3-Dimension Measurement Sensor

摘要

We have developed a 3-dimension measurement sensor which is available in the SMT process line. High-speed, high-accuracy measurement has been realized by combining the triangulation method, which enables Z-direction high-accuracy measurement, with the Scanning LASER. The space resolution in the X and Y planes is 20 μ m, allowing measurement of extremely small parts. A miniaturized sensor head, sized to the dimensions of 76.5 (W) x 132 (D) x 130 (H), can be easily incorporated into the in-line equipment. As a measurement result is output as a 3-D Image where each pixel is composed of the height information, you can measure the area, height, and volume of the measuring object through data processing with applied image processing technology. We succeeded in measuring the solder volume at the BGA placement points deposited on the PCBs (Printed Circuit Boards) at repeatability of +- 10 % or less. In terminal shape measurement of the SMT parts, we could measure coplanarity of the QFP leads at repeatability of +- 10 μ m.