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Advanced Packaging, IEEE Transactions on

中文名称：高级包装，IEEE事务

ISSN：1521-3323
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1.Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

机译：用于改进的高性能倒装芯片BGA封装的裸露模顶封装成型
- 作者：Chong D. Y. R.;Lim B. K.;Rebibis K. J.;Pan S. J.;Sivalingam K.;Kapoor R.;Sun A. Y. S.;Tan H. B.
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第4期
2.A Time-Domain Approach for Extracting Broadband Macro- π Models of Differential Via Holes

机译：一种时域方法提取差分过孔的宽带宏π模型
- 作者：Chen-Chao Wang;Chih-Wen Kuo;Chun-Chih Kuo;Tzong-Lin Wu
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第4期
3.Design and Characterization of Purely Textile Patch Antennas

机译：纯纺织贴片天线的设计与表征
- 作者：Locher I.;Klemm M.;Kirstein T.;Trster G.
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第4期
4.Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon Bondability

机译：铬-金和钛-氮化钛-铂-金金属化对导线/碳带键合性的影响
- 作者：Jianbiao Pan;Pafchek R. M.;Judd F. F.;Baxter J. B.
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第4期
- Auger electron spectroscopy;
- adhesion;
- annealing;
- chromium;
- gold;
- lead bonding;
- metallisation;
- platinum;
- titanium;
- titanium alloys;
- 25.4 micron;
- Auger electron spectroscopy;
- Cr-Au;
- Cr-Au metallization systems;
- Ti-TiN-Pt-Au;
- Ti-TiN-Pt-Au metallization systems;
- annealing;
5.A Fully Embedded 60-GHz Novel BPF for LTCC System-in-Package Applications

机译：用于LTCC封装系统应用的全嵌入式60 GHz新型BPF
- 作者：Young Chul Lee;Chul Soon Park
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第4期
6.Advanced Acoustic Microimaging Using Sparse Signal Representation for the Evaluation of Microelectronic Packages

机译：使用稀疏信号表示的高级声学微成像技术用于微电子封装的评估
- 作者：Guang-Ming Zhang;David Mark Harvey;Derek R. Braden
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第2期
7.Bumpless Interconnect Through Ultrafine Cu Electrodes by Means of Surface-Activated Bonding (SAB) Method

机译：通过表面活化键合（SAB）方法通过超细铜电极实现无凸点互连
- 作者：Akitsu Shigetou;Toshihiro Itoh;Mie Matsuo;Nobuo Hayasaka;Katsuya Okumura;Tadatomo Suga
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第2期
8.Cost-Effective Chip-On-Heat Sink Leadframe Package for 800-Mb/s/Lead Applications

机译：具有成本效益的散热片式引线框封装，适用于800 Mb / s /铅的应用
- 作者：Nansen Chen;Hongchin Lin;Jeng-Yuan Lai
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第2期
9.Signal Integrity Characterization of Microwave XFP ASIC BGA Package Realized on Low-K Liquid Crystal Polymer (LCP) Substrate

机译：低K液晶聚合物（LCP）基板上实现的微波XFP ASIC BGA封装的信号完整性表征
- 作者：Farhang Yazdani
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第2期
10.Numerical Analysis on Compliance and Electrical Behavior of Multi-Copper-Column Flip-Chip Interconnects for Wafer-Level Packaging

机译：晶圆级封装的多铜柱倒装芯片互连符合性和电气性能的数值分析
- 作者：E. B. Liao;Andrew A. O. Tay;Simon S. Ang;H. H. Feng;R. Nagarajan;V. Kripesh
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第2期
- Compliance;
- Electrical parasitic;
- Flip-chip;
- Multi-copper-column interconnect;
- Wafer-level packaging;
11.Silicon Micromachining of High Aspect Ratio, High-Density Through-Wafer Electrical Interconnects for 3-D Multichip Packaging

机译：用于3D多芯片封装的高纵横比，高密度晶圆间电互连的硅微加工
- 作者：Zheyao Wang;Lianwei Wang;N. T. Nguyen;Wim A. H. Wien;Hugo Schellevis;Pasqualina M. Sarro;Joachim N. Burghartz
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
12.Fluxless Flip-Chip Solder Joint Fabrication Using Electroplated Sn-Rich Sn-Au Structures

机译：电镀锡富锡锡金结构的无助焊剂倒装芯片焊点制造
- 作者：Jongsung Kim;Dongwook Kim;Chin C. Lee
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
- Au;
- AuSn{sub}4 intermetallics;
- Cr;
- Electroplating;
- Fluxless flip-chip bonding;
- Sn;
13.Modeling and Measurement of Simultaneous Switching Noise Coupling Through Signal Via Transition

