REDUCING AGENT FOR LOW TEMPERATURE REDUCING AND SINTERING OF COPPER NANOPARTICLES, AND METHOD FOR LOW TEMPERATURE SINTERING USING THE SAME

摘要

The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.