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Method for manufacturing printed circuit board, method for manufacturing printed circuit board assembly sheet, printed circuit board, and printed circuit board assembly sheet

机译:制造印刷电路板的方法,制造印刷电路板组件板的方法,印刷电路板和印刷电路板组件板

摘要

Base insulating layers are formed on a support substrate having a conductive property. The support substrate is etched, to form support substrate board and a plurality of conductive portions in a suspension board. The holding piece and the conductive portions constitute a shape determination unit. The conductive portions have first to fifth conductive portions. The third and fourth conductive portions are spaced apart from each other, and the fifth conductive portion is formed between the third and fourth conductive portions. The first and second conductive portions are respectively formed integrally with one end and the other end of the fifth conductive portion. It is determined whether the first and second conductive portions in the shape determination unit are connected electrically to each other. And it is determined whether the first and third conductive portions are connected electrically to each other.
机译:在具有导电性的支撑基板上形成基底绝缘层。蚀刻支撑基板,以在悬浮板上形成支撑基板和多个导电部分。保持片和导电部分构成形状确定单元。导电部分具有第一至第五导电部分。第三导电部分和第四导电部分彼此间隔开,并且第五导电部分形成在第三导电部分和第四导电部分之间。第一和第二导电部分分别与第五导电部分的一端和另一端一体形成。确定形状确定单元中的第一导电部分和第二导电部分是否彼此电连接。并且确定第一导电部分和第三导电部分是否彼此电连接。

著录项

  • 公开/公告号US8866020B2

    专利类型

  • 公开/公告日2014-10-21

    原文格式PDF

  • 申请/专利权人 JUN ISHII;

    申请/专利号US201113298741

  • 发明设计人 JUN ISHII;

    申请日2011-11-17

  • 分类号H05K1/00;H05K1/05;H05K1/02;H05K3/00;

  • 国家 US

  • 入库时间 2022-08-21 16:05:04

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