机译：通过过渡信号同时进行开关噪声耦合的建模和测量
- 作者：Jongbae Park;Hyungsoo Kim;Youchul Jeong;Jingook Kim;Jun So Pak;Dong Gun Kam;Joungho Kim
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
14.Hybrid TIE/FDTD Method for Open Boundary Coupling Between Isolation Islands

机译：隔离岛之间开放边界耦合的TIE / FDTD混合方法
- 作者：Chun-Te Wu;Yi-Hsin Pang;Ruey-Beei Wu
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
- Finite-difference time-domain (FDTD);
- Integral equation formulation;
- Power islands;
- Signal integrity;
15.Modeling of Striplines Between a Power and a Ground Plane

机译：电源和地平面之间的带状线建模
- 作者：A. Ege Engin;Werner John;Grit Sommer;Wolfgang Mathis;Herbert Reichl
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
- Mode conversion;
- Nonideal power/ground planes;
- Return path discontinuity;
- Stripline;
16.Noise Reduction Using Compensation Capacitance for Bend Discontinuities of Differential Transmission Lines

机译：使用补偿电容降低差分传输线弯曲不连续性的噪声
- 作者：Guang-Hwa Shiue;Wei-Da Guo;Chien-Min Lin;Ruey-Beei Wu
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
17.Room-Temperature Microfluidics Packaging Using Sequential Plasma Activation Process

机译：使用顺序等离子体激活过程的室温微流体包装
- 作者：M. M. R. Howlader;S. Suehara;H. Takagi;T. H. Kim;R. Maeda;T. Suga
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
18.Parallel Optical Transmitter Module Using Angled Fibers and a V-Grooved Silicon Optical Bench for VCSEL Array

机译：VCSEL阵列使用成角度的光纤和V型槽硅光学平台的并行光学发射器模块
- 作者：Sung Hwan Hwang;Dae Dong Seo;Jae Yong An;Myeong-Hyun Kim;Woo Chang Choi;Sung Ryul Cho;Sang Hwan Lee;Hyo-Hoon Park;Han Seo Cho
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
19.The Effect of Different Bonding Temperatures on the Mechanical and Electrical Performance of NCF-Bonded Flip-Chip-on-Flex Packages

机译：不同键合温度对NCF键合柔性倒装芯片封装的机械和电气性能的影响
- 作者：S. C. Tan;Y. C. Chan;Nelson S. M. Lui
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
- Contact resistance;
- Nonconducting film;
- Peel strength;
20.Package Design and Materials Selection Optimization for Overmolded Flip Chip Packaging

机译：包覆成型倒装芯片封装的包装设计和材料选择优化
- 作者：Yaomin Lin;Frank G. Shi
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2006年第3期
- Finite-element methods;
- Flip chip;
- Interfacial stress;
- Overmolded package;
- Parametric study;
21.Wavelength-Tunable Laser Module Using Low-Temperature Cofired Ceramic Substrates

机译：使用低温共烧陶瓷基板的波长可调激光模块
- 作者：Veli Heikkinen;Janne Aikio;Teemu Alajoki;Kari Kautio;Jyrki Ollila;Pentti Karioja
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
22.High Electromagnetic Shielding of Plastic Package for 2.5-Gb/s Optical Transceiver Modules

机译：用于2.5 Gb / s光学收发器模块的塑料封装的高电磁屏蔽
- 作者：Tzong-Lin Wu;Cheng-Wei Lin;Wen-Chi Hung;Chien-Hui Lee;Wern-Shiarng Jou;Wood-Hi Cheng
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
23.Modeling and Sensitivity Analysis of Circuit Parameters for Flip-Chip Interconnects Using Neural Networks

机译：倒装芯片互连电路参数的神经网络建模和灵敏度分析
- 作者：Rana J. Pratap;Daniela Staiculescu;Stephane Pinel;Joy Laskar;Gary S. May
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- Flip-chip bonding;
- Lumped element model;
- Neural network;
- Sensitivity analysis;
24.Microstructural Evolution of Lead-Free Sn-Bi-Ag-Cu SMT Joints During Aging

机译：无铅Sn-Bi-Ag-Cu SMT接头时效时的组织演变
- 作者：C. M. Lawrence Wu;Mingliang L. Huang
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- Aging;
- Fractography;
- Lead-free solder;
- Microstructural evolution;
- Sheaf strength;
- Sn-Bi-Ag-Cu;
25.Simulation and Sensitivity Analysis of Nonuniform Transmission Lines Using Integrated Congruence Transform

机译：集成同余变换的非均匀传输线仿真与灵敏度分析
- 作者：Emad Gad;Michel Nakhla
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
26.Extraction of ϵr(f) and tanδ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique

机译：使用短脉冲传播技术提取高达30 GHz的印刷电路板绝缘子的εr（f）和tanδ（f）
- 作者：Deutsch A.;Winkel T.-M.;Kopcsay G.V.;Surovic C.W.;Rubin B.J.;Katopis G.A.;Chamberlin B.J.;Krabbenhoft R.S.
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
27.CAD Flows for Chip-Package Coverification

