The sintering densification process of low temperature cofired glass ceramics substrate made by 50%Al_2O_3-50%BSG powder by tape casting which is used for multichip modules in electronic packaging is studied. The thermolysis process of high molecular polymer below 450°C and the densification sintering mechanism of the substrate in high temperature are analyzed. It is found that different sintering temperature and isothermal time have important effects to the density of substrate. The substrate can be sintered in 2 hours at 950°C, it also can achieve requirement density and therefore the sintering temperature can be lowered. At the different phase, substrate has different shrinkage: at 0～550°C, it almost don't show any shrinkage, but it shrink dramatically from 550°C to 900°C, as high as 25%. We found that it is Liquid-Sintering-Mechanism of glass that plays an important role in deification process. These works can help to optimize the sintering technology and modify the prosperities of the substrate to fit the cofried process.
展开▼
