首页>外文会议>International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)

International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)

召开年：2001
召开地：Tokyo(JP);Tokyo(JP);Tokyo(JP)
出版时间：-

会议文集：-

会议论文

热门论文

全部论文

全选（0）

1.Opto-electronic Hybrid Integration Technique using Planar Lightwave Circuit (PLC) Platform

机译：使用平面光波电路（PLC）平台的光电混合集成技术
- 作者：Yasufumi Yamada
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
2.SOP vs. SOC at Georgia Tech PRO

机译：Georgia Tech PRO的SOP与SOC
- 作者：Rao R. Tummala;Kenichi Shinotani;Venky Sundaram;Swapan Bhattacharya;George White;Fuhan Liu;P.M. Raj;Lixi Wan;Seock Hee Lee;D. Ravi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
3.A Greedy Router based on Maze Router and Genetic Algorithm

机译：基于迷宫路由器和遗传算法的贪婪路由器
- 作者：Akinori KANASUGI;Jin TAKAHASHI
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
4.A Study on the Thermal Fatigue Characteristics of Microelectronic Packaging Solder Joints

机译：微电子封装焊点的热疲劳特性研究
- 作者：Ma Jusheng;Wang Qian;Chen Guohai;Huang Le
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
5.Advanced Packaging Trends in Wireless Products

机译：无线产品的高级封装趋势
- 作者：E. Jan Vardaman;Doug Feicht
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
6.An Extremely Thin, BGA Format Chip Scale Package and Stacking

机译：极薄的BGA格式芯片级封装和堆叠
- 作者：Akito Yoshida;David Zoba;Choon-Heung Lee;Seon-Goo Lee;Young-Ho Kim;Sung-Su Park;Jin-Young Kim
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
7.Design and Manufacturing Factors of Micro-via Buildup Substrate Technologies

机译：微孔积层基板技术的设计和制造因素
- 作者：Yutaka Tsukada
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
8.Development of an Optical Active Connector for LAN

机译：局域网光有源连接器的开发
- 作者：Nobuyuki Tanaka;Noboru Iwasaki;Mitsuaki Yanagibashi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
9.Interface Microstructure of Sn-Zn-Bi Solder/Sn-10Pb Plating/Cu and High Temperature Stability

机译：Sn-Zn-Bi焊料/ Sn-10Pb镀层/ Cu的界面微观结构及高温稳定性
- 作者：Kim Young-Sun;Chi-Won Hwang;Katsuaki Suganuma
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
10.Metallurgical Reaction between Electroless Ni Metallized Al_2O_3 Substrate and Unleaded 42Sn-58Bi Solders during Annealing

机译：退火过程中化学镀镍金属Al_2O_3衬底与无铅42Sn-58Bi焊料之间的冶金反应
- 作者：Jenq-Gong Duh;Bi-Lian Young
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- under bump metallurgy;
- Sn-Bi solder;
- intermetallic compound;
- metallurgical reaction;
11.Method of Production of Semiconductor Packaging

机译：半导体封装的生产方法
- 作者：Atsushi Okuno;Noritaka Oyama
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
12.New Generation Silver Based Low Temperature Co-fired Ceramic (LTCC) System for Wireless Applications

机译：用于无线应用的新一代基于银的低温共烧陶瓷（LTCC）系统
- 作者：Liang Chai;Aziz Shaikh;Jim Henry;Vern Stygar
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
13.Opto-electronic Chip-on-film Packaging Technology Using Optical Waveguide Films with Low Coefficients of Thermal Expansion

机译：使用具有低热膨胀系数的光波导薄膜的光电薄膜封装技术
- 作者：Ishibashi Shigeki;Hirata Hirooki;Ishizawa Suzuko;Koshoubu Nobutatsu;Tsunetsugu Hideki;Takahara Hideyuki
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
14.Potential Application of SmSx Material in Microelectronics

