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International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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1.
Effect of Stress State on Fatigue Characterization of SAC305 Solder Joints
机译:
应力状态对SAC305焊点疲劳表征的影响
作者:
Abhishek Deshpande
;
Hannah Kaeser
;
Abhijit Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Soldering;
Stress;
Fatigue;
Loading;
Strain;
Copper;
Microelectronics;
2.
Simulation of Self-Heating of Printed Interconnects for Thermal Design
机译:
用于热设计印刷互连自加热的仿真
作者:
Daniel Bülz
;
Petra Streit
;
Roman Forke
;
Thomas Otto
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Conferences;
Microelectronics;
Micromechanical devices;
3.
New Method to Determine the Local Joule Heat Distribution in Fast Switching Devices
机译:
快速开关装置中局部焦耳热分布的新方法
作者:
Christian R?melsberger
;
Martin Hanke
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Bridge circuits;
Transient analysis;
Pulse width modulation;
Graphical models;
Distribution functions;
Layout;
Harmonic analysis;
4.
High Power Terminal Vibrational Analysis in Response to Experimental Qualification Results
机译:
高功率端子振动分析响应实验资格结果
作者:
Matt Packwood
;
Daohui Li
;
Xiang Li
;
Paul Mumby-Croft
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2019年
关键词:
Stress;
Load modeling;
Qualifications;
Vibrations;
Loading;
Testing;
Geometry;
5.
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications
机译:
Indap / GaAs HBT装置和手机应用阵列电热效应的组合Spice-Fem分析
作者:
Vincenzo dAlessandro
;
Antonio Pio Catalano
;
Lorenzo Codecasa
;
Brian Moser
;
Peter J. Zampardi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Gallium arsenide;
Thermal resistance;
Substrates;
Integrated circuit modeling;
Computational modeling;
Heterojunction bipolar transistors;
Performance evaluation;
6.
Vibration test and simulation of printed circuit board
机译:
印刷电路板的振动试验与仿真
作者:
F. Arabi
;
A. Gracia
;
J.-Y. Delétage
;
H. Frémont
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Vibrations;
Frequency measurement;
Numerical models;
Load modeling;
Acceleration;
Soldering;
Shape;
7.
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
机译:
板级焊料金属间强度测量使用迷你夏比冲击测试和有限元校准
作者:
Riet Labie
;
Frederic Duflos
;
Bart Vandevelde
;
Bart Allaert
;
Ralph Lauwaert
;
Geert Willems
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Stress;
Force;
Finite element analysis;
Strain;
Intermetallic;
Acceleration;
8.
3D-printing and wet metallization for uniaxial and multi-axial accelerometers
机译:
单轴和多轴加速度计的3D印刷和湿金属化
作者:
Valentina Zega
;
Caterina Credi
;
Marta Invernizzi
;
Roberto Bernasconi
;
Giacomo Langfelder
;
Alfredo Cigada
;
Luca Magagnin
;
Marinella Levi
;
Alberto Corigliano
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Accelerometers;
Fabrication;
Electrodes;
Mechanical sensors;
Micromechanical devices;
Springs;
9.
Design, modelling, and characterization of display compatible pMUT device
机译:
显示兼容PMUT设备的设计,建模和表征
作者:
C. H. Huang
;
H. Gao
;
G. B. Torri
;
S. Mao
;
Y. Jeong
;
D. Cheyns
;
V. Rochus
;
X. Rottenberg
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Acoustics;
Resonant frequency;
Acoustic measurements;
Frequency measurement;
Analytical models;
Mathematical model;
Metals;
10.
Measurement and simulation of MEMS dedicated to investigation of heat transfer at nanoscale
机译:
专用于纳米尺度传热研究的MEMS测量和仿真
作者:
Marcin Janicki
;
Piotr Pietrzak
;
Jedrzej Topilko
;
Piotr Zajac
;
Artur Sobczak
;
Grzegorz Jablonski
;
Pawel Janus
;
Piotr Prokaryn
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Resistors;
Temperature measurement;
Heating systems;
Micromechanical devices;
Resistance;
Current measurement;
Voltage measurement;
11.
Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
机译:
Cu / SiO2在电子封装中使用多尺度建模方法的互态特性
作者:
Zhen Cui
;
Xianping Chen
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Load modeling;
Loading;
Copper;
Substrates;
Adhesives;
Microelectronics;
Finite element analysis;
12.
Application of water activity-based theory for moisture diffusion in electronic packages using ANSYS
机译:
基于水处理的应用基于水分的应用湿气扩散在电子包装中使用ANSYS
作者:
Liangbiao Chen
;
Yong Liu
;
Xuejun Fan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Moisture;
Finite element analysis;
Numerical models;
Mathematical model;
Computational modeling;
Material properties;
Humidity;
13.
Wire pull FEA simulation comparison
机译:
电线拉动FEA仿真比较
作者:
Raj Sekar Sethu
;
Salil Hari Kulkami
;
How Ung Ha
;
Kok Heng Soon
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Wires;
Stress;
Gold;
Microelectronics;
Analytical models;
Strain;
14.
Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets
机译:
非密封柜的热抗冷凝方法实验和CFD评价
作者:
Ilja Belov
;
Zahra Alavizadeh
;
Mats Lindgren
;
Jan Rydén
;
Peter Leisner
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Heating systems;
Surface treatment;
Humidity;
Plastics;
Electron tubes;
Temperature measurement;
Bars;
15.
Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor
机译:
使用压阻硅应力传感器对TQFP进行液体热冲击的TQFP的内应力状态
作者:
Alexandra Prisacaru
;
Yue Sun
;
Przemys?aw Jakub Gromala
;
Bongtae Han
;
Guo Qi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Stress;
Liquids;
Electric shock;
Compounds;
Delamination;
Reliability;
Piezoresistance;
16.
Effect of ultrasound agitation on the properties of copper electrodeposition in micro-via
机译:
超声搅拌对微通透铜电沉积性能的影响
作者:
Houya Wu
;
Yan Wang
;
Fuliang Wang
;
Wenhui Zhu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Filling;
Ultrasonic imaging;
Copper;
Ions;
Three-dimensional displays;
Packaging;
Additives;
17.
Kapitza resistance for nanoscale crystalline and amorphous silicon carbide
机译:
纳米级结晶和非晶碳化硅的Kapitza抗性
作者:
Chengdi Xiao
;
Hu He
;
Junhui Li
;
Wenhui Zhu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Resistance;
Couplings;
Silicon carbide;
Strain;
Heterojunctions;
Nanoscale devices;
Heating systems;
18.
Power map modeling in integrated circuits and power devices
机译:
集成电路和电力设备中的电源地图建模
作者:
Kunal Jain
;
Swati Saxena
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Heating systems;
Heat sinks;
Integrated circuit modeling;
Geometry;
Temperature;
Silicon;
19.
Failure analysis in power devices using lock-in infrared thermography
机译:
使用锁定红外热成像电源设备的故障分析
作者:
M. Vellvehi
;
X. Perpi?á
;
D. Sánchez
;
P. Fernández-Martínez
;
D. Flores
;
X. Jordà
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Heating systems;
Logic gates;
Temperature measurement;
Metals;
Leakage currents;
Temperature sensors;
Surges;
20.
Hardware implementation of LED forward voltage measurement for junction temperature estimation
机译:
结温估计的LED正向电压测量的硬件实现
作者:
Thomas Tetzlaff
;
Ulf Witkowski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Temperature measurement;
Light emitting diodes;
Current measurement;
Voltage measurement;
Junctions;
Hardware;
Semiconductor device measurement;
21.
Mechanistic model for the stress-strain response of double-layered PSA
机译:
双层PSA应力 - 应变反应的机理模型
作者:
H. Huang
;
A. Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Stress;
Strain;
Finite element analysis;
Substrates;
Bonding;
Deformable models;
Cavity resonators;
22.
Designing a 100 aF/nm capacitive transducer
机译:
设计100 AF / NM电容传感器
作者:
L. M. Middelburg
;
B. El Mansouri
;
R. H. Poelma
;
H. W. van Zeijl
;
J. Wei
;
G. Q. Zhang
;
W. D. van Driel
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Sensitivity;
Fingers;
Electrodes;
Substrates;
Mechanical sensors;
Mathematical model;
23.
Investigation of DELPHI-inspired compact thermal model for modeling planar transformer — Network concept
机译:
平面变压器模型德尔福灵敏热模型研究 - 网络概念
作者:
Valentin Bissuel
;
Eric Monier-Vinard
;
Abel Olivier
;
Brice Rogie
;
Arnaud Mahé
;
Najib Laraqi
;
Christophe Gougis
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Numerical models;
Windings;
Resistance;
Temperature measurement;
Copper;
Thermal conductivity;
Computational modeling;
24.
Board level drop reliability study and orthotropic PCB material property test methodology
机译:
板级降低可靠性研究和正交PCB材料性能测试方法
作者:
Jue Li
;
Pirkka Myllykoski
;
Cong Huang
;
Esa Hussa
;
Dongmin Hu
;
Dahe Kou
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Strain;
Load modeling;
Stress;
Material properties;
Computational modeling;
Iron;
Vibrometers;
25.
Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board
机译:
印刷电路板上无铅CSP组件的振动疲劳分析
作者:
Chinmay Nawghane
;
Bart Vandevelde
;
Riet Labie
;
Bart Allaert
;
Ralph Lauwaert
;
Filip Vanhee
;
Davy Pissoort
;
Ingrid De Wolf
;
Jan Mehner
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Vibrations;
Stress;
Soldering;
Harmonic analysis;
Acceleration;
Analytical models;
Finite element analysis;
26.