机译：用于芯片封装覆盖的CAD流程
- 作者：Ambrish K. Varma;Paul D. Franzon
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- Chip package codesign;
- Computer-aided design;
- Design automation;
- Multichip modules (MCMs);
- System in package (SIP);
28.Compact Packaging of Optical and Electronic Components for On-Board Optical Interconnects

机译：用于板载光学互连的光学和电子组件的紧凑包装
- 作者：Han Seo Cho;Kun-Mo Chu;Saekyoung Kang;Sung Hwan Hwang;Byung Sup Rho;Weon Hyo Kim;Joon-Sung Kim;Jang-Joo Kim;Hyo-Hoon Park
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- Flip-chip devices;
- Hybrid integrated circuit bonding;
- Indium;
- Optical coupling;
- Optical interconnections;
- Optical polymers;
- Packaging;
- Simulation;
29.Warpage-Induced Lithographic Limitations of FR-4 and the Need for Novel Board Materials for Future Micro via and Global Interconnect Needs

机译：FR-4的翘曲引起的光刻限制以及对未来的微通孔和全球互连需求的新型电路板材料的需求
- 作者：Sounak Banerji;P. Markondeya Raj;Swapan Bhattacharya;Rao R. Tummala
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- FR4;
- Global interconnects;
- High-density wiring;
- Misregistration;
- Printed wiring board (PWB);
- Routing;
- Warpage;
30.Extraction of Noise Current Signatures Using Wavelets in Packaged Digital Systems

机译：封装数字系统中使用小波提取噪声电流签名
- 作者：Rohan Mandrekar;Madhavan Swaminathan
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- Current signature;
- Signal denoising;
- Simultaneous switching noise;
- Switching current;
- Wavelets;
31.T-Rex, A Blade Packaging Architecture for Mainframe Servers

机译：T-Rex，一种用于大型机服务器的刀片式包装架构
- 作者：George A. Katopis;Wiren Dale Becker;Hubert H. Harrer
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
32.Reliability Issues of Low-Cost Overmolded Flip-Chip Packages

机译：低成本包覆成型倒装芯片封装的可靠性问题
- 作者：Yaomin Lin;Wenning Liu;Yifan Guo;Frank G. Shi
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- Critical stress;
- Finite-element (FE) methods;
- Flip-chip;
- Optimal package design;
- Overmolded package;
- Parametric study;
33.Analysis of RF MEMS Switch Packaging Process for Yield Improvement

机译：用于提高产量的RF MEMS开关封装工艺分析
- 作者：Lei L. Mercado;Shun-Meen Kuo;Tien-Yu (Tom) Lee;Russell Lee
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
34.A CAD Methodology and Tool for the Characterization of Wide On-Chip Buses

机译：用于表征大型片上总线的CAD方法和工具
- 作者：I. M. Elfadel;Alina Deutsch;Gerard V. Kopcsay;Barry J. Rubin;Howard H. Smith
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
35.DEPACT: Delay Extraction-Based Passive Compact Transmission-Line Macromodeling Algorithm

机译：摘要：基于延迟提取的无源紧凑型传输线宏建模算法
- 作者：Natalie M. Nakhla;Anestis Dounavis;Ramachandra Achar;Michel S. Nakhla
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
36.Extraction of /spl epsiv//sub r/(f) and tan/spl delta/(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique

机译：使用短脉冲传播技术提取高达30 GHz的印刷电路板绝缘子的/ spl epsiv // sub r /（f）和tan / spl delta /（f）
- 作者：Deutsch A.;Winkel T.-M.;Kopcsay G.V.;Surovic C.W.;Rubin B.J.;Katopis G.A.;Chamberlin B.J.;Krabbenhoft R.S.
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
37.Experimental Validation of Crosstalk Simulations for On-Chip Interconnects Using S-Parameters

机译：使用S参数进行片上互连的串扰仿真的实验验证
- 作者：Mauro J. Kobrinsky;Sourav Chakravarty;Dan Jiao;Michael C. Harmes;Scott List;Mohiuddin Mazumder
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第1期
- Interconnects;
- On-chip;
- S-parameters;
- Signal integrity;
- Validation;
38.Interfacial Microstructure and Strength of Lead-Free Sn-Zn-RE BGA Solder Bumps

机译：无铅Sn-Zn-RE BGA焊块的界面组织和强度
- 作者：C. M. T. Law;C. M. L. Wu;D. Q. Yu;M. Li;D. Z. Chi
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Ball grid array (BGA);
- BGA shear strength;
- Interfacial microstructure evolution;
- Sn-Zn-RE solder ball;
39.An Enhanced Transmission Line Model for Conductors With Arbitrary Cross Sections

