IGBT, POWER MODULE, POWER MODULE MANUFACTURING METHOD, AND POWER CONVERSION APPARATUS

摘要

There are two chances of detecting scratches on a rear surface of an IGBT chip, said chances being a time after the IGBT is completed, and a time after the IGBT chip is mounted on a circuit board. Even if inspection is performed after the IGBT chip is completed, since there are possibilities of generating scratches on the rear surface during a period from a time after the chip is inspected to a time when the chip is mounted on the circuit board, it is desirable to perform inspection also after the chip is mounted on the circuit board.The present invention detects a failure of an IGBT after the IGBT is mounted on the circuit board, and is capable of improving a power module assembly yield by providing the IGBT with a structure for electrically connecting a drift layer to the outside in a state wherein the gate is turned off.