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Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)

召开年：2003
召开地：Marina Del Rey, CA(US);Marina Del Rey, CA(US)
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1.<0.1psi Ultra Low Pressure CMP for Copper/Ultra Low-k Films

机译：<0.1psi超低压CMP，用于铜/超低k膜
- 作者：Susumu Hoshino;Yuko Kitade;Norio Yoshida;Yutaka Uda
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
2.A 90nm Copper CMP Process with Low Defectivity Using Optimized Copper and Barrier Removal Slurries

机译：采用优化的铜和势垒去除浆料的低缺陷的90nm铜CMP工艺
- 作者：Periva Gopalan;Todd Buley;Mike Kulus
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
3.A BIFURCATED COPPER REMOVAL RATE MECHANISM

机译：铜去除率机制
- 作者：Peter Renteln;Sridharan Srivatsan;K. Y. Ramanujam;Tara Keefover
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
4.A HISTORY OF NICKEL-IRON (NiFe) CMP AS USED IN THE MAGNETIC HEADS INDUSTRY

机译：磁头行业中镍铁（NiFe）CMP的历史
- 作者：C. M. Pitcher
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
5.A MECHANICAL MODEL FOR EROSION IN COPPER CHEMICAL-MECHANICAL POLISHING

机译：铜化学机械抛光中腐蚀的机械模型
- 作者：Kyungyoon Noh;Nannaji Saka;Jung-Hoon Chun
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
6.A New Method for Evaluating CMP Pad Surface Conditions Using Digital Images

机译：一种使用数字图像评估CMP焊盘表面状况的新方法
- 作者：Hiroyuki Kqjima;Takashi Nishiguchi
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
7.A Novel Air Floating Head for Next Generation CMP

机译：用于下一代CMP的新型空气浮头
- 作者：Akira Isobe;Akihiko Yamane;Katsunori Tanaka;Soushi Yamada;Minoru Numoto
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
8.A Novel New Dispersion for the CMP Industry

机译：CMP行业的新型分散体
- 作者：Robert Eaton;Saeed Mohseni;Lisa Gramm;Gary Morr;Deepak Mahulikar
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
9.A Novel Photoresist Planarization for Deep-Trench Capacitor Plate Formation of DRAM

机译：DRAM深沟道电容器极板形成的新型光刻胶平面化
- 作者：Chih-Fan Wang;Hung Yi Chang;Tony K.J. Liu;Liang-Kuei Chou;Victor H. H. Wang
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
10.A Study of Copper Planarization Using Ultra High Selective Copper Slurry on Sub-100nm Device

机译：低于100nm器件的超高选择性铜浆铜平面化研究
- 作者：Duk-Ho Hong;Ja-Hyung Han;Sung-Bae Lee;Ja-Eung Koo;Jong-Gyoon Kim;Byung-Lyul Park;Hong-Seong Sohn;Ju-Hyuck Chung;Sang-Rok Hah;Kwang-Myeun Park
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
11.A Study on the Relationship Between Wafer Surface Pressure and Wafer Backside Loading in CMP

机译：CMP中晶圆表面压力与晶圆背面载荷之间关系的研究
- 作者：GUANGHUI FU;ABHIJIT CHANDRA
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
12.AN ANALYTICAL DISHING AND STEP HEIGHT REDUCTION MODEL FOR CHEMICAL MECHANICAL PLANARIZATION (CMP)

机译：化学机械平面化（CMP）的分析处理和阶梯高度减少模型
- 作者：Guanghui Fu;Abhijit Chandra
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
13.Analysis of the Sub Pad Effects on the Edge in CMP

机译：CMP中边缘的子焊盘效应分析
- 作者：Jaeseok Kim;Geon Kim;Ju Yeol Lee;In-ha Park;Yi-Koan Hong;Jin-Goo Park
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
14.ANALYSIS OF WAFER DEFECTS CAUSED BY LARGE PARTICLES IN CMP SLURRY USING LIGHT SCATTERING AND SEM MEASUREMENT TECHNIQUES