Mechanical reliability of microelectronics packaging: Small scale adhesion measurements and in-situ imaging
机译:
微电子包装机械可靠性:小规模粘附测量和原位成像
作者:
Emanuele Cattarinuzzi
;
Dario Gastaldi
;
Pasquale Vena
;
Fiorella Pozzobon
;
Lucrezia Guarino
;
Luca Cecchetto
;
Antonio Andreini
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Adhesives;
Microelectronics;
Imaging;
Packaging;
Delamination;
Plastics;
Mathematical model;
27.
Simulation of thermomechanical stress of a MEMS microphone
机译:
MEMS麦克风热机械应力的仿真
作者:
Hanna Ebbinghaus
;
Gregor Feiertag
;
Sebastian Walser
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Creep;
Mathematical model;
Microphones;
Micromechanical devices;
Temperature measurement;
Strain;
Sensitivity;
28.
Color maintenance prediction for LED-based products
机译:
基于LED的产品颜色维护预测
作者:
W. D. van Driel
;
J.G.J. Beijer
;
J.W. Bikker
;
C.H.M. van Blokland
;
C. Ankomah
;
B. Jacobs
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Color;
Light emitting diodes;
Optical reflection;
Aging;
Lighting;
Mathematical model;
Degradation;
29.
Flow induced hotspot migration studies with heat spreader integrated microchannels using reduced graphene oxide nanofluids
机译:
流量诱导热点迁移研究与散热器综合微通道使用氧化石墨烯纳米流体
作者:
G. Narendran
;
N. Gnanasekaran
;
D. Arumuga Perumal
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Microchannels;
Heating systems;
Fluids;
Heat sinks;
Heat transfer;
Mathematical model;
Nanofluidics;
30.
Method to predict lifetime of IGBT under power cycling based-on fast electro-thermo-mechanical model
机译:
基于快速电热热机械模型的功率循环下IGBT下预测IGBT寿命的方法
作者:
Maogong Jiang
;
Guicui Fu
;
Hongyan Leng
;
Bo Wan
;
Yu Cheng
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Insulated gate bipolar transistors;
Mathematical model;
Semiconductor device modeling;
Software packages;
Simulation;
Electronic packaging thermal management;
Predictive models;
31.
Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling
机译:
振动硅MEMS悬臂上的铝薄膜的低循环疲劳:高度加速应力测试和有限元建模
作者:
Georg M. Reuther
;
Reinhard Pufall
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Strain;
Electrical resistance measurement;
Temperature measurement;
Fatigue;
Aluminum;
Resistance;
Metallization;
32.
Application of FCM-ANFIS approach to model heat transfer and pressure drop of Titania-water nanofluids in the turbulent flow regime
机译:
FCM-ANFIS方法在湍流状态下二氧化钛纳米流体模型传热和压降的应用
作者:
Mehdi Mehrabi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Nanofluidics;
Correlation;
Data models;
Heat transfer;
Solid modeling;
Predictive models;
Fluids;
33.
Prognostics and health management: Current state-of-the-art for optimizing aircraft structural maintenance
机译:
预测和健康管理:最新的最先进,用于优化飞机结构维护
作者:
Christian Gogu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Maintenance engineering;
Inspection;
Monitoring;
Fatigue;
Safety;
Airplanes;
34.
On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
机译:
关于TSV分层风险依赖于TSV距离和硅晶型取向
作者:
J. Auersperg
;
J. Albrecht
;
S. Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Through-silicon vias;
Delamination;
Silicon;
Copper;
Crystals;
Strain;
Reliability;
35.
Data analytics approach for optimal qualification testing of electronic components
机译:
电子元件最优验证测试的数据分析方法
作者:
Stoyan Stoyanov
;
Mominul Ahsan
;
Chris Bailey
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Qualifications;
Data analysis;
Testing;
Data models;
Analytical models;
Predictive models;
Machine learning;
36.
3D hybrid bonding assembly studied by scanning thermal microscopy, resistive thermometry and Finite Element Modelling
机译:
通过扫描热显微镜,电阻温度和有限元建模研究的3D混合粘合组件
作者:
Axel Pic
;
Rafael Prffito
;
Sébastien Gallois-Garreignot
;
Jean-Philippe Colonna
;
Vincent Fiori
;
Pierre-Olivier Chapuis
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Temperature measurement;
Heating systems;
Thermal conductivity;
Semiconductor device measurement;
Resistance;
Electrical resistance measurement;
Pollution measurement;
37.
Experimental investigation and numerical modelling of the high cycle fatigue behaviour of a SnAgCu-solder alloy including temperature and mean stress effects
机译:
SNAGCU焊料合金高循环疲劳行为的实验研究及数值模型,包括温度和平均应力效应
作者:
Youssef Maniar
;
Georg Konstantin
;
Marta Kuczynska
;
Alexander Kabakchiev
;
Michael Guyenot
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Stress;
Strain;
Fatigue;
Temperature measurement;
Numerical models;
Plastics;
Force;
38.