机译：SmSx材料在微电子领域的潜在应用
- 作者：P.V. Miodushvesky
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
15.Preparation of Anodized Film on Metal Substrate

机译：在金属基底上制备阳极氧化膜
- 作者：Zhu Jiman;Liu Yudong;Ma Jusheng
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- insulated metal substrate;
- anodization;
- thermal shock resistivity;
16.The Performance and Dimension Control of Copper Alloy for Etching Applications

机译：蚀刻用铜合金的性能和尺寸控制
- 作者：Ma Jusheng;Huang Fuxiang;Huang Le;Lu Chao Ning Honglong;Han zhenyu;Xu Zhonghua
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
17.128Mbit NAND Flash Memory by Chip-on-Chip Technology with Cu Through Plug

机译：采用片上芯片技术的128Mbit NAND闪存，带铜直插
- 作者：Keiichi Sasaki;Mie Matsuo;Nobuo Hayasaka;Katsuya Okumura
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
18.A Placement Method Based on Boundary Method and Genetic Algorithm

机译：基于边界法和遗传算法的布局方法
- 作者：Akinori KANASUGI;Jin TAKAHASHI
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
19.A Study on the Relationships between Electrical Contact Resistance and Current Flow in Electrical Sliding Contact

机译：电滑动接触中电接触电阻与电流关系的研究
- 作者：Masanari TANIGUCHI;Hiroyuki ISHIDA;Tasuku TAKAGI
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
20.Cross-Sectional Analysis of Anisotropically Conductive Film Connection using Transmission Electron Microscopy and Finite Element Method

机译：透射电子显微镜和有限元方法对各向异性导电膜连接的截面分析
- 作者：Satoshi Tsuji;Katsuhiro Tsujimoto;Kosei Tanahashi;Hideyuki Nishida;Kotaro Kuroda;Hiroyasu Saka
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
21.Deification Kinetics of Glass Ceramics Substrate

机译：玻璃陶瓷基体的定型动力学
- 作者：Zhenyu Han;Jusheng Ma;Guangneng Zhang;Zhonghua Xu;Fuxiang Huang
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
22.Development of 3D-module

机译：3D模块的开发
- 作者：KoZo Sato;Kenzo Hatada;Hirofumi Takahashi;Tadahiro Higaki
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
23.Development of the MEMS Methodology to Micro Heat Sink

机译：微型散热器微机电系统方法学的发展
- 作者：Ming-Hsi Tseng;Heng-Chieh Chien;Chih-Yao Wang;Wen-Wang Ke
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
24.Drop-simulation of Electronic Boards Mounted with CSPs

机译：装有CSP的电子板的跌落仿真
- 作者：Ichiro HIRATA;Yuichi YOSHIDA;Ikushi MORISAKI
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- CSP;
- FEM;
- drop-simulation;
- drop-testing, implicit method, explicit method;
25.Dual Band Antenna Switch Modules with Bare SAW Chips Mounted on LTCC

机译：具有裸SAW芯片的双频段天线开关模块安装在LTCC上
- 作者：Fumio Uchikoba;Tomoyuki Goi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
26.Electroless Gold Plating Technology Using Ascorbic Acid as Reducing Agent

机译：以抗坏血酸为还原剂的化学镀金工艺
- 作者：Noriko Hattori;Katsushige Iwamatsu;Kaoru Naito;kazuyoshi Okuno;Yutaka Yazawa;Kenji Kuroiwa;Masaru Kato
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
27.Environmentally Friendly Printed Wiring Board (Glass-Epoxy Laminate) without Halogen-type and Phosphorus-type Flame Retardants

机译：不含卤素和磷型阻燃剂的环保印刷线路板（玻璃环氧层压板）
- 作者：Masatoshi Iji;Yukihiro Kiuchi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
28.Estimation of Fall Impact Strength for BGA Solder Joints