机译：利用光散射和SEM测量技术分析CMP浆液中大颗粒引起的晶片缺陷
- 作者：Kristi Nicholes;Mark R. Litchy;Elizabeth Hood;William G. Easter;Venkat R. Bhethanabotla;Leslie Cheema;Donald C. Grant
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
15.CHALLENGES FOR THE INTEGRATION OF SHALLOW TRENCH ISOLATION

机译：集成浅沟槽隔离的挑战
- 作者：Katia Devriendt;Nancy Heylen;Jose Luis Hernandez
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
16.Challenges of CMP Technology Beyond 65 nm Node

机译：CMP技术超越65 nm节点的挑战
- 作者：N. Endo;S. Kondo;S. Tokitou;B.U. Yoon;N. Ohashi;S. Sone;H.J. Shin;I. Matsumoto;N. Kobayashi
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
17.Chemical Mechanical Planalization for Copper Interconnection Layers

机译：铜互连层的化学机械平面化
- 作者：Tohru Hara
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
18.CMP Barrier Slurry Development For Technology Nodes Beyond 0.13μm

机译：超过0.13μm技术节点的CMP阻挡层浆料开发
- 作者：Qianqiu (Christine) Ye;John Quanci;Matthew VanHanehem;Ray Lavoie
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
19.CMP IN-SITU PAD CONDITION MONITORING WITH PADPROBE~(TM)

机译：使用PADPROBE〜（TM）进行CMP原位PAD状态监测
- 作者：Bill Kalenian;Brian Pautsch;Bryan Sennett;Norm Gitis;Michael Vinogradov
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
20.CMP TRIBOLOGICAL STUDY OF CARRIER RING PLASTIC MATERIALS

机译：载环塑料的CMP摩擦学研究
- 作者：W. G. Easter;G. D. Willis;A. K. Sikder;P. Zantye;Ashok Kumar
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
21.COPPER CHEMICAL MECHANICAL PLANARIZATION PROCESSES WITH CARBON DIOXIDE

机译：二氧化碳的铜化学机械平面化过程
- 作者：Pamela M. Visintin;Ginger M. Denison;Carol A. Bessel;Cynthia K. Schauer;Joseph M. DeSimone
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
22.Corrosion Control Technique in Copper Post-CMP Cleaning Using Gas Dissolved Water

机译：气体溶解水在CMP后进行铜清洗的腐蚀控制技术
- 作者：Masayuki Kamezawa;Kenya Ito
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
23.Corrosion Issues in Chemical Mechanical Planarization of Copper

机译：铜化学机械平面化中的腐蚀问题
- 作者：S. Raghavan;S. Tamilmani;W. Huang;R. Small
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
24.Cu/Low-K CMP for 0.13um 300mm Dual Damascene Process

机译：适用于0.13um 300mm双镶嵌工艺的Cu / Low-K CMP
- 作者：C.W.Chung;Y.H.CHen;W.Chang;S.M.Jang;M.S.Liang
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
25.Defect Learning In Dielectric CMP

机译：介电CMP中的缺陷学习
- 作者：Christopher Hawes;Jaishankar Kasthurirangan;Paul Feeney;Ray Campbell
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
26.DELAMINATION STUDIES IN Cu-ULTRA LOW-k STACK

机译：铜超低k层的分层研究
- 作者：A. K. Sikder;P. Zantye;S. Thagella;Ashok Kumar;B. Michael Vinogradov;Norm V. Gitis
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
27.DETERMINING THE THERMAL ATTRIBUTES OF CMP THROUGH CONTROLLED REMOVAL RATE vs. TEMPERATURE STUDIES

机译：通过控制去除率与温度研究确定CMP的热属性
- 作者：J. Sorooshian;D. DeNardis;L. Charns;Z. Li;D. Boning;F. Shadman;A. Philipossian
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
28.DHF Application at Metal CMP Cleaning Process

机译：DHF在金属CMP清洗工艺中的应用
- 作者：Sang-Yong Kim;Hwal-Pyo Kim;Dae-Young Kim;Jae-Deok Jeong;Chang-Sun Moon;Jeong Lee
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
29.Dynamic Pot-Life and Handling Evaluation of EPL2362 First Step Copper Slurry