Optimized 2D positioning of windings in inductive components by genetic algorithm
机译:
遗传算法优化了绕组绕组的2D定位
作者:
Andreas Rosskopf
;
Karsten Knoerzer
;
Eberhard Baer
;
Stefan Ehrlich
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Windings;
Finite element analysis;
Topology;
Coils;
Two dimensional displays;
Integrated circuit modeling;
Geometry;
39.
Extending the performance of high heat flux 2.5D and 3D packaging from component-system interaction
机译:
从组件 - 系统交互扩展高热通量2.5D和3D包装的性能
作者:
Gamal Refai-Ahmed
;
Hoa Do
;
Brian Philofsky
;
Jason Strader
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Heat sinks;
Temperature measurement;
Numerical models;
Thermal management;
Integrated circuits;
Atmospheric modeling;
Surface resistance;
40.
Modeling the influence of mold compound and temperature profile on board level reliability of single die QFN packages
机译:
模塑模具化合物和温度曲线对单芯QFN封装底座可靠性的影响
作者:
Maxim Serebreni
;
Patrick McCluskey
;
Tyler Ferris
;
Gil Sharon
;
Nathan Blattau
;
Craig Hillman
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Compounds;
Fatigue;
Temperature;
Temperature dependence;
Mathematical model;
Soldering;
Electronic packaging thermal management;
41.
A mechanistic model for the life of solder joints under realistic long-term service conditions
机译:
现实长期服务条件下焊点寿命的机制模型
作者:
P. Borgesen
;
L. Wentlent
;
T. Alghoul
;
S. Joshi
;
R. Sivasubramony
;
M. Yadav
;
S. Thekkut
;
J. L. Then Cuevas
;
L. E. Alvarez
;
C. Greene
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Stress;
Vibrations;
Soldering;
Life estimation;
Strain;
Fatigue;
Market research;
42.
Modeling reaction front propagation of intermetallic compounds by using isogeometric analysis
机译:
用异构术分析模拟金属间化合物的反应前繁殖
作者:
A. Morozov
;
A. Freidin
;
W.H. Müller
;
T. Hauck
;
I. Schmadlak
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Intermetallic;
Stress;
Chemicals;
Strain;
Mathematical model;
Copper;
Microelectronics;
43.
Automation of electro-thermal simulations based on thermal conductivity optimization
机译:
基于导热率优化的电热模拟自动化
作者:
A. Datsuk
;
M. Kaynak
;
T. Krupkina
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Integrated circuit modeling;
Conductivity;
Temperature measurement;
Silicon;
Thermal conductivity;
Heterojunction bipolar transistors;
Computational modeling;
44.
On the applicability of single-layer integrated microchannel cooling in 3D ICs
机译:
关于3D IC中单层集成微通道冷却的适用性
作者:
Piotr Zaj?c
;
Marcin Janicki
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Cooling;
Microchannels;
Three-dimensional displays;
Silicon;
Through-silicon vias;
Fluids;
45.
Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
机译:
故意释放弹性能量的鲁棒包装设计,以避免界面裂纹传播
作者:
Reinhard Pufall
;
Michael Goroll
;
Georg M. Reuther
;
Nadine Pflügler
;
Dominik Udiljak
;
Rainer Dudek
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Delamination;
Adhesives;
Acoustics;
Microscopy;
Cooling;
Microelectronics;
Micromechanical devices;
46.
Simulation and characterization of a high-sensitive micro-opto-mechanical Microphone
机译:
高敏微光机械麦克风的仿真与表征
作者:
H. Gao
;
C. H. Huang
;
W. Westerveld
;
R. Haouari
;
B. Troia
;
F. Verhaegen
;
R. Jansen
;
B. Figeys
;
X. Rottenberg
;
V. Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Optical sensors;
Microphones;
Integrated circuit modeling;
Frequency measurement;
Resonant frequency;
Optical device fabrication;
Sensitivity;
47.
Perspectives of water effects in polymers through molecular dynamics
机译:
聚合物通过分子动力学的水量效应的透视
作者:
Nancy Iwamoto
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Plastics;
Moisture;
Copper;
Water;
Substrates;
Adhesives;
Market research;
48.
Advanced risk analysis of interface delamination in semiconductor packages: A novel experimental approach to calibrating cohesive zone elements for finite element modelling
机译:
半导体封装中界面分层的先进风险分析:一种校准有限元建模粘性区元素的新试验方法
作者:
Nadine Pflügler
;
Georg M. Reuther
;
Michael Goroll
;
Dominik Udiljak
;
Reinhard Pufall
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Load modeling;
Adaptation models;
Delamination;
Calibration;
Loading;
Strain;
Finite element analysis;
49.
Four-point-bending experiments on multilayer ceramic capacitors: Microstructural details on crack initiation and propagation
机译:
多层陶瓷电容器的四分弯曲实验:裂纹启动和传播的微观结构细节
作者:
Joseph Al Ahmar
;
Erik Wiss
;
Steffen Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Capacitors;
Nonhomogeneous media;
Ceramics;
Flexible printed circuits;
Metallization;
Stress;
Standards;
50.
