首页> 外文会议>International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems >Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures
【24h】

Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures

机译:电阻电容器方法,用于在电子外壳内温湿度响应建模

获取原文
获取外文期刊封面目录资料

摘要

Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.
机译:水分是电子设备可靠性,功能和耐久性的重要因素。如今,建模工具已成为电子设计的一个组成部分,因为它们对于搜索湿度控制的最佳设计而言较低。 CFD和FEM由于其计算工作而非常耗时,因此希望具有诸如众所周知的电容器(RC)方法的方法,其更快并且具有较少的空间分辨率。本文涉及使用RC方法在非等温条件下模拟电子外壳内的耦合热量和水分运输的RC方法的开发。此后,将模拟结果与相应的实验进行了比较,以便验证发达的代码。基于与实验的比较,开发了一种新的配置RC模型,用于更准确的湿度预测。在通用中,新的RC模型的吸附和解吸机构包括作为集体电容,用于描述其两侧壁的表面。这种修改改善了与实验协议。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号