机译：BGA焊点跌落冲击强度的估算
- 作者：Takahiro SOGO;Satoru HARA
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
29.Excellent Reliability Epoxy Adhesive Sheet for High Density Substrate and New Halogen-free Alternative Material

机译：适用于高密度基材和新型无卤替代材料的出色可靠性环氧树脂胶粘片
- 作者：Nobuyuki Ogawa;Takeshi Horiuchi;Atsushi Takahashi;Takahiro Tanabe;Toshihisa Kumakura;Takayuki Suzuki
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
30.Fluxless Reflowing On SnAg And High-PbSn Solder Bumps

机译：SnAg和高PbSn焊料凸块上的无助焊剂回流
- 作者：Hirohisa MATSUKI;Hiroyuki MATSUI;Eiji WATANABE
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- bump reflow;
- bump forming;
- fluxless;
- carboxylic acid;
- void;
31.Influence of Sintering Atmosphere on LTCC/Cu

机译：烧结气氛对LTCC / Cu的影响
- 作者：Xu Zhonghua;Ma Jusheng;Wang Yonggan;Han Zhenyu;Huang Le
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
32.Influences of Epoxy Dielectrics on Seeding Surfaces Used in Build-Up Multilayers

机译：环氧树脂介电层对多层复合结构播种表面的影响
- 作者：Paavo Jalonen;Aulis Tuominen
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
33.Market Trends in Die Product/MCM Applications

机译：模具产品/ MCM应用的市场趋势
- 作者：Charles E. Bauer
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
34.Mechanical Properties of and a Life-time Simulation for Lead-free Solder

机译：无铅焊料的力学性能和寿命仿真
- 作者：Yukari KAGA;Masahiro ISHIBASHI;Ken-ichi OHGUCHI
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
35.Metal-graphite Composite Heat Spreaders having High Thermal Conductivity and Low Thermal Expansion Coefficient

机译：具有高导热率和低热膨胀系数的金属石墨复合散热器
- 作者：Chihiro Kawai;Yoshiyuki Hirose;Tadashi Tomikawa
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
36.Modified Pad Pattern for CPW Millimeterwave Flip chip

机译：CPW毫米波倒装芯片的改进焊盘图案
- 作者：Jin-Sung Kim;Hyun-Sik Park;Sung-Dae Lee;Yeon-Sik Chae;Young-Soon Yoon;Jin-Koo Rhee;Heog-Chul Kwon
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
37.New LTCC Package for Microwave Application

机译：用于微波应用的新型LTCC封装
- 作者：Masahiro Tomisako;Kodama Kazuyoshi;Toshiaki Shigeoka;Shinya Kawai;Yoshitake Terashi;Satoru Hamano;Katsuhiko Onitsuka
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
38.Preparation of Bimetallic Fine Au-Pd Particles by Aerosol Process

机译：气溶胶法制备双金属金-钯微粒
- 作者：Noritaka Iida;Hiroyuki Naito;Hironobu Ito;Kazutaka Nakayama;I. Wuled Lenggoro;Kikuo Okuyama
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
39.Research on the Flip-chip Applications of Advanced Non Conductive Past (ANCP)

机译：先进非导电胶（ANCP）倒装芯片应用研究
- 作者：Honma Yoshinobu;Osamu Suzuki;Haruyuki Yoshii;Satomi Kawamoto;Kenichi Suzuki
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
40.Super Thin Packages for 3-Dimensional Assembly

机译：用于3维组装的超薄封装
- 作者：Takashi Kurihara;Shigeru Mizuno;Kazuhiro Miyazawa;Seiji Sato;Michio Horiuchi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
41.The Vacuum Furnace for a Transparent Dielectric Layer

机译：透明电介质层用真空炉
- 作者：Masahiro Yokoe;Shin Ohno;Shinji Senda;Kazutaka Nakayama
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
42.Two-dimensional Array Layout for Low Power NMOS 4-phase Dynamic Logic

