SEMICONDUCTOR MODULE, POWER CONVERSION APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING POWER CONVERSION APPARATUS

摘要

Techniques disclosed herein improve the heat-dissipating performance of a semiconductor element provided on an insulating substrate. A semiconductor module related to the techniques disclosed herein is provided with: an insulating substrate having a conductor pattern on at least an upper surface thereof; at least one semiconductor element provided on an upper surface of the conductor pattern; a first bonding material provided in a part of a lower surface of the insulating substrate; and a metal film which has a thermal conductivity higher than that of the first bonding material, and which is provided in another part of the lower surface of the insulating substrate. The metal film is provided on the lower surface of the insulating substrate at a position corresponding to the position at which the semiconductor element is disposed.