z. Khatir
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
54.
Bond Wire Design for eXtreme Switch Devices
机译:
极端开关装置的键合线设计
作者:
Torsten Hauck
;
Anton Kolbeck
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
55.
The Study of Carbon Nanotube's Length in Reference to Its Thermal Conductivity by Molecular Dynamics Approach
机译:
分子动力学方法研究碳纳米管长度的热导率
作者:
Bartosz Platek
;
Tomasz Falat
;
Jan Felba
;
Artur Borzdun
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
56.
New Methodology on Electro-Thermal Characterization and Modeling of Large Power Drivers Using Lateral PNP BJTs
机译:
横向PNP BJTS电热表征和大型电力驱动器建模的新方法
作者:
J. Rhayem
;
A. Vrbicky
;
R. Blecic
;
P. Malena
;
S. Bychikhin
;
D. Pogany
;
A. Wieers
;
A. Baric
;
M. Tack
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
57.
Thermo-mechanical simulation of BCB membrane thin-film package
机译:
BCB膜薄膜包装的热机械模拟
作者:
S. Seok
;
Janggil Kim
;
N. Rolland
;
P. A. Rolland
;
Siebe Bouwstra
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
58.
Numerical-experimental analysis of combined bulk and interface fracture in a leadless package
机译:
无铅封装中组合散装和界面骨折的数值实验分析
作者:
Sander Noijen
;
Sven Walczyk
;
Roelf Groenhuis
;
Olaf van der Sluis
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
59.
Numerical Approach to Multiscale Evaluation and Analysis of Tg of Crosslinked Polymers
机译:
多尺度评价与交联聚合物Tg分析的数值方法
作者:
Sebastian J. Tesarski
;
Ole Holck
;
Artur Wymyslowski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
60.
Prediction of Stiction in Microswitch Systems
机译:
微动开关中静态预测
作者:
Ling WU
;
V. ROCHUS
;
L. NOELS
;
J. C. GOLINVAL
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
61.
Virtual Thermo-Mechanical Prototyping for High-Temperature-Application Microelectronics
机译:
高温应用微电子的虚拟热机械原型
作者:
Daoguo Yang
;
W. D. van Driel
;
Huib Scholten
;
L. Goumans
;
R. Faria
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
62.
Fabrication of Freestanding Thin Pt/W Thermocouple by Joule Heat Welding
机译:
通过焦耳热焊接制作独立薄Pt / W热电偶
作者:
Hironori Tohmyoh
;
Hironao Takeda
;
Mohammed N. I. Khan
;
Masumi Saka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
63.
Design of Al Pad Geometry for Reducing Current Crowding Effect in Flip-chip Solder Joint Using Finite-element Analysis
机译:
使用有限元分析减少倒装芯片焊接关节电流拥挤效应的Al焊盘几何设计
作者:
Y. W. Chang
;
Chih Chen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
64.
Modeling the residual shrinkage during lithographic processing on flexible polymer substrates
机译:
柔性聚合物基材的光刻处理中的残余收缩
作者:
Barink M.
;
Van den Berg D.
;
Yakimets I.
;
Meinders E.
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
65.
Principles for Simulation of Barrier Cracking due to high Stress
机译:
由于高应力引起的阻挡裂缝模拟原理
作者:
Johar Ciptokusumo
;
Kirsten Weide-Zaage
;
Oliver Aubel
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
66.
Thermomechanical characterization of electronic components
机译:
电子元件的热机械表征
作者:
Sana Ben KHLIFA
;
Napo BONFOH
;
Paul LIPINSKI
;
Manuel FENDLER
;
Stephane BERNABE
;
Herve RIBOT
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
67.
A correlation between thermo-mechanical finite elements tool with electro-thermal finite elements tool: towards an electro-mechanical finite elements modeling for IGBT used in power assemblies
机译:
具有电热有限元工具的热机械有限元工具的相关性:朝向动力组件中使用的IGBT的电力有限元建模
作者:
Y. Belmehdi
;
S. Azzopardi
;
E. Woirgard
;
J. Y. Deletage
;
I. Favre
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
68.
Sintering, in Different Temperatures, of Traces of Silver Printed in Flexible Surfaces
机译:
在不同的温度下,烧结在柔性表面中的痕量银痕迹
作者:
Mancosu R. D.
;
Quintero J. A. Q.
;
Azevedo R. E. S.
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
关键词:
Ink-jet printing;
Conductive silver;
Nano-particles;
Sintering;
69.