机译：具有任意横截面的导体的增强型传输线模型
- 作者：Antonio Maffucci;Giovanni Miano;Fabio Villone
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Arbitrary cross sections;
- High-speed integrated circuits;
- Interconnects;
- Modeling;
- Radiation effects;
- Transmission lines;
40.Nitride-Based Flip-Chip ITO LEDs

机译：基于氮化物的倒装芯片ITO LED
- 作者：S. J. Chang;C. S. Chang;Y. K. Su;C. T. Lee;W. S. Chen;C. F. Shen;Y. P. Hsu;S. C. Shei;H. M. Lo
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Flip-chip;
- GaN;
- Indium-tin-oxide (ITO);
- Light-emitting diode (LED);
41.Laser-Induced Surface Activation of LTCC Materials for Chemical Metallization

机译：用于化学镀金属的LTCC材料的激光诱导表面活化
- 作者：K. Kordas;A. E. Pap;J. Saavalainen;H. Jantunen;P. Moilanen;E. Haapaniemi;S. Leppavuori
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Copper;
- Gold;
- Laser;
- Low-temperature cofired ceramic (LTCC);
- Metallization;
- Nanoparticle;
- Silver;
42.Influence of the Ground Line Position on the Signal Integrity of Product-Related Interconnects in the Frequency and Time Domain

机译：地线位置在频域和时域对产品相关互连的信号完整性的影响
- 作者：M. Faiez Ktata;Uwe Arz;Hartmut Grabinski;Helmut Fischer
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
43.Parametric Macromodels of Differential Drivers and Receivers

机译：差分驱动器和接收器的参数宏模型
- 作者：Igor S. Stievano;Ivan A. Maio;Flavio G. Canavero;Claudio Siviero
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
44.Optimal Chip-Package Codesign for High-Performance DSP

机译：高性能DSP的最佳芯片封装协同设计
- 作者：Pronita Mehrotra;Vikram Rao;Thomas M. Conte;Paul D. Franzon
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Chip-package codesign;
- Fast Fourier transform (FFT);
- Seamless high off-chip connectivity (SHOCC);
45.System-in-a-Package Integration of SAW RF Rx Filter Stacked on a Transceiver Chip

机译：收发器芯片上堆叠的SAW RF Rx滤波器的系统级集成
- 作者：Robert E. Jones;Chandra Ramiah;Telesphor Kamgaing;Suman K. Banerjee;Chi-Taou Tsai;Henry G. Hughes;Ananda P. De Silva;James Drye
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
46.Process and Design Analysis for Ultrafine-Pitched Wiresweep Elimination in Advanced Copper Heat Spreader BGA Package

机译：先进的铜散热器BGA封装中超细间距扫线消除工艺和设计分析
- 作者：Surasit Chungpaiboonpatana;Frank G. Shi
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Cold and hot test;
- Copper heat spreader;
- Loop design;
- Mold transfer time;
- Thermally enhanced ball grid array (BGA);
- Wiresweep;
47.Coupling Between Microstrip Lines With Finite Width Ground Plane Embedded in Thin-Film Circuits

机译：嵌入薄膜电路中具有有限宽度接地层的微带线之间的耦合
- 作者：George E. Ponchak;Edan Dalton;Manos M. Tentzeris;John Papapolymerou
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Coupling;
- Crosstalk;
- Finite-difference time domain (FDTD);
- Microstrip;
48.Coupling Between Differential Signals and the DC Power-Bus in Multilayer PCBs

机译：多层PCB中差分信号与DC电源总线之间的耦合
- 作者：Chen Wang;Marco Leone;James L. Drewniak;Antonio Orlandi
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Differential signaling;
- Power-bus noise;
- Signal imbalance;
- Signal integrity;
- Via transition;
49.Characterization of Flip-Chip Interconnects Up to Millimeter-Wave Frequencies Based on a Nondestructive In Situ Approach

机译：基于无损原位方法的高达毫米波频率的倒装芯片互连特性
- 作者：Ullrich R. Pfeiffer;Arun Chandrasekhar
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
50.Online-Offline Laser Ultrasonic Quality Inspection Tool for MultiLayer Ceramic Capacitors-Part II

机译：多层陶瓷电容器的在线-离线激光超声质量检测工具-第二部分
- 作者：Dathan S. Erdahl;I. Charles Ume
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Flex cracks;
- Inspection;
- Interferometry;
- Laser ultrasound;
- Multilayer ceramic capacitor;
- Vibration analysis;
51.Black-Box Modeling of Passive Systems by Rational Function Approximation

