"Photolithographic Packaging (PL-Pack) with Selectively Occupied Repeated Transfer (SORT)" is proposed for optoelectronic system integration. PL-Pack with SORT integrates different types of thin-film device pieces into one substrate with desired configurations using all-photolithographic process. A process design example is presented for Scalable Film Optical Link Multi-chip-module (S-FOLM). A preliminary estimation reveals that PL-Pack with SORT will achieve Ⅲ-Ⅴ epitaxial material saving of <1/100 and module cost reduction of <1/10, comparing with flip-chip-bonding-based packaging. The result indicates that the process will save cost and resource simultaneously. Critical issue is how to simplify the procedure for distributing thin-film device pieces onto a substrate. SORT is found to reduce the distribution step count typically by factor of <1/10-1/10000 comparing with conventional One-by-One method.
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