机译：EPL2362第一步铜浆的动态适用期和处理评估
- 作者：Budge Johl;Adam Manzonie;Rakesh K. Singh
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
30.EFFECT OF COEFFICIENT OF FRICTION AND PROCESS TRIBOLOGY ON REMOVAL RATE IN ILD CMP APPLICATIONS

机译：摩擦系数和过程摩擦学系数对ILD CMP应用中去除率的影响
- 作者：Ara Philipossian;Scott Olsen
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
31.Effect of Kinematic Conditions on Polishing Process in Rotary CMP

机译：运动条件对旋转式CMP抛光工艺的影响
- 作者：Hyoungjae Kim;Hoyun Kim;Haedo Jeong;Eungsug Lee;Youngjae Shin
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
32.EFFECT OF VARIATIONS IN WAFER DIAMETER, WAFER SHAPE AND THERMAL HISTORY ON PRESSURE AND STRESS DISTRIBUTIONS DURING CMP

机译：晶圆直径，晶圆形状和热历史的变化对CMP期间压力和应力分布的影响
- 作者：J. Sorooshian;A. Philipossian;M. Goldstein;S. Beaudoin;W. Huber
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
33.EFFECTS OF PAD CHARACTHERISTICS ON METAL CMP

机译：PAD特性对金属CMP的影响
- 作者：Nam-Hoon Kim;In-Pyo Kim;Sang-Yong Kim;Yong-Jin Seo;Eui-Goo Chang
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
34.EMERGENT CMP APPLICATIONS

机译：紧急CMP应用
- 作者：D. R. Evans
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
35.Evaluation of an Edge Load Ring to Reduce Levels of CMP Microscratchs

机译：评估边缘加载环以减少CMP微划痕的水平
- 作者：James McGrath;Andrew Cockburn
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
36.EXCURSION CONTROL AND BASELINE DEFECTIVITY REDUCTION IN CU CMP

机译：CU CMP中的偏移控制和基线缺陷减少
- 作者：Richard Guldi;Mona Eissa;Vince Korthuis;Frank Cataldi;Deepak Ramappa;Jeffrey Ritchison;Judy Shaw;Vikas Sachan;Steve Fanelli;Micheal Vunguyen;Bob Fiordalice
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
37.Experimental Investigation of Surface Properties of Particles and Their Effects on Cu CMP

机译：颗粒表面性质及其对Cu CMP影响的实验研究
- 作者：Joe J. Zhao;Y. Li;P. Severs;H. Xu;H. Liang
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
38.Hard Porous Pad for Oxide Chemical Mechanical Polish

机译：氧化物化学机械抛光用硬质多孔垫
- 作者：Guangwei Wu;Long Nguyen;Pepito Galvez;Thomas E. West
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
39.HIGH-PERFORMANCE CMP PADS FOR CU/LOW K/ULTRA-LOW K WAFER PROCESSING

机译：用于CU / LOW K /超低K晶圆加工的高性能CMP垫
- 作者：Mary Jo Kulp;David James;Greg Muldowney;Chau Duong;Todd Crkvenac
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
40.Improved Cu Abrasive-Free Polishing For 90 nm Node Process

机译：用于90 nm节点工艺的改进的无铜磨料抛光
- 作者：YOUHEI YAMADA;HIROKI TERAZAKI;NOBUHIRO KONISHI
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
41.Influence of Micro-voids in Cu Films on Repeatability of Removal Rate

机译：铜膜中微孔对去除速率重复性的影响
- 作者：Keisuke Suzuki;Shunichi Tokitoh;Hong-Jae Shin;Isao Matsumoto
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
42.INTEGRATED MODELING OF NANOTOPOGRAPHY IMPACT IN PATTERNED STI CMP

机译：图案CMP中纳米照相术的集成建模。
- 作者：Xiaolin Xie;Duane Boning
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
43.INTEGRATED MULTISCALE AND MULTISTEP PROCESS SIMULATION

机译：集成的多尺度和多步过程仿真
- 作者：M.O. Bloomfield;Yeon Ho Im;Jongwon Seok;Cyriaque P. Sukam;John A. Tichy;Timothy S. Cale
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
44.Issues associated with cleaning of nano-sized particles