Atomic level prediction of thermal conductivity of metallic materials in IC packaging
机译:
IC包装中金属材料导热率的原子水平预测
作者:
Guang Zheng
;
Hu He
;
Wenhui Zhu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Conductivity;
Thermal conductivity;
Phonons;
Heating systems;
Slabs;
Gold;
51.
Coupled thermo-mechanical analysis of mass reduced silicon micromirrors
机译:
耦合热机械分析质量减少硅微镜
作者:
Harris J. Hall
;
Jason Schmidt
;
LaVern Starman
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Geometry;
Mirrors;
Solids;
Optical diffraction;
Optical films;
Heating systems;
Silicon;
52.
CFD-based iterative methodology for modeling natural convection in microelectronic packages
机译:
基于CFD的微电子包装自然对流的基于CFD的迭代方法
作者:
Mamadou Kabirou Toure
;
Papa Momar Souare
;
Stephanie Allard
;
Benoit Foisy
;
Eric Duchesne
;
Julien Sylvestre
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Convection;
Temperature measurement;
Numerical models;
Computational fluid dynamics;
Computational modeling;
Solids;
Microelectronics;
53.
Lift off reliability model for aluminum and copper wire bonds
机译:
提升铝和铜线键合的可靠性模型
作者:
M. Guyenot
;
Y. Maniar
;
M. Reinold
;
M. Rittner
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Copper;
Aluminum;
Wires;
Stress;
Reliability;
Geometry;
Metallization;
54.
Assessing the vibrational response and robustness of electronic systems by dissolving time and length scale
机译:
通过溶解时间和长度等级来评估电子系统的振动响应和鲁棒性
作者:
Thomas Schriefer
;
Maximilian Hofmann
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Mathematical model;
Vibrations;
Oscillators;
Damping;
Load modeling;
Stress;
Fatigue;
55.
On relation between parameters of cohesive zone model
机译:
凝聚区模型参数的关系
作者:
S. Ananiev
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Delamination;
Loading;
Adhesives;
Temperature measurement;
Analytical models;
Stress;
Limiting;
56.
Investigation of trapping behaviour in GaN HEMTs through physical TCAD simulation of capacitance voltage characteristics
机译:
通过物理TCAD仿真对电容电压特性捕获行为的研究
作者:
K. Mukherjee
;
A. Curutchet
;
F. Darracq
;
N. Malbert
;
N. Labat
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Logic gates;
Gallium nitride;
Aluminum gallium nitride;
Wide band gap semiconductors;
Capacitance-voltage characteristics;
Capacitance;
HEMTs;
57.
A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
机译:
集成LED灯的概率物理 - 故障可靠性评估方法
作者:
Bo Sun
;
Jiajie Fan
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Reliability;
Junctions;
LED lamps;
Light sources;
Temperature distribution;
Integrated circuit modeling;
58.
Study of EM thermal design in 1.2kV/600A IGBT module
机译:
1.2KV / 600A IGBT模块中的EM与热设计研究
作者:
Ying Dai
;
Xiang Li
;
Daohui Li
;
Fang Qi
;
Matthew Packwood
;
Haihui Luo
;
Guoyou Liu
;
Yangang Wang
;
Xiaoping Dai
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Insulated gate bipolar transistors;
Strain;
Substrates;
Integrated circuit modeling;
Temperature distribution;
Electronic packaging thermal management;
Inductance;
59.
Minimizing electro-mechanical shifts in IC applications
机译:
最小化IC应用中的机电换档
作者:
J. J. M. Zaal
;
A. Mavinkurve
;
Y. K. Liang
;
S. F. Chopin
;
E. Huynh
;
Y. Gao
;
A. Damian
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Stress;
Integrated circuit modeling;
Silicon;
Response surface methodology;
Microassembly;
60.
Electro-thermal behaviour using finite volume and Finite Element method
机译:
采用有限体积和有限元方法的电热行为
作者:
M. A. Bella
;
C. Bailey
;
H. Lu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Integrated circuit modeling;
Computational modeling;
Finite element analysis;
Heating systems;
Mathematical model;
Solid modeling;
Conductors;
61.
Reliability assessment of SiC power module stack based on thermo-structural analysis
机译:
基于热结构分析的SIC电源模块堆栈的可靠性评估
作者:
Alexey Sokolov
;
Chunlei Liu
;
Fabian Mohn
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Silicon carbide;
Reliability;
Bonding;
Strain;
Substrates;
Load modeling;
Plastics;
62.
FEM modelling of porosity in Ag sintering die attach for RF power applications
机译:
用于RF功率应用的AG烧结模具中孔隙率的有限元模拟
作者:
Jianlin Huang
;
Huib Scholten
;
Frank de Bruijn
;
An Xiao
;
Mario de Vaan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
elasticity;
finite element analysis;
microassembling;
porosity;
porous materials;
shear strength;
silver;
sintering;
tensile strength;
tensile testing;
voids (solid);
63.
