Development of 3D-module

摘要

The continuing demand for Mobile Information Terminal Tools to become smaller and lighter requires for electronic parts inside these mobile tools to also become smaller and lighter. In today's electronics, the area of the substrate itself is shrinking in size as well as the surface area for chip parts to be assembled on. For this reason, fine-pitched high density IC assembly is being focused. But high-density assembly has its limits, and will soon be needing a new technology. This is where our TZ-CSP (Tape Z-axis Chip Size Package) comes in. We have developed a new packaging method of simply stacking the chips on each other (multiply layered in Z-axis direction). The concept of the TZ-CSP was developed to have a wide variety of usage while being able to be assembled on reel to reel which enables high production yield and reduce costs. Although presently, we are working on multiple stacking with the same IC, our goal is to not only be able to stack same chips but also be able to stack a variety of ICs and chip parts into a single package.