机译：低功耗NMOS 4相动态逻辑的二维阵列布局
- 作者：Makoto Furuie;Takao Onoye;Shuji Tsukiyama;Isao Shirakawa
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
43.Via-filling Using Copper Electroplating for Build-up Multilayer Board

机译：多层板使用铜电镀的通孔填充
- 作者：Shuhei Miura;Kuniaki Mihara;Tsukasa Fukushi;Hideo Honma
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
44.3-Dimension Measurement Sensor

机译：3维测量传感器
- 作者：Atsuro Tanuma;Kouji Ohmori;Kazuki Nagatsuka;Eiji Tsujimura;Takahisa Tashita;Hisao Hara
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
45.A Comparative Analysis of Lead Free Solder Bumping for Aluminum and Copper Metallized Wafers

机译：铝和铜金属化晶圆的无铅焊锡凸点比较分析
- 作者：Gautham Vishwanadam;Kripesh Vaidyanathan;Poi-Siong Teo;Lim;Sharon;Marvin Lo Chen Yang
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
46.A New Concept on Low Cost Plastic Packaging for GHz Devices

机译：用于GHz设备的低成本塑料包装的新概念
- 作者：Kiyotaka Seyama;Shunichi Kikuchi;Mikio Nishihara;Haruhiko Yamamoto;Fujitsu Limited
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
47.A Research on Conductive Mechanism of Conductive Channels in Thick Film Resistors

机译：厚膜电阻器中导电通道的导电机理研究
- 作者：Osamu TOYOIZUMI;Ikuo KANEKO
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
48.A Wafer Level Chip Size Package with a Printed Stress Compliant Layer

机译：具有印刷应力兼容层的晶圆级芯片尺寸封装
- 作者：Hiroshi Hozoji;Yoshihide Yamaguchi;Hiroyuki Tenmei;Shigeharu Tsunoda;Madoka Minagawa;Naoya Kanda;Yoshii Morishita;Toshiaki Tanaka;Yasuhiro Yano
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
49.Accelerated Moisture Sensitivity Test For Plastic IC Packages

机译：塑料IC封装的加速湿敏性测试
- 作者：E.H. Wong;R. Rajoo;T.B. Lim;K.H. Lee;S.W. Koh
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
50.Advances in Fast Underfill of Flip Chips

机译：倒装芯片快速底部填充的进展
- 作者：Alec J. Babiarz;Horatio Quinones
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
51.Applications of Newly Developed Positive Photosensitive Block Co-Polyimides to Microelectronic Packaging Processes

机译：新开发的正性光敏嵌段共聚酰亚胺在微电子封装工艺中的应用
- 作者：Shunichi Matsumoto;Xing Zhou Jin;Masataka Miyamura;Hirosi Itatani
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
52.Area-distributed I/O Pad Design

机译：区域分布的I / O焊盘设计
- 作者：Yu-Jung Huang;Ching-Mai Ko;Shen-Li Fu
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
53.BGA to CSP to Flip Chip ― Manufacturing Issues

机译：从BGA到CSP的倒装芯片制造问题
- 作者：Greg Caswell;Julian Partridge
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- ball grid array (BGA);
- chip scale package (CSP);
54.Characteristics of Sn-Ag-Cu Solder and Interfacial Reaction between Lead-free Metallization and Solder

机译：Sn-Ag-Cu焊料的特性及无铅金属与焊料的界面反应
- 作者：Masayuki Kitajima;Tadaaki Shono;Masakazu Takesue;Michiko Noguchi;Kazutoshi Yamazaki
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
55.CO_2 -Laser Copper Direct Drilling Technology for Printed Circuit Boards

机译：用于印刷电路板的CO_2-激光铜直接钻孔技术
- 作者：Kunio Arai
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
56.Comprehensive Analysis of BGA Block Warpage Induced after Post Mold Cure