机译：通过有理函数逼近对无源系统进行黑匣子建模
- 作者：Rong Gao;Yidnekachew S. Mekonnen;Wendemagegnehu T. Beyene;Jose E. Schutt-Aine
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Chebyshev polynomials;
- Legendre;
- Orthogonal polynomials;
- Power series;
- Rational interpolation;
- Transfer function;
- Vandermonde matrix;
52.Wide-Band Characterization of Average Power Handling Capabilities of Some Microstrip Interconnects on Polyimide and Polyimide/GaAs Substrates

机译：聚酰亚胺和聚酰亚胺/ GaAs衬底上某些微带互连的平均功率处理能力的宽带表征
- 作者：Wen-Yan Yin;X. T. Dong
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
53.Thermoelectric-Powered Convective Cooling of Microprocessors

机译：微处理器的热电对流冷却
- 作者：Kazuaki Yazawa;Gary L. Solbrekken;Avram Bar-Cohen
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Energy efficient;
- Heat sink;
- Microprocessor;
- Optimization;
- Power regeneration;
- Thermoelectric;
54.The creation of compact thermal models of electronic components using model reduction

机译：使用模型归约法创建电子元件的紧凑型热模型
- 作者：Celo D.;Xiaoming Guo;Gunupudi P.K.;Khazaka R.;Walkey D.J.;Smy T.;Nakhla M.S.
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
55.An Efficient Algorithm for Sensitivity Analysis of Nonuniform Transmission Lines

机译：非均匀传输线灵敏度分析的高效算法
- 作者：Emad Gad;Michel Nakhla
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- High-speed interconnects;
- Model-order reduction;
- Nonuniform transmission lines;
- Sensitivity analysis;
56.A Novel Valveless Micropump With Electrohydrodynamic Enhancement for High Heat Flux Cooling

机译：新型无阀微型泵，具有电动流体动力学特性，可用于高热通量冷却
- 作者：Vishal Singhal;Suresh V. Garimella
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
- Electronics cooling;
- Induction electrohydrodynamics (EHD);
- Microchannels;
- Micropumps;
- Nozzle-diffuser action;
- Valveless pumping;
57.Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

机译：包含密集通孔的不规则形状的电源/接地平面构成的供电网络分析
- 作者：Heeseok Lee;Young-Seok Hong;Dong Gun Kam;Joungho Kim
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
58.Analysis and Suppression of SSN Noise Coupling Between Power/Ground Plane Cavities Through Cutouts in Multilayer Packages and PCBs

机译：通过多层封装和PCB中的切口分析和抑制电源/接地平面腔之间的SSN噪声耦合
- 作者：Junwoo Lee;Mihai Dragos Rotaru;Mahadevan K. Iyer;Hyungsoo Kim;Joungho Kim
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第2期
59.Three-Dimensional Packaging for Power Semiconductor Devices and Modules

机译：功率半导体器件和模块的三维包装
- 作者：Jesus N. Calata;John G. Bai;Xingsheng Liu;Sihua Wen;Guo-Quan Lu
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
60.An Analytical Model for Predicting the Underfill Flow Characteristics in Flip-Chip Encapsulation

机译：倒装芯片封装中底部填充流动特性的预测分析模型
- 作者：J. W. Wan;W. J. Zhang;D. J. Bergstrom
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Analytical model;
- Flip-chip package;
- Power-law constitutive equation;
- Surface tension;
- Underfill flow;
- Washburn model;
61.Architectural Implications and Process Development of 3-D VLSI Z-Axis Interconnects Using Through Silicon Vias

机译：使用硅通孔的3-D VLSI Z轴互连的体系结构含义和工艺开发
- 作者：Leonard W. Schaper;Susan L. Burkett
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
62.Design and Validation of a Power Supply Noise Reduction Technique

机译：一种电源降噪技术的设计与验证
- 作者：Gang Ji;Tawfik R. Arabi;Greg Taylor
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Capacitors;
- Decoupling of systems;
- Noise;
- Noise measurement;
63.Design and Fabrication of a Flip-Chip-on-Chip 3-D Packaging Structure With a Through-Silicon Via for Underfill Dispensing

机译：带硅通孔的倒装芯片3D封装结构的设计和制造，用于底部填充分配
- 作者：Y. K. Tsui;S. W. Ricky Lee
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
64.Experimental Wetting Dynamics Study of Eutectic and Lead-Free Solders With Various Fluxes, Isothermal Conditions, and Bond Pad Metallizations

机译：具有各种焊剂，等温条件和焊盘金属化的共晶和无铅焊料的实验润湿动力学研究
- 作者：Suk Chae Kang;Chunho Kim;Jennifer Muncy;Daniel F. Baldwin
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Electronics packaging;
- Eutectic solder;
- Experiments;
- Interconnect;
- Lead-free solder;
- Reflow process;
- Solder joint;
- Substrate pad finish;
- Wetting dynamics;
65.Polylithic Integration of Electrical and Optical Interconnect Technologies for Gigascale Fiber-to-the-Chip Communication

