Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board

摘要

This paper is aimed at researching the impact of vibrations on chip scale packages (CSPs) assembled on a printed circuit board (PCB) and exploring finite element technique to investigate PCB assembly under vibration load. Importance of experimental modal analysis and FE model validation with the help of modal analysis is presented in this paper. In contrast to previous studies, this study is focused on stress analysis of orthogonal and diagonal arrangement of CSPs on PCB and provides stress distribution for both. Stress distribution identifies the location of the critical solder joint and confirms that corner solder joint experiences highest stress levels as compared to other solder joints and are more prone to failure due to crack formation. Along with harmonic vibration loads, PCB assembly and FE model was also investigated under the influence of random vibration loads. Simulation results show a good correlation with experimental results and confirm that finite element method is a valid support for vibration analysis of electronic boards.