首页> 外文会议>International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems >Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets
【24h】

Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets

机译:非密封柜的热抗冷凝方法实验和CFD评价

获取原文

摘要

Experimental evaluation of several active anti-condensation methods for application in non-hermetic electronics enclosures was performed in harsh climatic conditions, including RH = 70% and T = 43 °C. The studied methods included blowing the air along the exposed surface, combination of blowing and air heating as well as local heating of the exposed surface in natural convection conditions. The purpose was to prevent/remove the dew on/from the exposed surface of a micro-condensation sensor. The difference between the methods was quantified in terms of time for dew removal. The power consumption aspects were discussed. A CFD based optimization methodology was developed to determine the heating profiles for the local anti-condensation PCB heater in a non-hermetic cabinet exposed to the quickly changing climatic conditions. The potential for 60% energy savings was revealed by simulation.
机译:在恶劣的气候条件下进行多种活性抗缩小方法在非密封电子外壳中应用的实验评估,包括RH = 70℃和T = 43℃。所研究的方法包括沿着暴露的表面吹风,吹气和空气加热的组合以及在自然对流条件下的暴露表面的局部加热。目的是防止/从微冷凝传感器的暴露表面上移除露水。在露水时间方面定量了这些方法之间的差异。讨论了功耗方面。开发了基于CFD的优化方法,以确定暴露于迅速变化的气候条件的非密封柜中局部防冷凝PCB加热器的加热型材。模拟揭示了60 %能量节省的潜力。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号