机译：用于千兆级光纤到芯片通信的电气和光学互连技术的多片集成
- 作者：Anthony V. Mule;Ricardo A. Villalaz;Paul Jayachandran Joseph;Azad Naeemi;Paul A. Kohl;Thomas K. Gaylord;James D. Meindl
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- High-speed interconnects;
- Integrated optics;
- Optical;
- Optical interconnects;
- Optoelectronic packaging;
- System level;
66.Toward a More Robust and Accurate CEM Fast Integral Equation Solver for IC Applications

机译：面向IC应用的更强大，更准确的CEM快速积分方程求解器
- 作者：Weng Cho Chew;Li Jun Jiang;Yun Hui Chu;Gong Li Wang;I-Ting Chiang;Yuancheng C. Pan;Jun Sheng Zhao
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
67.Sea of Leads Compliant I/O Interconnect Process Integration for the Ultimate Enabling of Chips With Low-k Interlayer Dielectrics

机译：符合Sea of Leads标准的I / O互连工艺集成，可最终实现具有低k层间电介质的芯片
- 作者：Muhannad S. Bakir;Bing Dang;Richard Emery;Gilroy Vandentop;Paul A. Kohl;James D. Meindl
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Compliant leads;
- Input/output (I/O);
- Interconnects;
- Low-k;
- Packaging;
68.Real Chip Size Three-Dimensional Stacked Package

机译：实际芯片尺寸三维堆叠式封装
- 作者：Takao Yamazaki;Yoshimichi Sogawa;Rieka Yoshino;Keiichiro Kata;Ichiro Hazeyama;Sakae Kitajo
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
69.Three-Dimensional System-in-Package Using Stacked Silicon Platform Technology

机译：使用堆叠式硅平台技术的三维系统级封装
- 作者：Vaidyanathan Kripesh;Seung Wook Yoon;V. P. Ganesh;Navas Khan;Mihai D. Rotaru;Wang Fang;Mahadevan K. Iyer
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
70.Dynamic Analysis of Flip-Chip Self-Alignment

机译：倒装芯片自对准的动态分析
- 作者：Hua Lu;Christopher Bailey
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Computer modeling;
- Coupled dynamic analysis;
- Flip-chip;
- Self-alignment;
71.Comprehensive Broad-Band Electromagnetic Modeling of On-Chip Interconnects With a Surface Discretization-Based Generalized PEEC Model

机译：基于表面离散化的广义PEEC模型的片上互连的全面宽带电磁建模
- 作者：Aosheng Rong;Andreas C. Cangellaris;Limin Dong
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Electromagnetic modeling;
- Interconnects;
- Partial element equivalent circuit (PEEC);
- Signal integrity;
72.Enhanced Cu/LCP Adhesion by Pre-Sputter Cleaning Prior to Cu Deposition

机译：通过在铜沉积之前进行预溅射清洗来增强Cu / LCP附着力
- 作者：M. M. R. Howlader;M. Iwashita;K. Nanbu;K. Saijo;T. Suga
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Adhesion;
- Deposition;
- Diffusion;
- Interfacial reaction;
- Liquid crystal polymer (LCP);
- Peel strength;
- Radio frequency (RF) plasma;
73.Design, Analysis, and Development of Novel Three-Dimensional Stacking WLCSP

机译：新型三维堆叠WLCSP的设计，分析和开发
- 作者：Chang-Ann Yuan;Cheng Nan Han;Ming-Chin Yew;Chan-Yen Chou;Kou-Ning Chiang
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Factorial analysis;
- Finite-element method;
- Three-dimensional (3-D) stacking;
- Wafer-level packaging;
74.Environmental Qualification Testing and Failure Analysis of Embedded Resistors

机译：嵌入式电阻器的环境鉴定测试和故障分析
- 作者：Lawrence John Salzano II;Chris Wilkinson;Peter A. Sandborn
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Embedded passives;
- Environmental testing;
- Integral passives;
- Laser trimming;
- Reliability;
- Resistors;
75.Optimization for Chip Stack in 3-D Packaging

机译：3-D封装中芯片堆叠的优化
- 作者：Kazumi Kara;Yohei Kurashima;Nobuaki Hashimoto;Kuniyasu Matsui;Yoshihide Matsuo;Ikuya Miyazawa;Tomonaga Kobayashi;Yoshihiko Yokoyama;Motohiko Fukazawa
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第3期
- Bonding;
- Multichip modules;
- Semiconductor device packaging;
- Wiring;
76.Dynamic Compact Thermal Models With Multiple Power Sources: Application to an Ultrathin Chip Stacking Technology

机译：具有多个电源的动态紧凑热模型：在超薄芯片堆叠技术中的应用
- 作者：Jordi Palacin;Marc Salleras;Josep Samitier;Santiago Marco
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Dynamic compact thermal models;
- Modeling;
- Thin electronics;
77.Effect of Plasma Treatment of Au-Ni-Cu Bond Pads on Process Windows of Au Wire Bonding

