首页> 外国专利> POLISHING PAD CONDITIONING DRESSER CLEANING MACHINE OF A CMP(CHEMICAL MECHANICAL POLISHING) APPARATUS, CAPABLE OF REMOVING THE FOREIGN MATERIAL REMAINING ON THE SURFACE OF A DIAMOND DISK BY USING A BRUSH

POLISHING PAD CONDITIONING DRESSER CLEANING MACHINE OF A CMP(CHEMICAL MECHANICAL POLISHING) APPARATUS, CAPABLE OF REMOVING THE FOREIGN MATERIAL REMAINING ON THE SURFACE OF A DIAMOND DISK BY USING A BRUSH

机译:CMP(化学机械抛光)设备的抛光垫条件清洁剂清洗机,可以通过使用刷子去除残留在金刚石盘表面的异物

摘要

PURPOSE: A polishing pad conditioning dresser cleaning machine of a CMP(Chemical Mechanical Polishing) apparatus is provided to prevent the scratch from being generated on the surface of a wafer by removing the foreign material remaining on the surface of a diamond disk by using a brush.;CONSTITUTION: A polishing pad conditioning dresser cleaning machine(100) of a CMP(Chemical Mechanical Polishing) apparatus is composed of a cleaning cup(120), a supporting plate(150), a brush(140), upper and lower nozzles(4,5), a drain cup(130), and a motor(180). The upper side of the cleaning cup is opened to house a dresser(40). The brush is projected upwardly from both ends of the supporting plate. The upper and lower nozzles inject ultra-pure water to the upper and lower sides of the dresser. The drain cup houses and discharges the ultra-pure water and foreign material. The motor transmits the driving force for rotating the supporting plate.;COPYRIGHT KIPO 2010
机译:目的:提供一种CMP(化学机械抛光)设备的抛光垫调理修整器清洁机,以通过使用刷子去除残留在金刚石盘表面上的异物来防止在晶片表面上产生划痕。 。;组成:CMP(Chemical Mechanical Polishing)设备的抛光垫调理修整器清洁机(100)由清洁杯(120),支撑板(150),刷子(140),上下喷嘴组成(4,5),排水杯(130)和电动机(180)。打开清洁杯的上侧以容纳梳妆台(40)。刷子从支撑板的两端向上突出。上下喷嘴向修整器的上下注入超纯水。排水杯容纳并排出超纯水和异物。电机传递驱动力来旋转支撑板。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100005474A

    专利类型

  • 公开/公告日2010-01-15

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080065515

  • 发明设计人 MIN BYOUNG HO;

    申请日2008-07-07

  • 分类号B24B29/00;B24B37/00;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:30

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