Influence of Sintering Atmosphere on LTCC/Cu

摘要

Low temperature ceramics cofired with copper (LTCC/Cu) was one of the important technologies in ceramic packaging. Due to the easily oxidized characteristics of copper circuit and the organic removal difficulty, selecting an appropriate sintering atmosphere for LTCC/Cu was important. This paper contrasted the influence of several sintering atmospheres for LTCC/Cu. Protective ambience such as nitrogen and hydrogen atmosphere were used. The result showed that the introduction of water vapor into the sintering atmosphere could help remove organic earrier. Oxygen in the sintering atmosphere expedited the oxidation speed of copper circuit, Cu_2O was thus created, then it dissolved into the glass phase with a result of copper diffusion. Under the protective atmosphere, organics in copper I circuit could not be removed completely, consequently the conductivity of copper circuit was damaged. Existence of residual carbon in substrate would restrain the viscous movement of glass phase, LTCC substrate thus appeared as two-phase structure.