A Case Study of Networked Sensors by Simulations and Experiments
机译:
模拟与实验的联网传感器案例研究
作者:
Cheng Guo
;
Martin Jacobsson
;
R. Venkatesha Prasad
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
70.
Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test
机译:
D滴试验下IC包装焊接接头可靠性预测的动态子结构方法
作者:
Fei Liu
;
Qiang Wang
;
Lihua Liang
;
Yong Liu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
关键词:
WL-CSP;
Drop test;
Input-G;
Substructure method;
71.
Interfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress
机译:
硅与模塑化合物的界面强度随热残余应力而变化
作者:
Gerd Schlottig
;
An Xiao
;
Heinz Pape
;
Bernhard Wunderle
;
Leo J. Ernst
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
72.
Magnetic Analysis and Simulations of a Self-Propelled Capsule Endoscope
机译:
自推进胶囊内窥镜的磁分析和仿真
作者:
Chengzhi Hu
;
Mingyuan Gao
;
Zhenzhi Chen
;
Honghai Zhang
;
Sheng Liu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
73.
Effects of the Geometrical Dimensions on Stress and Strain of Electrostatically Actuated MEMS Resonators at Pull-in and Stiction Positions
机译:
几何尺寸对拉入静态位置静电MEMS谐振器应力和应变的影响
作者:
M. Pustan
;
V. Rochus
;
J. C. Golinval
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
74.
High-Speed Mechanical Impact Reliability of Solder Interconnections in High-Power LEDs
机译:
高功率LED中焊料互连的高速机械冲击可靠性
作者:
J. Hokka
;
J. F. J. M. Caers
;
X. J. Zhao
;
M. De Jong
;
W. Peels
;
B. Sykes
;
G. Q. Zhang
;
M. Paulasto-Krockel
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
75.
Evaluating the Effect of Shock Absorber Layers in the Dynamic Behavior of PWB with Viscoelastic Insert
机译:
用粘弹性插入评估减震器层对PWB动态行为的影响
作者:
Cleber Pagliosa
;
Joao Morais da Silva Neto
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
76.
Board Level Reliability of the Advanced RF Power Packaging
机译:
高级RF Power Packaging的板级可靠性
作者:
Cadmus Yuan
;
Michael A. Asis
;
Joey Salta
;
Willem van Driel
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
77.
Mechanical Behaviour and Fatigue of Copper Ribbons used as Solar Cell Interconnectors
机译:
用作太阳能电池互连器的铜带力学行为和疲劳
作者:
Steffen Wiese
;
Rico Meier
;
Frank Kraemer
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
78.
Application of Numerical Optimization Algorithms Used to Investigation of Thin Films in Nanoindentation Test
机译:
数值优化算法应用于纳米狭窄试验中薄膜的研究
作者:
Lukasz Dowhan
;
Artur Wymyslowski
;
Olaf Wittler
;
Raul Mrossko
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
79.
Electro-thermal investigations on silicon inverters operating at low frequency
机译:
低频运行硅逆变器的电热调查
作者:
J. ANTONIOS
;
N. GINOT
;
C. BATARD
;
Y. SCUDELLER
;
M. MACHMOUM
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
80.
A Comparison of Model Order Reduction Methods used in different FE Software Tools
机译:
不同FE软件工具中使用模型顺序减少方法的比较
作者:
M. Jungwirth
;
D. Hofinger
;
H. Weinzierl
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
81.
Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures
机译:
纳米级图案硅结构中应变行为的数值研究
作者:
F. Naumann
;
O. Moutanabbir
;
M. Reiche
;
C. Schriever
;
J. Schilling
;
M. Petzold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
82.
Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board
机译:
电路板中有源嵌入式组件的电子组件PCB积聚层配置的优化
作者:
W. C. Maia Filho
;
M. Brizoux
;
A. Grivon
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
关键词:
Printed Circuit Board;
PCB stack-up;
Embedded active components;
83.
A New Iterative Algorithm For The Solution For The Load Deflection Square Membranes
机译:
一种新的载荷偏转方膜解决方案的迭代算法
作者:
H. Youssef
;
A. Ferrand
;
P. Pons
;
R. Plana
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
84.
Numerical Simulations of Thermo-Mechanical Stresses during the Casting of Multi-Crystalline Silicon Ingots
机译:
多晶硅锭铸造过程中热机械应力的数值模拟
作者:
M. Oswald
;
M. Turek
;
J. Bagdahn
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
85.