机译：与清洁纳米颗粒有关的问题
- 作者：W.Fyen;G. Vereecke;K. Xu;J. Lauerhaas;F. Holsteyns;R. Vos;P.W. Mertens
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
45.LEVASIL~(~R) COLLOIDAL SILICA SLURRIES ON A SINGLE DAMASCENE WAFER FOR COPPER-CMP

机译：单铜晶圆上的LEVASIL〜（〜R）胶体二氧化硅淤泥，用于铜CMP
- 作者：Gabriele M. Hey;Gerd Passing;Lothar Puppe;Jill C. Simpson;Valentina L. Terzieva
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
46.LOW STRESS POLISHING OF COPPER/LOW-K DIELECTRIC STRUCTURES

机译：铜/低k介电结构的低应力抛光
- 作者：Rajiv K. Singh;Seung-Mahn Lee
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
47.METAL DENSITY OPTIMIZATION WITH THE CMP-BASED DUMMY PLACEMENT

机译：基于CMP的虚拟放置的金属密度优化
- 作者：Valeriy Sukharev;Payman Zarkesh-Ha;Chien-Hwa Chang;William Loh;Kai Zhang
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
48.METAL-DOPED SILICA ABRASIVE SLURRIES AND THEIR EFFECT ON FRICTION AND REMOVAL RATE CHARACTERISTICS OF ILD AND STI CMP

机译：掺杂金属的二氧化硅磨料浆及其对ILD和STI CMP的摩擦和去除速率特性的影响
- 作者：R. Brandes;T. Knothe;F. Klaessig;F. Menzel;W. Lortz;G. Varga;T. Shibasaki;A. Philipossian
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
49.NANOCRYSTALLINE ALUMINA AND CERIA ABRASIVES IN CHEMICAL-MECHANICAL PLANARIZATION SLURRIES

机译：化学机械平面化浆液中的纳米氧化铝和铈陶瓷磨料
- 作者：Patrick G. Murray;Harry Sarkas;Daniel C. Coy;Richard W. Brotzman
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
50.Novel EPD Using White Light for ILD Application

机译：使用白光进行ILD应用的新型EPD
- 作者：O.Matsushita;A.Yamane;A.lsobe
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
51.Optimizing Diamond Conditioning Disks for the Tungsten CMP Process

机译：为钨CMP工艺优化金刚石调理盘
- 作者：Mark Bubnick;Sohail Qamar
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
52.Pad Conditioning and Scale-up Issues Between 200 and 300 mm Polishing

机译：200到300毫米抛光之间的抛光垫修整和放大问题
- 作者：A. Scott Lawing;Chris Juras;Tony Tran
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
53.PLANARIZATION ISSUES FOR THREE-DIMENSIONAL (3D) ICs AND WAFER-SCALE PACKAGING (WSP) APPLICATIONS

机译：三维（3D）IC和晶圆级封装（WSP）应用的规划问题
- 作者：R.J. Gutmann;A. Jindal;G. Rajagopalan;J.-Q. Lu;J.J. McMahon;Y. Kwon;T.S. Cale
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
54.Post Chemical-Mechanical Planarization Defect Study on 90 nm Cu/Low k Interconnect

机译：90 nm Cu / Low k互连的化学机械平面化缺陷研究
- 作者：H. H. Lu;H. H. Kuo;T. C. Tseng;Y. H. Chen;S. M. Jang;M. S. Liang
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
55.Profile Control by the Smart Simulator in Partial Polishing CMP

机译：智能模拟器在部分抛光CMP中的轮廓控制
- 作者：T.Senga;K.Shinjo;T.Ueda;H.Nakahira;Y.Ushio;A.Une
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
56.PROGRESS TOWARDS COPPER CMP IN A CARBON DIOXIDE MATRIX

机译：二氧化碳基质中铜CMP的研究进展
- 作者：Ginger M. Denison;Pamela M. Visintin;Carol A. Bessel;Joseph M. DeSimone
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
57.Proper Filtration Removes Large Particles from Copper CMP Slurries

机译：适当的过滤可去除CMP铜浆中的大颗粒
- 作者：Mike H.-S. Tseng;Karen Carter;Joel Marchese;Mike Parakilas;Quamrul Arefeen;Thomas B. Hackett;Steve Hymes
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
58.Rapid Reliability Assessment of ULSI Electronics with Copper Interconnects

