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The Effects of Sintering Temperature and Addition of TiH2 on the Sintering Process of Cu

机译:烧结温度和TiH2的添加对Cu烧结过程的影响

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摘要

In this study, effects of sintering temperature and TiH2 on the sintering process of Cu are investigated. During sintering, the oxide in Cu decomposes and generates oxygen, which can become trapped in the material forming closed pores. Therefore, this results in low sintered density. Sintering behavior of Cu can be significantly improved by adding 0.5 wt.% TiH2 which decomposes during sintering, producing hydrogen and effectively reducing the oxide in Cu. Although gas products of the reduction reaction may still be trapped inside the close pores formed near the TiH2 particles and handicap the sintering of Cu, an isothermal treatment at 650 °C can avoid forming close pores. This allows reaction products to dissipate freely from the sample, subsequently increasing its sintered density.
机译:在这项研究中,研究了烧结温度和TiH2对Cu烧结过程的影响。在烧结过程中,Cu中的氧化物分解并生成氧气,氧气会被捕获在形成封闭孔的材料中。因此,这导致低的烧结密度。通过添加0.5重量%的在烧结过程中分解的TiH 2,可以显着改善Cu的烧结行为,所述TiH 2在烧结期间分解,产生氢并且有效地还原Cu中的氧化物。尽管还原反应的气体产物可能仍会滞留在TiH2颗粒附近形成的细孔内部,并妨碍Cu的烧结,但在650°C下进行等温处理可以避免形成细孔。这样可使反应产物从样品中自由散逸,随后增加其烧结密度。

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