Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder

机译：由焊料选择的焊接堆的热电力行为的比较

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摘要

The following topics are dealt with: finite element analysis; solders; reliability; failure analysis; tin alloys; microsensors; electronics packaging; deformation; thermal expansion; printed circuits.

机译：处理以下主题：有限元分析;焊料;可靠性;故障分析;锡合金;微传感器;电子包装;形变;热膨胀;印刷电路。

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 》|2019年|475p|共6页
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Ramiro S. Vargas C; Viktor Gonda;
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原文格式 PDF
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中图分类 TP15-53;
关键词
Creep; Mathematical model; Strain; Load modeling; Lead; Stress;

机译：蠕变;数学模型;应变;负荷建模;铅;压力;

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专利

1. Evaluation of thermal-mechanical fatigue behavior for 62Sn-38Pb bulk solder [J] . X. S. Wang, Y. Q. Li, S. W. Yu Experimental Techniques . 2003 ,第2期

机译：62Sn-38Pb块状焊料的热机械疲劳行为评估
2. Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect [J] . Fan-Yi Ouyang, Wei-Cheng Jhu Journal of Applied Physics . 2013 ,第4期

机译：三维集成电路中无铅倒装芯片焊点与微凸点之间的热迁移行为比较：凸点高度效应
3. Comparison of Inelastic Behaviors of Lead-Free and Sn-Pb Solder Joints [J] . Hsin-Chun Tsai, Wen-Ren Jong, Hsiu-Tao Chang Journal of Reinforced Plastics and Composites . 2009 ,第19期

机译：无铅和Sn-Pb焊点非弹性行为的比较
4. Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder [C] . Ramiro S. Vargas C, Viktor Gonda International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2019

机译：比较受焊料选择影响的焊接叠层的热机械性能
5. Lumped parameter mathematical model of laser soldering process and comparison of different optical soldering technologies. [D] . Naveed, Syed Mukarram. 2002

机译：激光焊接过程的集总参数数学模型以及不同光学焊接技术的比较。
6. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响
7. Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers [O] . Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim 2019

机译：焊接聚合物复合物中还原剂含量对低熔点合金填料聚结和润湿行为的影响

Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder

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