Explosion mechanism investigation of high power IGBT module

摘要

High power IGBT modules are crucial component in switching power electronic applications, such as renewable energy, traction, electrical vehicles. The IGBT module packages usually provide electromagnetic (EM) and chemical protection, mechanical support, heat dissipation, electrical connection for electrical components and interconnections [1]. 3.3kV/1500A IGBT module, with 190mm×140mm footprint, is one type of standard packages that have been vastly utilised in traction, industry applications for potential MW level system. There are different failure modes related to bonding wire, soldering layer, silicon chip, humidity, environment that affect long term reliability [2]. One of failures is module explosion during the operation in the filed or even at test bench. The high power module explosion can cause direct damages and huge influences to surrounding systems or even cause safety problems depending on its application scenario [1-3].