机译：等离子处理Au-Ni-Cu焊盘对Au引线键合工艺窗口的影响
- 作者：Yu Hin Chan;Jang-Kyo Kim;Deming Liu;Peter Chou Kee Liu;Yiu-Ming Cheung;Ming Wai Ng
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Au-Ni-Cu bond pad;
- Au wire bond;
- Plasma treatment;
- Process window;
- Surface energy;
78.A Micromachined Pirani Gauge With Dual Heat Sinks

机译：带有双散热器的微加工皮拉尼仪表
- 作者：Junseok Chae;Brian H. Stark;Khalil Najafi
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Microelectromechanical systems (MEMS);
- Packaging;
- Pirani gauge;
- Pressure sensor;
79.Actin-Based Molecular Motors for Cargo Transportation in Nanotechnology - Potentials and Challenges

机译：纳米技术中用于肌动蛋白的基于肌动蛋白的分子电动机-潜力和挑战
- 作者：Alf Mansson;Mark Sundberg;Richard Bunk;Martina Balaz;Ian A. Nicholls;Par Omling;Jonas O. Tegenfeldt;Sven Tagerad;Lars Montelius
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Electron beam lithography;
- In vitro motility;
- Mi-crofluidics;
- Molecular motor;
- Motor protein;
- Myosin;
- Nanoimprint;
80.Caged ATP - Fuel for Bionanodevices

机译：笼式ATP-Bionanodevices的燃料
- 作者：Di Wu;Robert Tucker;Henry Hess
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Active transport;
- Biomolecular motor;
- Bionano-technology;
- Caged adenosine 5'-triphosphate (ATP);
- Hybrid devices;
- Kinesin;
- Microfluidics;
- Microtubule;
- Motor protein;
- Power;
81.Evaluation of Cryopreserved Microtubules Immobilized in Microfluidic Channels for a Bead-Assay-Based Transportation System

机译：基于微珠测定的运输系统中固定在微流通道中的冷冻微管的评估
- 作者：Ryuji Yokokawa;Yumi Yoshida;Shoji Takeuchi;Takahide Kon;Kazuo Sutoh;Hiroyuki Fujita
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Cryopreservation;
- Kinesin;
- Micro total analysis systems (μTAS);
- Microtubule;
- Transport;
82.Localized Bonding Processes for Assembly and Packaging of Polymeric MEMS

机译：聚合物MEMS组装和封装的局部键合工艺
- 作者：Yu-Chuan Su;Liwei Lin
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Assembly;
- Bonding;
- Encapsulation;
- Localized heating;
- Microelectromechanical systems (MEMS);
- Packaging;
- Polymer;
83.Micro- and Nanofabrication Processes for Hybrid Synthetic and Biological System Fabrication

机译：用于混合合成和生物系统制造的微型和纳米制造工艺
- 作者：Vivek Verma;William O. Hancock;Jeffrey M. Catchmark
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Biocompatibility;
- Biological systems;
- Casein;
- Hybrid systems;
- Kinesin;
- Microfabrication;
- Microtubules;
- Nanofabrication;
- Polymethylmethacrylate (PMMA) lithography;
- Protein patterning;
84.Minimizing Switching Noise in a Power Distribution Network Using External Coupled Resistive Termination

机译：使用外部耦合电阻端接将配电网络中的开关噪声降至最低
- 作者：Tsun-Hsu Chang
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
85.Microfabricated Capped Channels for Biomolecular Motor-Based Transport

机译：用于生物分子基于马达的运输的超细覆盖通道
- 作者：Ying-Ming Huang;Maruti Uppalapati;William O. Hancock;Thomas N. Jackson
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Kinesin;
- Microfabrication;
- Microfluidics;
- Microtubule;
- Molecular motor;
86.RF Characterization and Modeling of Various Wire Bond Transitions

机译：各种线键合过渡的RF表征和建模
- 作者：JuHwan Lim;DaeHan Kwon;Jae-Sung Rieh;Soo-Won Kim;SungWoo Hwang
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Conductor-backed CPW;
- Coplanar waveguide (CPW);
- Electromagnetic simulation;
- Finite-ground CPW;
- Micro-strip;
- Modes;
- Wire bond;
87.Packaging of Bio-MEMS: Strategies, Technologies, and Applications

机译：生物微机电系统的包装：策略，技术和应用
- 作者：Thomas Velten;Hans Heinrich Ruf;David Barrow;Nikos Aspragathos;Panagiotis Lazarou;Erik Jung;Chantal Khan Malek;Martin Richter;Jurgen Kruckow;Martin Wackerle
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Biomicroelectromechanical systems (bio-MEMS);
- Bioaffinity;
- Biosensor;
- Gluing;
- Joining;
- Microsystems;
- Point-of-care testing;
- Wire-bonding;
88.Simulation of Lossy Package Transmission Lines Using Extracted Data From One-Port TDR Measurements and Nonphysical RLGC Models

