Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling

摘要

Isotropic conductive adhesives (ICA) are now widely used in industry for a panel of applications such as space electronics manufacturing. Epoxy based adhesives are compliant enough to reliably bond bi-materials with an important coefficient of thermal expansion (CTE) mismatch. However, they are still under investigation for the characterization of their fatigue behaviour. Engineers lack of life prediction tools, although they are available for metallic materials. It is all the more necessary when it comes to severe on-ground qualification tests used to accelerate the demonstration of the die attachment reliability.