THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMOPSITION, THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDED BODY, METHOD FOR PRODUCING THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, METHOD FOR PRODUCING THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDED BODY, AND ELECTRONIC COMPONENT

摘要

Provided is a thermally conductive pressure-sensitive adhesive composition which has insulating properties and thermal conductivity in a balanced manner and is obtained by carrying out a polymerization reaction of a (meth)acrylic acid ester monomer mixture and a crosslinking reaction of a polymer that comprises a structural unit derived from a (meth)acrylic acid ester polymer (A1) and/or a (meth)acrylic acid ester monomer (alpha1) in a mixed composition that contains: 100 parts by mass of a (meth)acrylic resin composition (A) that contains the (meth)acrylic acid ester polymer (A1) and the (meth)acrylic acid ester monomer (alpha1); from 0.5 parts by mass to 40 parts by mass (inclusive) of a zinc oxide (C) having a needle-like portion; from 0.5 parts by mass to 20 parts by mass (inclusive) of an expanded graphite powder (D); and from 600 parts by mass to 1,400 parts by mass (inclusive) of an insulating thermally conductive filler (B) that is other than the zinc oxide (C) having a needle-like portion and the expanded graphite powder (D). Also provided are: a thermally conductive pressure-sensitive adhesive sheet-like molded body; a method for producing the thermally conductive pressure-sensitive adhesive composition; a method for producing the thermally conductive pressure-sensitive adhesive sheet-like molded body; and an electronic component which is provided with the thermally conductive pressure-sensitive adhesive composition or the thermally conductive pressure-sensitive adhesive sheet-like molded body.