机译：模后固化后BGA块翘曲的综合分析
- 作者：Tong Yan Tee;K. Sivakumar;Laurent Herard;Sung Yi;Lianxi Shen;Vora Mehul Mukund;Fei Su
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
57.Conductivity Model for Metal-coated Polymer Particles used in Anisotropically Conductive Adhesives

机译：各向异性导电胶中使用的金属包覆聚合物颗粒的电导率模型
- 作者：Jarmo Masttanen;Petteri Palm;Aulis Tuominen;Eero Ristolainen
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
58.Conventional Forced-air Cooling Scheme with Non-Conventional Approaches

机译：采用非常规方法的常规强制风冷方案
- 作者：David G. Wang;Keith Muller
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
59.Cost/Resource Saving Process for Scalable Film Optical Link Multi-chip-module (S-FOLM)

机译：可伸缩胶片光链路多芯片模块（S-FOLM）的成本/资源节省过程<具有选择性占领重复转移（SORT）的光刻包装（PL-Pack）>
- 作者：Tetsuzo Yoshimura;Koichi Kumai;Takashi Mikawa;Osamu Ibaragi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
60.Cure Behaviour and Interfacial Adhesion of a Photo-sensitive BCB

机译：光敏BCB的固化行为和界面粘合
- 作者：Chan Kai Chong;Cheong Chu Peng;Lee Guat Ngoh;Mary Teo
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
61.Determination of Specific Contact Resistance between Electrode and Resistor Material for Fabrication of Low Value Resistor

机译：低值电阻制造中电极与电阻材料的比接触电阻的确定
- 作者：Kiichi Kamimura;Shinsuke Okada;Masato Nakao;Yosiharu Onuma;Toshiyuki Sakuma;Hidemi Ohe
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
62.Development of Flip-Chip Mounting Process by Metallic Joint Which Uses Supersonic Ultrasonic Wave Energy

机译：利用超音速超声波能量的金属接头开发倒装芯片安装工艺
- 作者：Kazushi Higashi;Kazuya Ushirakawa;Kazuyuki Tomita
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- flip chip;
- ultrasonicwave;
- metallic joint;
63.Development of New Bend-Test Method: Bend-Testing for Varying Threshold of Mechanical Stress in Lead-Free Solder

机译：新的弯曲测试方法的发展：改变无铅焊料机械应力阈值的弯曲测试
- 作者：Yutaka TAKENAKA;Keiko SASAKI;Masao HIRANO
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
64.Development of stackable 0.5mm thickness FBGA Package

机译：开发可堆叠的0.5mm厚度FBGA封装
- 作者：Mitsuru Chino;Ken-ichi Tsuchihashi;Kenji Miyajima
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
65.Development of Technology for Probing Very Fine Pitch and Very Small Area

机译：极小间距极小面积探测技术的发展
- 作者：Michinobu Tanioka;Masahiro Sunohara;Tomotoshi Sato;Kenji Takahashi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- KGD;
- wafer probing test;
- electrical contact;
- silicon whisker probe;
66.Development of the Non-flux Solder Joint Technology

机译：无助焊剂技术的发展
- 作者：Ryoichi Okada;Ryota Kimura;Takeshi Hosomi;Shin-ichiro Ito
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
67.Diamond Package for 10Gbps EA Driver IC

机译：适用于10Gbps EA驱动器IC的钻石封装
- 作者：Satoshi Ooe;Yoshiyuki Yamamoto;Akihiro Nakamura;Tadashi Tomikawa;Takahiro Imai;Nobuo Shiga;Shosaku Yamanaka
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
68.Effect of Cooling Rates on Microstructures of Binary Sn-Ag Solder

机译：冷却速率对二元锡银焊料微结构的影响
- 作者：Taiki Kobayashi;Junichi Tanaka;Shigenari Hayashi;Toshiyuki Takashima;Toshio Narita
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- Pb-free solder;
- Sn-Ag;
- microsturcture;
- cooling rate;
- β -Sn;
69.Effect of Solder Mixture on Joint Reliability of Repaired Components