机译：使用一端口TDR测量和非物理RLGC模型提取的数据对有损包裹传输线进行仿真
- 作者：Woopoung Kim;Madhavan Swaminathan
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
89.Wire-Bonding Process Monitoring Using Thermopile Temperature Sensor

机译：使用热电堆温度传感器的引线接合过程监控
- 作者：Shivesh Suman;Michael Gaitan;Yogendra Joshi;George G. Harman
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
90.Transfer of Metal MEMS Packages Using a Wafer-Level Solder Transfer Technique

机译：使用晶圆级焊料转移技术转移金属MEMS封装
- 作者：Warren C. Welch III;Junseok Chae;Khalil Najafi
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
91.Effects on Signal Integrity and Radiated Emission by Split Reference Plane on High-Speed Multilayer Printed Circuit Boards

机译：分割参考平面对高速多层印刷电路板信号完整性和辐射发射的影响
- 作者：Jingook Kim;Heeseok Lee;Joungho Kim
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Electromagnetic interference;
- Noise coupling;
- Signal integrity;
- Slotline;
- Split plane;
- Stitching capacitor;
92.A Time-Domain Surface Integral Technique for Mixed Electromagnetic and Circuit Simulation

机译：时域表面积分技术用于电磁和电路混合仿真
- 作者：Chuanyi Yang;Vikram Jandhyala
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
93.A Novel Inspection of Fiber Post-Weld-Shift in Butterfly Laser Module Packaging

机译：蝶形激光模块包装中光纤焊后移位的新型检查
- 作者：Yih-Tun Tseng;Hsin-Chin Sung
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Butterfly package;
- Fiber alignment shift;
- Mirror inspection;
- Post-weld-shift (PWS);
94.Analytical Modeling of Thermal Stresses in Plated Through Via (PTV) Structures

机译：镀通孔（PTV）结构中的热应力的解析模型
- 作者：Jin Ma;Jan K. Spelt
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Analytical model;
- Plated through via (PTV);
- Reliability;
- Thermal stress;
- Variational mechanics;
95.Density Factor Approach to Representing Impact of Die Power Maps on Thermal Management

机译：表示芯片功率图对热管理影响的密度因子方法
- 作者：Javier Torresola;Chia-Pin Chiu;Greg Chrysler;Dean Grannes;Ravi Mahajan;Ravi Prasher;Abhay Watwe
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Hotspots;
- Nonuniform heating;
- Package thermal resistances;
96.Kinesin-Driven Sorting Machine on Large-Scale Microtubule Arrays

机译：驱动器在大型微管阵列上的分选机
- 作者：Konrad J. Bohm;Janina Beeg;Gabriele Meyer zu Horste;Roland Stracke;Eberhard Unger
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Array;
- Biomotor;
- Kinesin;
- Laser tweezers;
- Microtubule;
- Molecular sorting;
- Transport;
97.Low-Cost Compact Spiral Inductor Resonator Filters for System-In-a-Package

机译：用于系统封装的低成本紧凑型螺旋电感器谐振滤波器
- 作者：Gye-An Lee;Mohamed A. Megahed;Franco De Flaviis
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Bandpass filters;
- Electromagnetic coupling;
- Embedded inductors;
- Embedded passives;
- Multilayer;
- Resonator filters;
98.Mathematical Model of Low-Temperature Wafer Bonding Under Medium Vacuum and its Application

机译：中真空下低温晶圆键合的数学模型及其应用
- 作者：Wei Bo Yu;Jun Wei;Cher Ming Tan;Guang Yu Huang
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Bond strength;
- Bonding mechanisms;
- Diffusion theory;
- Mathematical model;
- Wafer bonding;
99.Packaging Actomyosin-Based Biomolecular Motor-Driven Devices for Nanoactuator Applications

机译：包装基于肌动蛋白的生物分子马达驱动装置，用于纳米执行器应用
- 作者：Theresa J. Grove;Katherine A. Puckett;Nicolas M. Brunet;Goran Mihajlovic;Lori A. McFadden;Peng Xiong;Stephan von Molnar;Timothy S. Moerland;P. Bryant Chase
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
100.MOEMS Chip-Level Optical Fiber Interconnect

机译：MOEMS芯片级光纤互连
- 作者：Michael A. Deeds;Peter A. Sandborn
- 期刊名称：《IEEE Transactions on Advanced Packaging》 | 2005年第4期
- Fluxless;
- Hermetic;
- Indium solder;
- Microelectro-mechanical system (MEMS);
- Microoptoelectromechanical system (MOEMS);
- Optical fiber;
- Package;
- Reliability;

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