Influence of additional elements on wettability for Lead free solder of Sn-3.0Ag-0.5Cu

摘要

Sn-3.0Ag-0.5Cu lead free solder is one of the most expected solders as alternative of Sn-Pb eutectic solder. When this Sn-3.0Ag-0.5Cu solder is used in wave soldering process, to manage the impurities in solder bath is thought to be extremely important. Because there is the possibility that the solderabilities such as wettability for lead free solder go wrong when the lead free solder includes the impurities. Therefore there is the possibility that soldering defects have occurred. However, relationship between the several kinds of elements of impurities in solder bath and the wettability has not been clear. So, the influence of impurities of solder on wettability for Sn-3.5Ag-0.5Cu lead free solder has been investigated. As a results, it has found that the effect of wettability on impurities of solder has been obvious.