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Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets

机译:非密封柜主动防冷凝方法的实验和CFD评估

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Experimental evaluation of several active anti-condensation methods for application in non-hermetic electronics enclosures was performed in harsh climatic conditions, including RH = 70% and T = 43 °C. The studied methods included blowing the air along the exposed surface, combination of blowing and air heating as well as local heating of the exposed surface in natural convection conditions. The purpose was to prevent/remove the dew on/from the exposed surface of a micro-condensation sensor. The difference between the methods was quantified in terms of time for dew removal. The power consumption aspects were discussed. A CFD based optimization methodology was developed to determine the heating profiles for the local anti-condensation PCB heater in a non-hermetic cabinet exposed to the quickly changing climatic conditions. The potential for 60% energy savings was revealed by simulation.
机译:在恶劣的气候条件下,包括RH = 70%和T = 43°C,对非密封电子设备外壳中使用的几种主动防冷凝方法进行了实验评估。研究的方法包括沿暴露表面吹送空气,结合吹气和空气加热以及在自然对流条件下对暴露表面进行局部加热。目的是防止/去除微冷凝传感器暴露表面上的露水。两种方法之间的差异以去除露水的时间进行了量化。讨论了功耗方面。开发了基于CFD的优化方法,以确定暴露于快速变化的气候条件的非密封柜中局部防冷凝PCB加热器的加热曲线。通过仿真揭示了60%节能的潜力。

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