Provided are: a thermally conductive pressure-sensitive adhesive composition which is obtained by carrying out at least a polymerization reaction of a (meth)acrylic acid ester monomer (α1) and a crosslinking reaction of a (meth)acrylic acid ester polymer (A1) and/or a polymer that has a structural unit derived from the (meth)acrylic acid ester monomer (α1) in a mixed composition that contains a predetermined amount of a (meth)acrylic resin composition (A) that contains the (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (α1), a predetermined amount of a thermally conductive filler (B1) that has an average particle diameter of 20 μm or less and a BET specific surface area of less than 1.0 m2/g, a predetermined amount of a thermally conductive filler (B2) that has an average particle diameter of 20 μm or less and a BET specific surface area of 1.0 m2/g or more, and a predetermined amount of a polyfunctional epoxy compound (C) that has from 2 to 10,000 (inclusive) functional groups, said thermally conductive pressure-sensitive adhesive composition being not easily torn even if molded into a thin body; and a thermally conductive pressure-sensitive adhesive sheet-like molded body.
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机译：提供一种导热性粘合剂组合物，其通过至少进行（甲基）丙烯酸酯单体（α1）的聚合反应和（甲基）丙烯酸酯聚合物（A1）的交联反应而得到。和/或具有在混合组合物中具有衍生自（甲基）丙烯酸酯单体（α1）的结构单元的聚合物，所述混合组合物包含预定量的包含（甲基）丙烯酸的（甲基）丙烯酸树脂组合物（A）酸酯聚合物（A1）和（甲基）丙烯酸酯单体（α1），预定量的平均粒径为20μm以下且BET比表面积小于2μm的导热性填料（B1）。 1.0 m 2 / g，预定量的导热填料（B2），其平均粒径为20μm或更小，BET比表面积为1.0 m 2 / g或更高，并且预定量的多官能环氧化合物（C）具有2〜10,000个（含）官能团，即使成型为薄片状，该导热性粘合剂组合物也不易撕裂。导热性粘合片状成型体。
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