机译：焊锡混合物对修复后零件接头可靠性的影响
- 作者：Takashi Nakashima;Masashi Ogawa;Akira Yoshida;Hiroshi Matsubara
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
70.Environmentally Preferred Packaging: Pb-free Solders

机译：环保包装：无铅焊料
- 作者：D. R. Frear;J. N. Arnold;R. C. Pfahl
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
71.Evaluation on the Properties of Sn-Bi-Ag Solder with Low-Melting Point

机译：低熔点Sn-Bi-Ag焊料的性能评估
- 作者：Hanae Shimokawa;Tasao Soga;Tetsuya Nakatsuka;Koji Serizawa
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
72.Fabrication of Fine Line Patterns for Advanced Build-up Package

机译：细线图案的制造，用于高级组合包装
- 作者：Kazutaka Kobayashi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
73.From CSP to WLP

机译：从CSP到WLP
- 作者：Juergen Simon
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
74.Giga-π: A Low-cost and Compact Parallel Optical Link Module for Very Short Reach Interconnect

机译：Giga-π：低成本，紧凑的并行光链路模块，可实现非常短的互连
- 作者：Takeshi Sakamoto;Nobuyuki Tanaka;Naoya Kukutsu
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
75.High-Density Interconnection 3D Packaging Technology for CCD Micro-Camera System

机译：CCD微型相机系统的高密度互连3D封装技术
- 作者：Hiroshi YAMADA;Takashi TOGASAKI;Hajime SUDO
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
76.Influence of additional elements on wettability for Lead free solder of Sn-3.0Ag-0.5Cu

机译：Sn-3.0Ag-0.5Cu无铅焊料中添加元素对润湿性的影响
- 作者：Makoto MIYAZAKI;Kenichi OKI;Shigeo NOMURA;Toshiyasu TAKEI;Naoki KATAYAMA;Hiroyuki TANAKA;Masanobu AKANUMA
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
77.Layout Dependence of Radiated Emissions from Printed Circuit Boards

机译：印刷电路板辐射的布局依赖性
- 作者：Hideki Sasaki;Takashi Harada;Toshihide Kuriyama
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
78.Measurement Potential Swing by Electric Field on Package Transmission Lines

机译：包装传输线上电场测量的电位摆幅
- 作者：Kanji Otsuka;Toshiaki Matsumura;Tamotsu Usami;Yasuhiko Ohdate;Yoshihiko Ikemoto;Chihiro Ueda;Tadatomo Suga
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- transmission line;
- microstrip line;
- stacked pair line;
- high frequency pulse transmission;
- potential measurement;
- ground line swing;
79.Micro Bump Interconnections and Encapsulation Technologies on 3D Stacked LSI

机译：3D堆叠式LSI上的微凸点互连和封装技术
- 作者：Yoshihiro Tomita;Tadahiro Morifuji;Tatsuya Ando;Masamoto Tago;Ryoichi Kajiwara;Yoshihiko Nemoto;Tomonori Fujii;Tomotoshi Sato;Kenji Takahashi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
80.Microwave Glob-top and Flip-chip with GaAs MMICs for Space Applications

机译：带有GaAs MMIC的微波球形顶部和倒装芯片，适用于太空应用
- 作者：Claude DREVON;Philippe MONFRAIX;Sebastien GEORGE;Jean Louis CAZAUX
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
81.Microwave LTCC Technology Using Photo Patterned Conductors

机译：使用光图案化导体的微波LTCC技术
- 作者：Peter Barnwell;Michael Ehlert
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
82.Optimization of Black Oxide Coating on Copper Substrate

机译：铜基氧化黑膜的优化
- 作者：Jang-Kyo KIM;Mohamed LEBBAI;W.K. SZETO
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
83.Packaging Technology for Microprocessor

