The ability to optimize diamond conditioning disks for a specific CMP process is demonstrated for the Tungsten CMP process. The diamond concentration, diamond type, and bond level on a CMP disk were manipulated for the Tungsten CMP process. The result is a diamond disk that has the same cut-rate, diamond retention, and RAS (Relative Abrasive Sharpness) values as a standard disk, but has a usable life that is 40% to 50% greater than a standard disk. The polishing pad removal rate and coefficient of friction between the diamond disk and polyurethane pad were measured using a test apparatus that simulated typical CMP processes. The tests were run on Rodel IC-1000 pads. Deionized water was used in place of slurry. The RAS (Relative Abrasive Sharpness) values were measured using proprietary equipment. Field test data from several fabs comparing standard AT Infinity~(TM) CMP disks and the Process Infinity~(TM) Tungsten disks are also included.
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