Excellent Reliability Epoxy Adhesive Sheet for High Density Substrate and New Halogen-free Alternative Material

摘要

The substrates of semiconductor packages require high wiring density and the highest reliability of all the printed wiring boards (PWBs). The interstitial via holes (IVHs) structure can be made with the build-up technology using laser or photo process. It is one of the major concerns to accomplish the high wiring density. We developed a high Tg and low coefficient of thermal expansion (CTE) epoxy adhesive sheet with copper foil for high density PWBs, and a new halogen-free alternative material. The substrate passed stringent tests, e.g. heat resistance and interconnection reliability in various connecting patterns. And these demonstrate good mounting capability, such as wire bonding and flip chip attachment, as a result of higher elastic modulus and less warpage in a high temperature range.