机译：微处理器封装技术
- 作者：Nobutaka SHIMIZU;Atsushi KIKUCHI;Masaru NUKIWA;Takumi IHARA;Makoto IIJIMA;Kazuyuki IMAMURA;Yasufumi YAMABE;Yasushi TOIDA;Masaharu MINAMIZAWA
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
84.Pb-free Thick Film Resistor Series Designed for Both LTCC System and 96 Al_2O_3 Substrate

机译：专为LTCC系统和96％Al_2O_3衬底设计的无铅厚膜电阻器系列
- 作者：Masashi Fukaya;Chiaki Higuchi
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
- Pb-free;
- LTCC;
- low thermal expansion resistor;
- SiO_2-B_2O_3-K_2O glass;
- and 850°C firing;
85.Selection and Evaluation of Materials for Future System-on-Package (SOP) Substrate

机译：未来封装系统（SOP）基板材料的选择和评估
- 作者：Ken-ichi Shinotani;Mancheol Seo;P. Markondeya Raj;Satoru Zama;Jicun Lu;Swapan Bhattacharya;Carl Zweben;George E. White;Rao R. Tummala
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
86.Solder Fatigue Reliability of Chip Scale Package for Double Sided Surface Mount

机译：双面表面贴装的芯片级封装的焊接疲劳可靠性
- 作者：Masazumi Amagai
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
87.Stacking Semiconductor Packages

机译：堆叠半导体封装
- 作者：Sei-ichi Denda;Tsutomu Otake;Yoshio Tezuka
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
88.Study of Blind Via Hole of Build-up PWB

机译：组合式PWB的盲孔研究
- 作者：Eiji Hirata;Tsutomu Minowa;Chihiro Simizutani;Yoshihisa Katou
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
89.Supply Current Test for Pin Opens in CMOS Logic Circuits

机译：CMOS逻辑电路中引脚开路的电源电流测试
- 作者：Masaki Hashizume;Akihiro Tsuji;Masahiro Ichimiya;Hiroyuki Yotsuyanagi;Takeomi Tamesada
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
90.The Hydrazine Reduced EN as the Alternative Process for Selective Deposition

机译：肼还原的EN作为选择性沉积的替代方法
- 作者：Katsuhiko Tashiro;Yuichi Takada;Kaoru Ishikawa;Hideo Honma
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
91.The Polymer Stud Grid Array (PSGA) Package: Test and Electrical Characterization for RF Applications

机译：聚合物螺柱网格阵列（PSGA）封装：RF应用的测试和电气特性
- 作者：Arun Chandrasekhar;Philip Pieters;Kristof Vaesen;Eric Beyne;Walter De Raedt;Bart Nauwelaers;Jef Van Puymbroeck
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
92.The Role of Soft Computing in Thermal Design of Compact Electronic Equipment

机译：软计算在紧凑型电子设备热设计中的作用
- 作者：Wataru Nakayama
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
93.Thermal Fatigue Behavior of CSP Solder Joints with Sn-Ag Lead-free Solders under Thermal Cycle Conditions

机译：热循环条件下具有Sn-Ag无铅焊料的CSP焊点的热疲劳行为
- 作者：Ikuo Shohji;Fuminari Mori;Shinichi Fujiuchi;Masaru Yamashita
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
94.Ultrasonic Flip-chip Bonding Technology Using Preformed Underfill-resin

机译：使用预制的底部填充树脂的超声波倒装芯片键合技术
- 作者：Michitaka Kimura;Toshihiro Iwasaki;Satoshi Yamada;Yasumichi Hatanaka;hirofumi Fujioka;Naoto Ueda
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年
95.Wafer Level Electroless Nickel/Gold ― Plating on Copper Pad Metallization A Solution for Wire Bonding and Flip Chip Technology

机译：晶圆级化学镀镍/金-在铜焊盘金属化上电镀-引线键合和倒装芯片技术解决方案
- 作者：Elke Zakel;Thorsten Teutsch
- 会议名称：《International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium)》 | 2001年