Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger

摘要

A Metal Core Printed Circuit Board with Micro Heat Exchanger(MHE MCPCB)was introduced for thermal management of high power LED.A comparative study was performed between 4 W/(m·K)regular MCPCB and this novel MCPCB to investigate the heat dissipation performance of this novel MCPCB.It was found that MHE MCPCB can obviously enhance the comprehensive optical properties of LED in comparison with 4 W/(m·K)regular MCPCB.Additionally,thermal contact resistance confining a dominant part of heat within the micro heat exchanger to achieve high efficient heat dissipation was proved.