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首页> 外文期刊>Journal of Electronic Materials >Influence of Aging Atmosphere on the Thermal Stability of Low-Temperature Rapidly Sintered Cu Nanoparticle Paste Joint
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Influence of Aging Atmosphere on the Thermal Stability of Low-Temperature Rapidly Sintered Cu Nanoparticle Paste Joint

机译:老化气氛对低温迅速烧结Cu纳米粒子糊剂的热稳定性的影响

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摘要

Isothermal aging tests of low-temperature rapidly sintered Cu-Cu joints were conducted at 180 degrees C for 72 h under air and vacuum atmospheres, respectively. Shear strength, micromorphology and elemental analysis of the joints before and after aging were characterized. The experimental results indicated that organics in nano-paste were not capable of sustainably inhibiting the oxidation of Cu nanoparticles under high-temperature and high-oxygen conditions. The shear strength degraded as low as 5.12 MPa after air aging, and a nanoporous and filamentous structure was formed due to the continuous growth of Cu oxides on the surface of the sintered nanoparticles. Nevertheless, the porosity of the as-sintered structure reduced with the formation of a large area interconnection microstructure under low-oxygen aging conditions, thereby the shear strength of the sintered joints notably improved up to 20.03 MPa after vacuum aging.
机译:低温迅速烧结Cu-Cu关节的等温老化试验分别在180℃下在空气和真空氛围下在180℃下进行72小时。 表征抗剪切强度,微观和元素在老化前后的关节分析。 实验结果表明,纳米糊剂中的有机物不能在高温和高氧条件下可持续地抑制Cu纳米颗粒的氧化。 在空气老化后,剪切强度降低至5.12MPa,并且由于烧结纳米粒子表面的Cu氧化物的连续生长而形成纳米多孔和丝状结构。 然而,随着低氧老化条件的大面积互连微观结构的形成,烧结结构的孔隙率降低,从而烧结接头的剪切强度在真空老化后显着提高至20.03MPa。

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