The drive toward more compact and powerful electronic equipment poses enormous challenges in thermal management. Particularly difficult is the heat transfer analysis that becomes time consuming due to complexity of heat transfer paths in compact equipment. The project is in progress in the Computational Mechanics Division of the Japan Society of Mechanical Engineers (JSME) as an industry-academia joint effort to develop a fast-to-use thermal design codes based on a novel concept called Build-Up Approach (BUA). In BUA a large solution base is developed from detailed numerical analysis of 'template models'. Then, a compact knowledge body is extracted from the solution base and assembled into a fast-to-use design code. The design code thus developed frees the packaging designer from the need to perform detailed numerical analysis. Techniques of soft computing are required to bridge the detailed analysis phase and the actual design work. The present paper outlines the BUA concept and presents an interim report of the JSME project.
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