MEMS Resonator temperature compensation
机译:
MEMS谐振器温度补偿
作者:
F. Casset
;
C. Durand
;
Y. Civet
;
E. Ollier
;
J. F. Carpentier
;
P. Ancey
;
P. Robert
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
86.
Local stress analysis in devices by FIB
机译:
FIB的设备中的局部应力分析
作者:
Rene Kregting
;
Sander Gielen
;
Willem van Driel
;
Paul Alkemade
;
Hozan Miro
;
Jan-Dirk Kamminga
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
87.
Electro-thermo-mechanical simulation of automotive MOSFET transistor
机译:
汽车MOSFET晶体管的电热热电机模拟
作者:
Herve FERAL
;
Xavier CHAUFFLEUR
;
Jean-Pierre FRADIN
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
88.
Electromagnetic and Thermal investigation of RF Devices
机译:
RF器件的电磁和热调查
作者:
A. ALNUKARI
;
P. GUILLEMET
;
Y. SCUDELLER
;
S. TOUTAIN
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
89.
Multiscale approach optimization on surface wettability change on rough surface
机译:
多尺度方法优化表面湿度变化粗糙表面
作者:
Edward K. L. Chan
;
Haibo Fan
;
Matthew M. F. Yuen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
90.
Design for reliability: Thermo-mechanical analyses of Stress in Through Silicon Via
机译:
可靠性设计:通过硅通硅压力的热机械分析
作者:
Samed Barnat
;
Helene Fremont
;
Alexandrine Gracia
;
Eric Cadalen
;
Catherine Bunel
;
Francois Neuilly
;
Jean-Rene Tenailleau
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
关键词:
Through silicon vias;
Thermomechanical stress;
Virtual prototyping;
Screening;
91.
The Degradation of Solder Joints under High Current Density and Low-Cycle Fatigue
机译:
高电流密度和低循环疲劳下焊点的降解
作者:
D. Di Maio
;
C. Murdoch
;
O. Thomas
;
C. Hunt
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
92.
Vibration Reliability of SMD Pb-free Solder Joints
机译:
SMD无铅焊点的振动可靠性
作者:
Mario Borras
;
Roumen Ratchev
;
Olivier Lanier
;
Michael Guyenot
;
Daniel Coutellier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
93.
Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates
机译:
高应变率下囊焊料力学行为的特征
作者:
K. Meier
;
M. Roellig
;
S. Wiese
;
K. J. Wolter
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
94.
Measuring time-dependent mechanics in metallic MEMS
机译:
在金属MEMS中测量时间依赖力学
作者:
L. I. J. C. Bergers
;
N. K. R. Delhey
;
J. P. M. Hoefnagels
;
M. G. D. Geers
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
95.
Comparison and Characterization of a Typical Strain Gage Trace Against Another Using the Printed Method
机译:
用印刷方法对抗典型应变计痕迹的比较与表征
作者:
Quintero Jairo Alonso Quintero
;
Mancosu Rafael Drumond
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
关键词:
Printed Electronics;
Strain gauge;
Polyimide;
Characterization;
96.
Interconnection Technologies for Photovoltaic Modules - Analysis of technological and mechanical Problems
机译:
光伏模块的互连技术 - 技术与机械问题分析
作者:
Steffen Wiese
;
Frank Kraemer
;
Norbert Betzl
;
Dietmar Wald
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
97.
Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures
机译:
底部填充机械性能对由区域串联倒装芯片结构安装芯片局部变形和残余应力的影响
作者:
Kohta Nakahira
;
Yuki Sato
;
Hiroki Kishi
;
Ken Suzuki
;
Hideo Miura
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
98.
Aging Effects of Epoxy Moulding Compound on the Long-Term Stability of Plastic Package
机译:
环氧成型化合物对塑料包装长期稳定性的老化作用
作者:
Eric Nguegang
;
Jochen Franz
;
Andre Kretschmann
;
Hermann Sandmaier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
99.
Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials
机译:
一些行为法律的效率和鲁棒性在粘塑变形和焊料材料的降解中的描述中
作者:
Sabeur MSOLLI
;
Adrien ZEANH
;
Olivier DALVERNY
;
Moussa KARAMA
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
100.
A Linear Analysis To Overcome The Numerical Cherenkov Instability
机译:
克服数值Cherenkov不稳定性的线性分析
作者:
F. Assous
;
J. Segre
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2010年
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