BGA strip warpage induced by assembly process and the practical prediction methodology
机译:
由装配过程和实用预测方法引起的BGA条带翘曲
作者:
Roseanne Duca
;
Jing En Luan
;
Phone Maw Hla
;
Claudio Maria Villa
;
Marco Rovitto
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Substrates;
Semiconductor device modeling;
Compounds;
Market research;
Temperature measurement;
Polymers;
Strips;
64.
Simulation-based lifetime curve for a power module to extend parameter regime beyond testing limitations
机译:
基于模拟的电源模块的寿命曲线,以扩展超出测试限制的参数制度
作者:
Tatyana Kashko
;
Oliver Schilling
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Temperature distribution;
Reliability;
Temperature dependence;
Heating systems;
Testing;
Stress;
65.
Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
机译:
拉伸电子曲线轨道的寿命建模与几何优化
作者:
Arian Grams
;
Simon Kuttler
;
Thomas L?her
;
Hans Walter
;
Olaf Wittier
;
Klaus-Dieter Lang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Strain;
Load modeling;
Plastics;
Stress;
Copper;
Convergence;
Data models;
66.
Simulating object lists using neural networks in automotive radar
机译:
使用Automative Radar中的神经网络模拟对象列表
作者:
Alexander Suhre
;
Waqas Malik
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Neural networks;
Training;
Standards;
Automotive engineering;
Radar measurements;
Global Positioning System;
67.
Self-assembly of high performance on-chip RF-MEMS inductors using internal stress
机译:
使用内部应力的芯片高性能片上的高性能自组装
作者:
Rayan Bajwa
;
Murat Kaya Yapici
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Inductors;
Spirals;
Substrates;
Q-factor;
Resonant frequency;
Inductance;
Metals;
68.
Effect of temperature on vibration fatigue of SAC105 solder material after extended room temperature aging
机译:
温度对延伸室温老化后SAC105焊料振动疲劳的影响
作者:
D. Leslie
;
T. Heid
;
A. Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Strain;
Vibrations;
Fatigue;
Temperature measurement;
Temperature;
Aging;
Temperature dependence;
69.
LED 3D thermal model calibration against measurement
机译:
LED 3D热模型校准测量
作者:
Robin Bornoff
;
Gabor Farkas
;
Lajos Gaal
;
Marta Rencz
;
Andras Poppe
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Temperature measurement;
Solid modeling;
Calibration;
Semiconductor device measurement;
Thermal conductivity;
Light emitting diodes;
Thermal resistance;
70.
Study on layout optimization of multi-chip LED modules based on discrete element method
机译:
基于离散元素法的多芯片LED模块布局优化研究
作者:
Quan Xia
;
Yi Ren
;
Zili Wang
;
Bo Sun
;
Qiang Feng
;
Dezhen Yang
;
Cheng Qian
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Light emitting diodes;
Layout;
Optimization;
Temperature distribution;
Lighting;
Heating systems;
Mathematical model;
71.
Modelling the magnetic nanoparticle filling procedure of flow-through microchambers
机译:
模拟流通微型电池的磁性纳米粒子填充程序
作者:
Péter Pálovics
;
Márta Rencz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Mathematical model;
Magnetomechanical effects;
Stress;
Magnetic nanoparticles;
Neodymium;
Suspensions;
72.
A tunable THz wave modulator based on graphene
机译:
基于石墨烯的可调谐THz波调制器
作者:
Feng Zhang
;
Xian-Ping Chen
;
Qi-qin Wei
;
Li-Bo Yuan
;
Miao Cai
;
Huai-Yu Ye
;
Guo-Qi Zhang
;
Jing Xiao
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Graphene;
Modulation;
Reflection;
Bragg gratings;
Optical surface waves;
Silicon;
73.
Multi-scale modelling of internal failure mechanism of SiC power MOSFETs
机译:
SIC电源MOSFET内部故障机制的多尺度建模
作者:
Kai Zheng
;
Houcai Luo
;
Liming Wang
;
Chunjian Tan
;
Shaogang Wang
;
Huaiyu Ye
;
Xianping Chen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Silicon carbide;
MOSFET;
JFETs;
Integrated circuit modeling;
Voltage control;
Electrodes;
Electric fields;
74.
Explosion mechanism investigation of high power IGBT module
机译:
高功率IGBT模块的爆炸机制研究
作者:
Daohui Li
;
Fang Qi
;
Matthew Packwood
;
Ariiul Islam
;
Lee Coulbeck
;
Xiang Li
;
Yangang Wang
;
Haihui Luo
;
Xiaoping Dai
;
Guoyou Liu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Explosions;
Insulated gate bipolar transistors;
Force;
Three-dimensional displays;
Lorentz covariance;
Two dimensional displays;
Microelectronics;
75.