机译：具有铜互连的ULSI电子的快速可靠性评估
- 作者：Patrick McCluskey
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
59.Research on a Novel Planarization Method as an Alternative or Complement to CMP

机译：一种替代CMP或补充CMP的新型平面化方法的研究
- 作者：Jeremy W. McCutcheon
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
60.Semi-Abrasive Free Slurry Including Acid Colloidal Silica for Copper Chemical-Mechanical Planarization

机译：用于铜化学机械平面化的含酸性胶体二氧化硅的半磨料免费浆液
- 作者：Jong-Heun LIM;Min-Ho KIM;Jong-Dai PARK
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
61.Simulation Method for CMP Slurry Flow with a Grooved Polishing Pad

机译：带有抛光垫的CMP浆液流动的仿真方法
- 作者：J.K. Eaton;C.J. Elkins;T. M. Burton;A. Miyaji;D. P. Coon
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
62.SMART Particles for Copper CMP

机译：用于铜CMP的SMART颗粒
- 作者：Stuart Hellring;Bob Auger;Colin McCann;Marc Fontenot;Ho-Cheol Kang;Lirong Guo;Xiaojing Shi;Devon Shipp;Yuzhuo Li
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
63.Statistical Experimental Methods used to Obtain Edge Control of 300mm Oxide Wafers During Chemical Mechanical Planarization (CMP)

机译：用于在化学机械平面化（CMP）过程中获得300mm氧化硅晶圆边缘控制的统计实验方法
- 作者：L.C. Tinoco
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
64.STI Defects ― They're Not Just CMP Created

机译：STI缺陷-它们不仅仅是CMP造成的
- 作者：David J. Stein;Sarah C. Everist;Wilfred Jaramillo
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
65.Study of Cu-CMP process performance for interconnects using new Cu slurries

机译：使用新的Cu浆料研究互连的Cu-CMP工艺性能
- 作者：S.Balakumar;T. Selvaraj;L. Ben Fu;C.Y. Li;R. Kumar;Jared Chee
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
- Cu -CMP;
- cu slurries;
- oxidizer;
- oxide loss;
- dishing;
66.STUDY OF SLURRY SELECTIVITY AND END POINT DETECTIONS IN Cu- CMP PROCESS

机译：Cu-CMP工艺中浆液选择性和终点检测的研究
- 作者：P. B. Zantye;A. K. Sikder;N. Gulati;Ashok Kumar
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
67.THE EFFECT OF WAFER AND PAD SHAPE ON REMOVAL UNIFORMITY ― A QUALITATIVE ANALYSIS USING A MECHANISTIC MODEL

机译：晶片和衬垫形状对去除均匀性的影响-使用力学模型进行定性分析
- 作者：John McGrath;Chris E. Davis
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
68.THE ROLE OF PAD SURFACE MORPHOLOGY AND MECHANICAL PROPERTIES ON THE MATERIAL REMOVAL RATE IN CMP

机译：垫表面形态和力学性能对CMP材料去除速率的作用
- 作者：Ashraf Bastawros;Abhijit Chandra;Yongjin Guo
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
69.Three-Dimensional CMP Process Model for Composite Film with Periodic Patterns by BEM

机译：BEM的周期性图案复合膜三维CMP工艺模型
- 作者：Takafumi Yoshida
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
70.Total Software Solution for CMP Yield Enhancement

机译：增强CMP产量的完整软件解决方案
- 作者：S. Y. Oh;K. H. Kim;Y.J. Kwon;O. S. Nakagawa;J. T. Kong;M. H. Yoo;Y. K. Park;Y. H. Kim;K. H. Lee;T. K. Kim;S. K. Hahn
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年
71.TRIBOLOGY AND REMOVAL RATE CHARACTERISTICS OF ABRASIVE-FREE SLURRIES FOR COPPER CMP APPLICATIONS

机译：用于铜CMP的无磨料渣浆的摩擦学和去除速率特性
- 作者：D. DeNardis;J. Sorooshian;M. Habiro;C. Rogers;A. Philipossian
- 会议名称：《Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)》 | 2003年