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Low-temperature sintering method using the same and reducing agent for the low-temperature reduction sintering of copper nanoparticles
Low-temperature sintering method using the same and reducing agent for the low-temperature reduction sintering of copper nanoparticles
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机译:使用其和还原剂的低温烧结方法用于铜纳米颗粒的低温还原烧结
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摘要
The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.
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