A thermo-mechanical fatigue damage modeling methodology for power semiconductor robustness validation studies
机译:
功率半导体鲁棒性验证研究的热机械疲劳损伤模型方法
作者:
Martin Springer
;
Heinz E. Pettermann
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Fatigue;
Load modeling;
Loading;
Degradation;
Finite element analysis;
Delamination;
Material properties;
76.
Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions
机译:
高温储存和温度循环条件下模塑化合物的热老化建模
作者:
Bingbing Zhang
;
Michael Johlitz
;
Alexander Lion
;
L. J. Ernst
;
K. M. B. Jansen
;
Duc-Khoi Vu
;
Laurens Weiss
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Aging;
High-temperature superconductors;
Temperature measurement;
Microelectronics;
Ovens;
Electronic packaging thermal management;
Compounds;
77.
Modeling of two-dimensional hyperbolic heat conduction in silicon-on-insulator transistor by equivalent RLC network
机译:
等效式RLC网络模拟绝缘体晶体管二维双曲热传导的建模
作者:
Amir Mirza Gheitaghy
;
Huaiyu Ye
;
Guo Qi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Heating systems;
Mathematical model;
Conductivity;
Nanoscale devices;
Heat transfer;
Transistors;
78.
Characterization of EMC/LF interfacial fracture toughness using the advanced mixed-mode bending method
机译:
使用先进的混合模式弯曲方法表征EMC / LF界面裂缝韧性
作者:
M. Schulz
;
H. S. Nabi
;
D.-K. Vu
;
B. Wunderle
;
J. Keller
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Electromagnetic compatibility;
Laser beam cutting;
Laser beams;
Copper;
Lead;
Finite element analysis;
Microelectronics;
79.
Thermodynamic analysis of SiO2 thickness's effect on TSV
机译:
SiO2厚度对TSV影响的热力学分析
作者:
Li Yanruoyue
;
Fu Guicui
;
Yan Xiaojun
;
Zhang Weifang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Through-silicon vias;
Stress;
Silicon;
Thermal stresses;
Reliability;
Three-dimensional displays;
80.
Microfluidics for the thermal control of Photonics Integrated Circuits
机译:
光子集成电路热控制的微流体
作者:
Jeff Punch
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Microelectronics;
Micromechanical devices;
Cooling;
Photonics;
Microfluidics;
Heat transfer;
Photonic integrated circuits;
81.
Thick AlCu-metal reliability characterization
机译:
厚的Alcu-Metal可靠性表征
作者:
Kirsten Weide-Zaage
;
Yuqi Tan
;
Verena Hein
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Stress;
Reliability;
Metallization;
Layout;
Electromigration;
Microelectronics;
82.
On the formation and propagation of laminate cracks and their influence on the fatigue lives of solder joints
机译:
关于层压裂缝的形成与繁殖及其对焊点疲劳寿命的影响
作者:
Andreas L?vberg
;
Per-Erik Tegehall
;
Saeed Akbari
;
Dag Andersson
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Soldering;
Laminates;
Stress;
Strain;
Lead;
Tin;
Fatigue;
83.
Determination of relevant material behavior for use in stretchable electronics
机译:
可拉伸电子器件中使用的相关材料行为的测定
作者:
H. Walter
;
A. Grams
;
M. Seckel
;
Th. L?her
;
O. Wittler
;
K. D. Lang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Strain;
Stress;
Material properties;
Biological system modeling;
Testing;
Mathematical model;
Load modeling;
84.
Study of cu wire crack under thermal cycling test
机译:
热循环试验下Cu线裂纹的研究
作者:
Haibo Fan
;
W W Chow
;
Fei Wong
;
Dashun Liu
;
Haibin Chen
;
Jingshen Wu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Wires;
Delamination;
Neck;
Electromagnetic compatibility;
Adhesives;
Compounds;
Strain;
85.
Parametric model order reduction of a thermoelectric generator for electrically active implants
机译:
用于电活性植入物的热电发电机的参数模型顺序减小
作者:
Cheng Dong Yuan
;
Onkar Sandip Jadhav
;
Evgenii B. Rudnyi
;
Dennis Hohlfeld
;
Tamara Bechtold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Heating systems;
Mathematical model;
Skin;
Legged locomotion;
Implants;
Muscles;
Generators;
86.
Development and characterization of MEMS membranes based on thin-film PZT actuators for microfluidic applications
机译:
基于微流体应用薄膜PZT致动器的MEMS膜的开发与表征
作者:
B. Neff
;
F. Casset
;
A. Millet
;
V. Agache
;
N. Verplanck
;
F. Boizot
;
S. Fanget
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Liquids;
Resonant frequency;
Microfluidics;
Micromechanical devices;
Finite element analysis;
Biomembranes;
Cavity resonators;
87.
Prediction of filling time in capillary-driven underfill process through 3D numerical analysis
机译:
通过3D数值分析预测毛细管驱动底部填充过程中的填充时间
作者:
Kanglun Wang
;
Yan Wang
;
Wenhui Zhu
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Mathematical model;
Filling;
Flip-chip devices;
Microelectronics;
Computational modeling;
Force;
Simulation;
88.
Lumen maintenance prediction for LEDs — New insights
机译:
LED的流明维护预测 - 新见解
作者:
B. Jacobs
;
W. D. van Driel
;
M. Schuld
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Light emitting diodes;
Degradation;
Mathematical model;
Maintenance engineering;
Temperature measurement;
Life estimation;
IEC Standards;
89.
CMUT with mechanically coupled plate actuators
机译:
CMUT与机械连接板致动器
作者:
Marcel Krenkel
;
Marco Kircher
;
Mario Kupnik
;
Sandro G. Koch
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Couplings;
Actuators;
Finite element analysis;
Electrodes;
Ultrasonic transducers;
Solid modeling;
Micromechanical devices;
90.
Resonance frequency dependency of Thermal Interface Materials (TIM) under vibration
机译:
振动下热界面材料(TIM)的共振频率依赖性
作者:
Emad A. Poshtan
;
C. Xingyuan
;
A. Roessle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Capacitors;
Resonant frequency;
Frequency measurement;
Vibrations;
Numerical models;
Delamination;
Young's modulus;
91.
Influence of cooling conditions on LED compact thermal model element values
机译:
冷却条件对LED紧凑型热模型元素值的影响
作者:
Tomasz Torzewicz
;
Marcin Janicki
;
Andrzej Napieralski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Temperature measurement;
Light emitting diodes;
Heating systems;
Optical variables measurement;
Convection;
Cold plates;
92.
Reliability analysis of encapsulated components in 3D-circuit board integration
机译:
3D电路板集成中封装组件的可靠性分析
作者:
R. Schwerz
;
M. Roellig
;
K.-J. Wolter
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Cavity resonators;
Reliability;
Stress;
Finite element analysis;
Transmission line matrix methods;
Load modeling;
Soldering;
93.
Simulation-based design of a micro fluidic transportation system for mobile applications based on ultrasonic actuation
机译:
基于超声致动的移动应用微流体运输系统模拟设计
作者:
M. Seidl
;
M. Gehring
;
U. Krumbein
;
G. Schrag
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Actuators;
Acoustics;
Microfluidics;
Finite element analysis;
Micromechanical devices;
Ultrasonic imaging;
Phased arrays;
94.
Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
机译:
硅薄溅射铜膜的热机械表征:朝向弹塑性,疲劳,亚临界骨折 - 机械数据
作者:
B. Wunderle
;
D. May
;
U. Zschenderlein
;
R. Ecke
;
M. Springborn
;
N. J?hrmann
;
K. A. Pareek
;
J. Heilmann
;
M. Stiebing
;
J. Arnold
;
R. Dudek
;
S. Schulz
;
M. J. Wolf
;
S. Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Copper;
Fatigue;
Films;
Silicon;
Crystals;
Testing;
95.
Peridynamic modelling of crack initiation and propagation in thermo-mechanically loaded electronic devices
机译:
热机械加载电子设备中裂纹启动和传播的王动态建模
作者:
Gábor Ladányi
;
Viktor Gonda
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Strain;
Heating systems;
Mathematical model;
Tensile stress;
Numerical models;
Load modeling;
96.
Modeling the effects of imposed current on the creep of SAC305 solder material
机译:
模拟施加电流对SAC305焊料蠕变的影响
作者:
Peter Varga
;
Andrew Rusinko
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Creep;
Current density;
Tensile stress;
Strain;
Steady-state;
Microelectronics;
Temperature measurement;
97.
A multiscale model of a two-dimensional micro-mirror array
机译:
二维微镜阵列的多尺度模型
作者:
Nguyen Nhat Binh Trinh
;
Michel Lenczner
;
Frédéric Zamkotsian
;
Nicolas Ratier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Mathematical model;
Mirrors;
Electrostatics;
Electrodes;
Structural beams;
Force;
Electric potential;
98.
The influence of thermal ageing on the flow-stress of copper traces on PCB's
机译:
热老化对PCB铜痕迹流量的影响
作者:
A. Yuile
;
S. Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Copper;
Annealing;
Strain;
Stress;
Standards;
Plastics;
Microelectronics;
99.
Heat haze effects in thermal chamber tensile tests on digital image correlation
机译:
热腔效应在热室拉伸试验中的数字图像相关性
作者:
A. Yuile
;
R. Schwerz
;
M. Roellig
;
R. Metasch
;
S. Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Fans;
Mathematical model;
Heating systems;
Atmospheric modeling;
Copper;
Temperature measurement;
Glass;
100.
Long-term thermal fatigue testing of solder joints and related fatigue life predictions
机译:
焊点的长期热疲劳试验及相关疲劳生活预测
作者:
Rainer Dudek
;
M. Hildebrandt
;
K. Krey?ig
;
S. Rzepka
;
M. Novak
;
W. Grübl
;
B. Schuck
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2018年
关键词:
Soldering;
Fatigue;
Reliability;
Creep;
Lead;
Ceramics;
Grain boundaries;
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